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Proceedings Papers

A Loop Heat Pipe for Vehicle CPU Cooling: Peak Performance and Partial Flooding and Dryout Regimes

Julio Ferreira, Massoud Kaviany, Vincent Dupont, Olivier de Laet, Thomas Nicolle, Erik Yen
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A001, July 11–13, 2022
Paper No: HT2022-83836
DOI: https://doi.org/10.1115/HT2022-83836
View Paper titled, A Loop Heat Pipe for Vehicle CPU Cooling: Peak Performance and Partial Flooding and Dryout Regimes
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Topics: Computer cooling, Floods, Heat pipes, Vehicles
Proceedings Papers

Experimental Investigation on the Effects of Inclination Angle on Heat Transfer Performance of a Liquid Metal High-Temperature Oscillating Heat Pipe

Mengke Wu, Yulong Ji, Yanmin Feng, Xin Yang, Yadong Li, Qinan Liu
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T08A010, June 16–18, 2021
Paper No: HT2021-63718
DOI: https://doi.org/10.1115/HT2021-63718
View Paper titled, Experimental Investigation on the Effects of Inclination Angle on Heat Transfer Performance of a Liquid Metal High-Temperature Oscillating Heat Pipe
Click here to open pdf in another window PDF for Experimental Investigation on the Effects of Inclination Angle on Heat Transfer Performance of a Liquid Metal High-Temperature Oscillating Heat Pipe
Topics: Alloys, Heat pipes, Heat transfer, High temperature, Liquid metals, Oscillations, Potassium, Sodium
Proceedings Papers

Effect of Build Angle on Additively Manufactured Aluminum Alloy Surface Roughness and Water Wetting Ability

Christopher M. Bailey, Scott M. Thompson, Melanie Derby, Jordan Morrow, Cameron Weeks
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T08A009, June 16–18, 2021
Paper No: HT2021-63599
DOI: https://doi.org/10.1115/HT2021-63599
View Paper titled, Effect of Build Angle on Additively Manufactured Aluminum Alloy Surface Roughness and Water Wetting Ability
Click here to open pdf in another window PDF for Effect of Build Angle on Additively Manufactured Aluminum Alloy Surface Roughness and Water Wetting Ability
Topics: Additive manufacturing, Aluminum alloys, Surface roughness, Water, Wetting, Printing, Columns (Structural), Design, Manufacturing, Vapors
Proceedings Papers

The Effects of Bending on Heat Pipes

Mahboobe Mahdavi, Amir Faghri
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T08A001, June 16–18, 2021
Paper No: HT2021-61823
DOI: https://doi.org/10.1115/HT2021-61823
View Paper titled, The Effects of Bending on Heat Pipes
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Topics: Computer simulation, Heat pipes
Proceedings Papers

Impact of Micropillar Density Distribution on the Capillary Limit of Heat Pipes

Doriane Ibtissam Hassaine Daoudji, Quentin Struss, Amrid Amnache, Étienne Léveillé, Mahmood Reza Salim Shirazy, Luc G. Fréchette
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T11A002, July 13–15, 2020
Paper No: HT2020-9001
DOI: https://doi.org/10.1115/HT2020-9001
View Paper titled, Impact of Micropillar Density Distribution on the Capillary Limit of Heat Pipes
Click here to open pdf in another window PDF for Impact of Micropillar Density Distribution on the Capillary Limit of Heat Pipes
Topics: Columns (Structural), Density, Heat pipes
Proceedings Papers

Copper-Carbon Nanotube Micropillars for Passive Thermal Management of High Heat Flux Electronic Devices

Gerardo Rojo, Jeff Darabi
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T12A009, July 13–15, 2020
Paper No: HT2020-8998
DOI: https://doi.org/10.1115/HT2020-8998
View Paper titled, Copper-Carbon Nanotube Micropillars for Passive Thermal Management of High Heat Flux Electronic Devices
Click here to open pdf in another window PDF for Copper-Carbon Nanotube Micropillars for Passive Thermal Management of High Heat Flux Electronic Devices
Topics: Carbon, Copper, Heat flux, Heat pipes, Nanotubes, Thermal management, Vapors
Proceedings Papers

A Planar Evaporator Design to Counter Parasitic Heat Flow During Device Startup of a Microscale Loop Heat Pipe

Navdeep S. Dhillon
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T10A008, July 14–17, 2019
Paper No: HT2019-3651
DOI: https://doi.org/10.1115/HT2019-3651
View Paper titled, A Planar Evaporator Design to Counter Parasitic Heat Flow During Device Startup of a Microscale Loop Heat Pipe
Click here to open pdf in another window PDF for A Planar Evaporator Design to Counter Parasitic Heat Flow During Device Startup of a Microscale Loop Heat Pipe
Topics: Design, Flow (Dynamics), Heat, Heat pipes, Microscale devices, Thermal management
Proceedings Papers

