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Proceedings Papers

Two-Step Raman Method for Interface Thermal Resistance and In-Plane Thermal Conductivity Characterization of Graphene Interface Materials

Man Li, Yanan Yue
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A005, July 10–14, 2016
Paper No: HT2016-7362
DOI: https://doi.org/10.1115/HT2016-7362
View Paper titled, Two-Step Raman Method for Interface Thermal Resistance and In-Plane Thermal Conductivity Characterization of Graphene Interface Materials
Click here to open pdf in another window PDF for Two-Step Raman Method for Interface Thermal Resistance and In-Plane Thermal Conductivity Characterization of Graphene Interface Materials
Topics: Graphene, Thermal conductivity, Thermal resistance, Interfacial thermal resistance, Phonons, Heating, Temperature, Couplings, Electromagnetic scattering, Heat transfer
Proceedings Papers

Thermal Interfacial Resistance Reduction Between Metal and Dielectric Materials by Inserting Intermediate Metal Layer

Xiangyu Li, Wonjun Park, Yong P. Chen, Xiulin Ruan
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T04A006, July 10–14, 2016
Paper No: HT2016-7414
DOI: https://doi.org/10.1115/HT2016-7414
View Paper titled, Thermal Interfacial Resistance Reduction Between Metal and Dielectric Materials by Inserting Intermediate Metal Layer
Click here to open pdf in another window PDF for Thermal Interfacial Resistance Reduction Between Metal and Dielectric Materials by Inserting Intermediate Metal Layer
Topics: Dielectric materials, Interfacial thermal resistance, Metals, Aluminum, Electrons, Phonons, Nickel, Simulation results, Temperature
Proceedings Papers

Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A001, July 10–14, 2016
Paper No: HT2016-7043
DOI: https://doi.org/10.1115/HT2016-7043
View Paper titled, Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness
Click here to open pdf in another window PDF for Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness
Topics: Metrology, Resolution (Optics), Steady state, Flow (Dynamics), Heat, Interfacial thermal resistance, Junctions, Measurement systems, Measurement uncertainty, Performance characterization
Proceedings Papers

Modeling Thermal Conductivity of Aligned CNT-Matrix Composites With Increasing Volume Fraction

Diana Grandio, Drazen Fabris
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T04A001, July 10–14, 2016
Paper No: HT2016-7145
DOI: https://doi.org/10.1115/HT2016-7145
View Paper titled, Modeling Thermal Conductivity of Aligned CNT-Matrix Composites With Increasing Volume Fraction
Click here to open pdf in another window PDF for Modeling Thermal Conductivity of Aligned CNT-Matrix Composites With Increasing Volume Fraction
Topics: Carbon nanotubes, Composite materials, Modeling, Thermal conductivity, Particulate matter, Finite element analysis, Fibers, Computation, Elastic moduli, Interfacial thermal resistance
Proceedings Papers

Dynamics of the Liquid Microlayer Underneath a Vapor Bubble Growing at a Heated Wall

A. Guion, D. Langewisch, J. Buongiorno
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A044, July 14–19, 2013
Paper No: HT2013-17174
DOI: https://doi.org/10.1115/HT2013-17174
View Paper titled, Dynamics of the Liquid Microlayer Underneath a Vapor Bubble Growing at a Heated Wall
Click here to open pdf in another window PDF for Dynamics of the Liquid Microlayer Underneath a Vapor Bubble Growing at a Heated Wall
Topics: Bubbles, Dynamics (Mechanics), Vapors, Evaporation, Capillarity, Heat flux, Inertia (Mechanics), Interfacial thermal resistance, Pressure, Thermal diffusion
Proceedings Papers

Interfacial Resistance Measurement of High Performance Thermal Interface Materials

