Topics: Design, Response surface methodology, Simulation, Thermal resistance, Errors, Heat conduction, Manufacturing, Cooling, Dimensions, Solders

Topics: Condensers (steam plant), Transient heat transfer, Temperature, Heat, Simulation, Density, Flow (Dynamics), Porous materials, Simulation results, Steady state

Topics: Computational fluid dynamics, Coolers, Cooling, Design, Engineering simulation, Heat, Heat transfer, Heat transfer coefficients, Simulation, Thermal conductivity

Topics: Design, Finite element analysis, Solders

Topics: Electronic equipment, Flow (Dynamics), Plates (structures), Shapes, Experimental design, Reynolds number, Natural convection

Topics: Electronic packages, Computational fluid dynamics, Convection, Junctions, Temperature, Algebra, Cooling, Fluid dynamics, Fluids, Heat transfer

Topics: Geometry, Heat transfer, Nozzles, Pressure drop, Cooling, Jets, Heat, Copper, Electronic components, Flow (Dynamics)

Topics: Clearances (Engineering), Cooling, Electronic equipment, Heating, Temperature, Copper, Modeling, Electronic products, Flow (Dynamics), Natural convection

Topics: Heat, Heat pipes, Water, Stress, Cooling, Copper, Diamonds, Fluctuations (Physics), Fluids, Heating

Topics: MOSFET transistors, Physics, Semiconductors (Materials), Electrodes, Errors, Gates (Closures)