Performance of a Pulsating Heat Pipe Fabricated With a 3-D Printer

Yasushi Koito, Masahiro Kawaji
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T11A010, July 9–12, 2017
Paper No: HT2017-4816
DOI: https://doi.org/10.1115/HT2017-4816
View Paper titled, Performance of a Pulsating Heat Pipe Fabricated With a 3-D Printer
Click here to open pdf in another window PDF for Performance of a Pulsating Heat Pipe Fabricated With a 3-D Printer
Topics: Heat pipes, Graphene, Condensers (steam plant), Cooling, Fluids, Two-phase flow, Additive manufacturing, Copper, Electric current, Ethanol
Proceedings Papers

ASETS-II Oscillating Heat Pipe Space Flight Experiment: Ground Truth Results

Brent S. Taft, Sally M. Smith
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T01A001, July 9–12, 2017
Paper No: HT2017-4706
DOI: https://doi.org/10.1115/HT2017-4706
View Paper titled, ASETS-II Oscillating Heat Pipe Space Flight Experiment: Ground Truth Results
Click here to open pdf in another window PDF for ASETS-II Oscillating Heat Pipe Space Flight Experiment: Ground Truth Results
Topics: Heat pipes, Space flight, Flight, Hardware, Testing, Uncertainty, Boundary-value problems, Design, Electronics, Fluids
Proceedings Papers

Transient Analysis of a Cylindrical Heat Pipe Considering Different Wick Structures

Mehdi Famouri, M. Mahdi Abdollahzadeh, Ahmed Abdulshaheed, GuangHan Huang, Gerardo Carbajal, Chen Li
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A023, July 10–14, 2016
Paper No: HT2016-7469
DOI: https://doi.org/10.1115/HT2016-7469
View Paper titled, Transient Analysis of a Cylindrical Heat Pipe Considering Different Wick Structures
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Topics: Heat pipes, Transient analysis, Vapors, Algorithms, Computer cooling, Cooling, Evaporation, Fluid dynamics, Fluids, Heat transfer
Proceedings Papers

A Combined Heat Pipe Solution for Long Distance Thermal Management

Steve Q. Cai, Avijit Bhunia, Julie Asfia
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A018, July 10–14, 2016
Paper No: HT2016-7342
DOI: https://doi.org/10.1115/HT2016-7342
View Paper titled, A Combined Heat Pipe Solution for Long Distance Thermal Management
Click here to open pdf in another window PDF for A Combined Heat Pipe Solution for Long Distance Thermal Management
Topics: Heat pipes, Thermal management, Heat transfer, Heat, Printed circuit board assemblies, Avionics, Bonding, Energy dissipation, Fluids, Heat conduction
Proceedings Papers

Fluid Flow and Capillary Limit in Heat Pipe Thermal Ground Planes

Mohammed T. Ababneh, Frank M. Gerner
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A013, July 14–19, 2013
Paper No: HT2013-17034
DOI: https://doi.org/10.1115/HT2013-17034
View Paper titled, Fluid Flow and Capillary Limit in Heat Pipe Thermal Ground Planes
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Topics: Fluid dynamics, Heat pipes, Vapors, Pressure drop, Shear stress, Temperature, Condensation, Convection, Energy budget (Physics), Evaporation
Proceedings Papers

Thermal Performance of a Flat Plate Heat Pipe With Gradient Wettability

Ping-Hei Chen, Hung-Hsia Chen, Bo-Rui Huang, Long-Sheng Kuo
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T20A001, July 14–19, 2013
Paper No: HT2013-17033
DOI: https://doi.org/10.1115/HT2013-17033
View Paper titled, Thermal Performance of a Flat Plate Heat Pipe With Gradient Wettability
Click here to open pdf in another window PDF for Thermal Performance of a Flat Plate Heat Pipe With Gradient Wettability
Topics: Flat plates, Heat pipes, Evaporation, Heat transfer, Copper, Fluids, Furnaces, Gravity (Force), Nanoparticles, Sol-gel processing
Proceedings Papers

Non-Dimensional Analysis for the Fluid Flow in the Flat Heat Pipes

Mohammed T. Ababneh, Frank M. Gerner
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A014, July 14–19, 2013
Paper No: HT2013-17035
DOI: https://doi.org/10.1115/HT2013-17035
View Paper titled, Non-Dimensional Analysis for the Fluid Flow in the Flat Heat Pipes
Click here to open pdf in another window PDF for Non-Dimensional Analysis for the Fluid Flow in the Flat Heat Pipes
Topics: Flat heat pipes, Fluid dynamics, Heat pipes, Shear stress, Cooling, Pressure, Vapor pressure, Computational fluid dynamics, Design, Fluids
Proceedings Papers

