Microwave coaxial switches used in satellites for instance are quite heavy and bulky and thus have an important after-effect on a payload cost. MEMS devices seems to bring a new alternative for compact switching matrix design which requires a large number of switching devices often incompatible with the semiconductor technology in term of dissipated power [3]. Meanwhile, the reliability of MEMS components for space applications still remains today a problem to be solved, in term of design, technology and cost of realization. Hence the component packaging appears today to be a crucial issue for these devices formed starting from mechanically deformable elements which require a stable environment, clean and deprived of moisture to function in an optimal way [1][2]. In spite of the strong integration of these components, standard packaging solutions are not appropriated for MEMS components [4]. This is why dedicated technological solutions must be developed to encapsulate the component or a group of components on the substrate by using simple techniques limited in term of technological steps.

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