A tandem 4 K pulse tube refrigerator requires a recuperator to be fully accomplished. The recuperator should be a counter-flow heat exchanger which has micro heat-transfer structure like a regenerator of cryogenic refrigerators. However, the technology of such a heat exchanger is not well established yet. Hence, the development of a counter-flow compact heat exchanger with micro structure is demanded first in order to proceed to the recuperative 4 K pulse tube refrigerator. This paper describes the design, fabrication and preliminary performance test of such a heat exchanger. The stainless steel micro structure with approximately 0.1 mm characteristic length has been created by chemical etching. The parallel V-shape double-sided micro channels (chevron stucture) in the heat exchanger enable the flow to be three-dimensionally well mixed so that the heat transfer at low Reynolds number can be enhanced. The etched plates are stacked and bonded through a vacuum brazing process to compose a plate-type heat exchanger. The chemically etched micro-structure heat exchanger has thermal effectiveness of 97%.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Chemically Etched Cryogenic Micro Structure Heat Exchanger
Jeheon Jung,
Jeheon Jung
Korea Advanced Institute of Science and Technology, Daejeon, Korea
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Sangkwon Jeong
Sangkwon Jeong
Korea Advanced Institute of Science and Technology, Daejeon, Korea
Search for other works by this author on:
Jeheon Jung
Korea Advanced Institute of Science and Technology, Daejeon, Korea
Sangkwon Jeong
Korea Advanced Institute of Science and Technology, Daejeon, Korea
Paper No:
HT2005-72249, pp. 641-646; 6 pages
Published Online:
March 9, 2009
Citation
Jung, J, & Jeong, S. "Chemically Etched Cryogenic Micro Structure Heat Exchanger." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 641-646. ASME. https://doi.org/10.1115/HT2005-72249
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