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Proceedings Papers

Thermal Conductivity Study of Biomass Reinforced Polymer Composites

Birce Dikici, Samarth Motagi, Prahruth Kantamani, Suma Ayyagari, Marwan Al-Haik
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T11A008, July 13–15, 2020
Paper No: HT2020-9065
DOI: https://doi.org/10.1115/HT2020-9065
View Paper titled, Thermal Conductivity Study of Biomass Reinforced Polymer Composites
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Topics: Biomass, Polymer composites, Thermal conductivity, Ester, Fibers, Resins, Cellulosic fibers, Composite materials, Epoxy adhesives, Epoxy resins
Proceedings Papers

Effect of Particle Size and Aggregation on Thermal Conductivity of Metal-Polymer Nanocomposite

Xiangyu Li, Wonjun Park, Yong P. Chen, Xiulin Ruan
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T04A005, July 10–14, 2016
Paper No: HT2016-7413
DOI: https://doi.org/10.1115/HT2016-7413
View Paper titled, Effect of Particle Size and Aggregation on Thermal Conductivity of Metal-Polymer Nanocomposite
Click here to open pdf in another window PDF for Effect of Particle Size and Aggregation on Thermal Conductivity of Metal-Polymer Nanocomposite
Topics: Metals, Nanocomposites, Particle size, Polymers, Thermal conductivity, Nanoparticles, Approximation, Epoxy adhesives, Epoxy resins, Fillers (Materials)
Proceedings Papers

Discriminating Composite Panels by Use of a Spectral Reflectometer

Alexander L. Brown
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T05A003, July 14–19, 2013
Paper No: HT2013-17614
DOI: https://doi.org/10.1115/HT2013-17614
View Paper titled, Discriminating Composite Panels by Use of a Spectral Reflectometer
Click here to open pdf in another window PDF for Discriminating Composite Panels by Use of a Spectral Reflectometer
Topics: Composite materials, Reflectometers, Epoxy adhesives, Epoxy resins, Reflectance, Binders (Materials), Aircraft, Carbon fibers, Instrumentation, Low temperature
Proceedings Papers

Characterization of Cryogen Spray Cooling With Thin-Film Thermocouple

Wangcun Jia, Thang Nguyen, Jaskaran Gill, J. Stuart Nelson
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 749-753, July 8–12, 2007
Paper No: HT2007-32222
DOI: https://doi.org/10.1115/HT2007-32222
View Paper titled, Characterization of Cryogen Spray Cooling With Thin-Film Thermocouple
Click here to open pdf in another window PDF for Characterization of Cryogen Spray Cooling With Thin-Film Thermocouple
Topics: Cooling, Sprays, Thermocouples, Thin films, Skin, Lasers, Surgery, Temperature, Epoxy adhesives, Epoxy resins
Proceedings Papers

Extending the 3 Omega Method to Measure Thermal Conductivity Anisotropy in Three Dimensions

Brandon Olson, Samuel Graham
Proc. ASME. HT2005, Heat Transfer: Volume 1, 29-35, July 17–22, 2005
Paper No: HT2005-72509
DOI: https://doi.org/10.1115/HT2005-72509
View Paper titled, Extending the 3 Omega Method to Measure Thermal Conductivity Anisotropy in Three Dimensions
Click here to open pdf in another window PDF for Extending the 3 Omega Method to Measure Thermal Conductivity Anisotropy in Three Dimensions
Topics: Anisotropy, Dimensions, Thermal conductivity, Algorithms, Composite materials, Computer software, Degrees of freedom, Design, Epoxy adhesives, Epoxy resins
Proceedings Papers

Thermal Optimization of a Composite Heat Spreader

G. F. Jones, S. Ghassemi
Proc. ASME. HT-FED2004, Volume 4, 835-842, July 11–15, 2004
Paper No: HT-FED2004-56609
DOI: https://doi.org/10.1115/HT-FED2004-56609
View Paper titled, Thermal Optimization of a Composite Heat Spreader
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Topics: Composite materials, Flat heat pipes, Optimization, Geometry, Electrical conductivity, Thermal conductivity, Blades, Carbon fibers, Cooling, Epoxy adhesives
Proceedings Papers

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Katsuhiro Koizumi, Masaru Ishizuka
Proc. ASME. HT-FED2004, Volume 4, 265-272, July 11–15, 2004
Paper No: HT-FED2004-56062
DOI: https://doi.org/10.1115/HT-FED2004-56062
View Paper titled, Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS
Click here to open pdf in another window PDF for Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS
Topics: Circuit design, Cooling, Design, Electronic equipment, Flow simulation, Natural convection, Power semiconductor devices, Computational fluid dynamics, Heat, Circuits