This paper deals with experimental and analytical heat transfer study of nonadecane spheres melting in natural convection of water. Experimental local and average heat transfer coefficients were obtained by analyzing photo images of the shape transformation of the nonadecane spheres. The relevant dimensionless parameters were varied in the ranges of 1.8×107 ≤ Grn·Prn ≤ 1.8×108 and 0.04 ≤ CnΔT/Ln ≤ 0.16. We found that (1) the melting nonadecane sphere was covered with thin nonadecane liquid film flowing upwards along the sphere to make a liquid cap on the top. The cap regularly repeated formation and splitting off, (2) on the lower hemisphere the experimental local heat transfer coefficients were slightly higher than the analytical ones and on the upper hemisphere the experimental local heat transfer coefficients were slightly lower than the analytical ones, and (3) the experimental average Nusselt number was correlated by Nu = 0.151 (Grn·Prn)0.257(CnΔT/Ln)0.117 that was in good agreement with the theoretical one.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Heat Transfer of Melting Nonadecane Spheres in Natural Convection of Water
Makoto Hishida,
Makoto Hishida
Chiba University, Chiba, Japan
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Gaku Tanaka
Gaku Tanaka
Chiba University, Chiba, Japan
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Yuta Tanaka
Chiba University, Chiba, Japan
Makoto Hishida
Chiba University, Chiba, Japan
Gaku Tanaka
Chiba University, Chiba, Japan
Paper No:
HT2005-72067, pp. 509-515; 7 pages
Published Online:
March 9, 2009
Citation
Tanaka, Y, Hishida, M, & Tanaka, G. "Heat Transfer of Melting Nonadecane Spheres in Natural Convection of Water." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 509-515. ASME. https://doi.org/10.1115/HT2005-72067
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