In this paper an experimental investigation of convective heat transfer is presented for laminar gas flow through a microchannel. A test stand was setup to impose thermal boundary conditions of constant temperature gradient along the microchannel length. Additionally, thin film temperature sensors were developed and used to directly measure the microchannel surface temperature. Heat transfer experiments were conducted in the laminar flow regime with the outlet Ma between 0.10 and 0.42. The experimental measurements of inlet and outlet gas temperature and the microchannel wall temperature were used to validate a 2D numerical model for gaseous flow in microchannel. The model was then used to determine bcal values of Ma, Re, and Nu. The numerical results show that after the entrance region, Nu approaches 8.23, the fully developed value of Nu for incompressible flow for constant wall heat flux if Nu is defined based on (Tw-Taw) and plotted as a function of the new dimensionless axial length, X* = (x/2H)(Ma2)/(RePr).
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ASME 2004 2nd International Conference on Microchannels and Minichannels
June 17–19, 2004
Rochester, New York, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4164-2
PROCEEDINGS PAPER
Effect of Compressibility on Heat Transfer in Microchannels
Stephen E. Turner,
Stephen E. Turner
Naval Undersea Warfare Center, Newport, RI
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Yutaka Asako,
Yutaka Asako
Tokyo Metropolitan University, Tokyo, Japan
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Mohammad Faghri
Mohammad Faghri
University of Rhode Island, Kingston, RI
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Stephen E. Turner
Naval Undersea Warfare Center, Newport, RI
Yutaka Asako
Tokyo Metropolitan University, Tokyo, Japan
Mohammad Faghri
University of Rhode Island, Kingston, RI
Paper No:
ICMM2004-2354, pp. 341-350; 10 pages
Published Online:
December 2, 2008
Citation
Turner, SE, Asako, Y, & Faghri, M. "Effect of Compressibility on Heat Transfer in Microchannels." Proceedings of the ASME 2004 2nd International Conference on Microchannels and Minichannels. ASME 2nd International Conference on Microchannels and Minichannels. Rochester, New York, USA. June 17–19, 2004. pp. 341-350. ASME. https://doi.org/10.1115/ICMM2004-2354
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