It has been established that focal cooling to suppress epileptiform activity has become a real and viable option. However, the specific thermal parameters necessary to suppress epileptiform activity have only begun to be quantitatively defined. In 2002 it was reported that a 41 year-old man with medically intractable epilepsy undertook surgery to remove his tumor and resect adjacent epileptogenic tissue. Electrocorticography was performed before resection. Cold saline was impinged on the resulting interictal spike foci resulting in transient, complete cessation of spiking. We present a transient post-operative heat transfer analysis of the cold saline impingement on the surface of brain. An approximate temporal and spatial temperature distribution of the perfused human brain response to surface cooling was developed. The realistic extent of cooling below the brain surface due to impinging saline was quantified. The sensitivity of cooling penetration depth to (a) saline exit velocity from the syringe, and (b) syringe inside diameter, was evaluated. A parametric study was performed to characterize the effects of brain metabolism and blood perfusion on surface cooling. The required thermal parameters necessary to suppress epileptiform activity through focal cooling are here quantitatively approximated, i.e. heat flux removal and maximum and realistic cooling penetration depths. The relatively shallow penetration depth suggests that the spreading depolarization associated with epileptiform activity may be abolished through focal cooling without affecting the deeper neurons responsible for motor activity.
- Heat Transfer Division
Characterization of the Focal Cooling Necessary to Suppress Spontaneous Epileptiform Activity
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Guerra, RG, Carey, V, Rubinsky, B, & Berger, M. "Characterization of the Focal Cooling Necessary to Suppress Spontaneous Epileptiform Activity." Proceedings of the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference. ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 375-384. ASME. https://doi.org/10.1115/HT2007-32034
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