Microwave coaxial switches used in satellites for instance are quite heavy and bulky and thus have an important after-effect on a payload cost. MEMS devices seems to bring a new alternative for compact switching matrix design which requires a large number of switching devices often incompatible with the semiconductor technology in term of dissipated power . Meanwhile, the reliability of MEMS components for space applications still remains today a problem to be solved, in term of design, technology and cost of realization. Hence the component packaging appears today to be a crucial issue for these devices formed starting from mechanically deformable elements which require a stable environment, clean and deprived of moisture to function in an optimal way . In spite of the strong integration of these components, standard packaging solutions are not appropriated for MEMS components . This is why dedicated technological solutions must be developed to encapsulate the component or a group of components on the substrate by using simple techniques limited in term of technological steps.
Design of Packaged RF MEMS Switching Functions on Alumina Substrate
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El-Khatib, MH, Pothier, A, & Blondy, P. "Design of Packaged RF MEMS Switching Functions on Alumina Substrate." Proceedings of the CANEUS 2006: MNT for Aerospace Applications. CANEUS2006: MNT for Aerospace Applications. Toulouse, France. August 27–September 1, 2006. pp. 297-300. ASME. https://doi.org/10.1115/CANEUS2006-11055
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