Numerical simulations based on the MARS (Multi-interface Advection and Reconstruction Solver) developed by one of the authors have been performed in order to understand the heat transfer mechanism of falling film flows along a vertical wall. In the present study, we focused on an internal structure, i.e. velocity profile and heat transfer. In this study, the velocity profiles in a falling film are categorized into three regions: substrate film region, solitary wave region, and capillary wave region with each characteristic. Moreover, small vortices can be found in the capillary wave region. Additionally, numerical results indicate that heat transfer mechanism is different for these three regions. We proposed new heat transfer evaluation manner as a function of the Prandtl number for these regions. This manner could contribute to a design work of falling film flow device.
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ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4274-6
PROCEEDINGS PAPER
Numerical Simulation on Heat Transfer of Falling Film Flow Along a Vertical Wall
Chiaki Kino,
Chiaki Kino
Japan Atomic Energy Agency, Tokyo, Japan
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Tomoaki Kunugi,
Tomoaki Kunugi
Kyoto University, Kyoto, Kyoto, Japan
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Zensaku Kawara
Zensaku Kawara
Kyoto University, Kyoto, Kyoto, Japan
Search for other works by this author on:
Chiaki Kino
Japan Atomic Energy Agency, Tokyo, Japan
Tomoaki Kunugi
Kyoto University, Kyoto, Kyoto, Japan
Zensaku Kawara
Kyoto University, Kyoto, Kyoto, Japan
Paper No:
HT2007-32002, pp. 461-467; 7 pages
Published Online:
August 24, 2009
Citation
Kino, C, Kunugi, T, & Kawara, Z. "Numerical Simulation on Heat Transfer of Falling Film Flow Along a Vertical Wall." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 461-467. ASME. https://doi.org/10.1115/HT2007-32002
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