Evaluation of the Integration of Oscillating Heat Pipes in High Power DC-DC Converters for Pulsed Power Applications

B. M. Huhman, A. Hathaway, H. B. Ma
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A016, July 14–19, 2013
Paper No: HT2013-17173
DOI: https://doi.org/10.1115/HT2013-17173
View Paper titled, Evaluation of the Integration of Oscillating Heat Pipes in High Power DC-DC Converters for Pulsed Power Applications
Click here to open pdf in another window PDF for Evaluation of the Integration of Oscillating Heat Pipes in High Power DC-DC Converters for Pulsed Power Applications
Topics: Heat pipes, Cooling, Capacitors, Aluminum, Batteries, Dimensions, Numerical analysis, Thermal conductivity, Bridges (Structures), Design
Proceedings Papers

An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications

Daniel Kearney, Justin Griffin
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A012, July 14–19, 2013
Paper No: HT2013-17009
DOI: https://doi.org/10.1115/HT2013-17009
View Paper titled, An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications
Click here to open pdf in another window PDF for An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications
Topics: Computer cooling, Heat pipes, Heat, Fluids, Flux (Metallurgy), Electronic systems, Ethanol, Heat transfer, Power density, Surface roughness
Proceedings Papers

Microstructural Evolution and Transport Properties of Sintered Porous Media

Karthik K. Bodla, Suresh V. Garimella
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A040, July 14–19, 2013
Paper No: HT2013-17241
DOI: https://doi.org/10.1115/HT2013-17241
View Paper titled, Microstructural Evolution and Transport Properties of Sintered Porous Media
Click here to open pdf in another window PDF for Microstructural Evolution and Transport Properties of Sintered Porous Media
Topics: Bonding, Dimensions, Dynamics (Mechanics), Fluids, Heat, Heat pipes, Manufacturing, Packing (Shipments), Packings (Cushioning), Particle size
Proceedings Papers

Thermoelectrically Powered Sensing for Small Modular Reactors

Chih Chieh Lin, Hanfei Chen, Mahder Tewolde, Gaosheng Fu, Di Liu, Tao Zhang, He Tao, Chao Nie, Weixiao Zheng, Fan Liu, Lei Zuo, David Hwang, Jon Longtin
Proc. ASME. HT2013, Volume 4: Heat and Mass Transfer Under Extreme Conditions; Environmental Heat Transfer; Computational Heat Transfer; Visualization of Heat Transfer; Heat Transfer Education and Future Directions in Heat Transfer; Nuclear Energy, V004T19A008, July 14–19, 2013
Paper No: HT2013-17788
DOI: https://doi.org/10.1115/HT2013-17788
View Paper titled, Thermoelectrically Powered Sensing for Small Modular Reactors
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Topics: Small modular reactors, Heat, Pipes, Radiation (Physics), Sensors, Circuits, Cooling, Design, Electricity (Physics), Energy dissipation
Proceedings Papers

Effect of Condenser Temperature on Pulsating Heat Pipe Performance

Nick Hansen, John VerSteeg, Gregory J. Michna
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T04A019, July 14–19, 2013
Paper No: HT2013-17457
DOI: https://doi.org/10.1115/HT2013-17457
View Paper titled, Effect of Condenser Temperature on Pulsating Heat Pipe Performance
Click here to open pdf in another window PDF for Effect of Condenser Temperature on Pulsating Heat Pipe Performance
Topics: Condensers (steam plant), Heat pipes, Temperature, Electrical components, Fluids, Heat, Heat flux, Thermal management, Thermal resistance, Vapor pressure
Proceedings Papers

Development of a Compensation Chamber for Use in a Multiple Condenser Loop Heat Pipe

Nicholas A. Roche, Martin Cleary, Teresa B. Peters, Evelyn N. Wang, John G. Brisson
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T04A020, July 14–19, 2013
Paper No: HT2013-17581
DOI: https://doi.org/10.1115/HT2013-17581
View Paper titled, Development of a Compensation Chamber for Use in a Multiple Condenser Loop Heat Pipe
Click here to open pdf in another window PDF for Development of a Compensation Chamber for Use in a Multiple Condenser Loop Heat Pipe
Topics: Condensers (steam plant), Heat pipes, Design, Heat sinks, Copper, Electronic systems, Floods, Fluids, Operating temperature, Particulate matter