Andrew N. Smith, Nicholas Jankowski, Lauren Boteler, Christopher Meyer
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A003, July 14–19, 2013
Paper No: HT2013-17507
DOI: https://doi.org/10.1115/HT2013-17507
View Paper titled, Interfacial Resistance Measurement of High Performance Thermal Interface Materials
Click here to open pdf in another window PDF for Interfacial Resistance Measurement of High Performance Thermal Interface Materials
Topics: Interfacial thermal resistance, Temperature, ASTM International, Resolution (Optics), Heat, Uncertainty, Microscopes, Preforms, Probes, Resistance thermometers
Proceedings Papers

Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction

Hua Bao, Shirui Luo, Ming Hu
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A039, July 14–19, 2013
Paper No: HT2013-17176
DOI: https://doi.org/10.1115/HT2013-17176
View Paper titled, Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction
Click here to open pdf in another window PDF for Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction
Topics: Carbon, Graphene, Junctions, Nanotubes, Carbon nanotubes, Energy dissipation, Heat, Silicon, Thermal conductivity, Engineering systems and industry applications
Proceedings Papers

An Evaluation of Energy Transfer Pathways in Thermal Transport Across Solid/Solid Interfaces

Yan Wang, Xiulin Ruan
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A041, July 14–19, 2013
Paper No: HT2013-17297
DOI: https://doi.org/10.1115/HT2013-17297
View Paper titled, An Evaluation of Energy Transfer Pathways in Thermal Transport Across Solid/Solid Interfaces
Click here to open pdf in another window PDF for An Evaluation of Energy Transfer Pathways in Thermal Transport Across Solid/Solid Interfaces
Topics: Electrons, Energy transformation, Heat, Heat transfer, High temperature, Interfacial thermal resistance, Metallic thin films, Metals, Phonons, Semiconductor wafers
Proceedings Papers

Dependence of Thermal Conductivities of the AlN Film in the LED Architecture on Surface Roughness and Lattice Mismatch

Zonghui Su, Jonathan A. Malen, Justin P. Freedman, Robert F. Davis, Jacob H. Leach, Edward A. Preble
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A004, July 14–19, 2013
Paper No: HT2013-17116
DOI: https://doi.org/10.1115/HT2013-17116
View Paper titled, Dependence of Thermal Conductivities of the AlN Film in the LED Architecture on Surface Roughness and Lattice Mismatch
Click here to open pdf in another window PDF for Dependence of Thermal Conductivities of the AlN Film in the LED Architecture on Surface Roughness and Lattice Mismatch
Topics: Surface roughness, Aluminum, Crystals, Interfacial thermal resistance, Resolution (Optics), Sapphire, Silicon, Thermal conductivity, Thermal resistance, Thin films
Proceedings Papers

Two Carrier Heat Transfer Modeling for Heat Assisted Magnetic Recording

Neil Zuckerman, Jin Fang
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A006, July 14–19, 2013
Paper No: HT2013-17235
DOI: https://doi.org/10.1115/HT2013-17235
View Paper titled, Two Carrier Heat Transfer Modeling for Heat Assisted Magnetic Recording
Click here to open pdf in another window PDF for Two Carrier Heat Transfer Modeling for Heat Assisted Magnetic Recording
Topics: Heat, Heat transfer, Magnetic recording, Modeling, Electrons, Phonons, Ceramics, Design, Nanoscale phenomena, Temperature
Proceedings Papers

Heat Conduction Across Corrugated Thermal Interface

Bozhi Yang, Wenjun Liu
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 277-281, July 8–12, 2007
Paper No: HT2007-32112
DOI: https://doi.org/10.1115/HT2007-32112
View Paper titled, Heat Conduction Across Corrugated Thermal Interface
Click here to open pdf in another window PDF for Heat Conduction Across Corrugated Thermal Interface
Topics: Heat conduction, Geometry, Heat transfer, Computer simulation, Design, Eigenfunctions, Finite element methods, Finite element model, Interfacial thermal resistance, Simulation
Proceedings Papers

Diameter and Length Effect on Diffusive-Ballistic Phonon Transport in a Carbon Nanotube

Junichiro Shiomi, Shigeo Maruyama
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 381-386, July 8–12, 2007
Paper No: HT2007-32734
DOI: https://doi.org/10.1115/HT2007-32734
View Paper titled, Diameter and Length Effect on Diffusive-Ballistic Phonon Transport in a Carbon Nanotube
Click here to open pdf in another window PDF for Diameter and Length Effect on Diffusive-Ballistic Phonon Transport in a Carbon Nanotube
Topics: Carbon nanotubes, Phonons, Single-walled nanotubes, Thermal conductivity, Temperature, Equilibrium (Physics), Heat conduction, Interfacial thermal resistance, Molecular dynamics, Nanotubes
Proceedings Papers

Thermal Conductivity and Specific Heat Capacity of Carbon Nanotube Bundles

John Shelton, Frank Pyrtle, III
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 517-520, July 8–12, 2007
Paper No: HT2007-32487
DOI: https://doi.org/10.1115/HT2007-32487
View Paper titled, Thermal Conductivity and Specific Heat Capacity of Carbon Nanotube Bundles
Click here to open pdf in another window PDF for Thermal Conductivity and Specific Heat Capacity of Carbon Nanotube Bundles
Topics: Carbon nanotubes, Specific heat, Thermal conductivity, Single-walled carbon nanotubes, Dimensions, Energy transformation, Equilibrium (Physics), Finite element analysis, Fluids, Heat transfer
Proceedings Papers

Effect of Polymer Chains on Heat Transfer on Nanofins

Navdeep Singh, Debjyoti Banerjee
Proc. ASME. HT2008, Heat Transfer: Volume 1, 385-388, August 10–14, 2008
Paper No: HT2008-56390
DOI: https://doi.org/10.1115/HT2008-56390
View Paper titled, Effect of Polymer Chains on Heat Transfer on Nanofins
Click here to open pdf in another window PDF for Effect of Polymer Chains on Heat Transfer on Nanofins
Topics: Heat transfer, Polymer chains, Fluids, Nanotubes, Simulation, Temperature, Carbon nanotubes, Interfacial thermal resistance, Nanoparticles, Atoms
Proceedings Papers

Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications

Y. Yang, Chun-Teh Li, S. M. Sadeghipour, M. Asheghi, H. Dieker, M. Wuttig
Proc. ASME. HT2005, Heat Transfer: Volume 4, 837-843, July 17–22, 2005
Paper No: HT2005-72679
DOI: https://doi.org/10.1115/HT2005-72679
View Paper titled, Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications
Click here to open pdf in another window PDF for Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications
Topics: Phase change materials, Thermal characterization, Metals, Electronic systems, Interfacial thermal resistance, MEMS packaging, Modeling, Nanoelectromechanical systems, Pacific Rim, Thermoreflectance
Proceedings Papers

Brownian-Motion-Based Convective-Conductive Model for the Thermal Conductivity of Nanofluids

Ravi Prasher
Proc. ASME. HT2005, Heat Transfer: Volume 1, 343-353, July 17–22, 2005
Paper No: HT2005-72048
DOI: https://doi.org/10.1115/HT2005-72048
View Paper titled, Brownian-Motion-Based Convective-Conductive Model for the Thermal Conductivity of Nanofluids
Click here to open pdf in another window PDF for Brownian-Motion-Based Convective-Conductive Model for the Thermal Conductivity of Nanofluids
Topics: Nanofluids, Thermal conductivity, Convection, Nanoparticles, Particulate matter, Concretes, Heat conduction, Interfacial thermal resistance, Particle size, Temperature
Proceedings Papers

Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling

Robert J. Stevens, Pamela M. Norris, Arthur W. Lichtenberger
Proc. ASME. HT-FED2004, Volume 4, 503-504, July 11–15, 2004
Paper No: HT-FED2004-56556
DOI: https://doi.org/10.1115/HT-FED2004-56556
View Paper titled, Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling
Click here to open pdf in another window PDF for Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling
Topics: Electrons, Interfacial thermal resistance, Phonons, Temperature, Electron scattering, Acoustics, Diamonds, Electrical conductance, Electromagnetic scattering, Metals