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Proceedings Papers

Transient Thermal Characteristics for a Liquid Drop Impacting a Hot PCM Substrate

Abdul Ahad Khan, Dilip Choudhary, Abhishek Basavanna, Salman Najmee, Jessica Crisantes, Navdeep S. Dhillon

Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A003, June 10–13, 2018

Paper No: ICNMM2018-7694

DOI: https://doi.org/10.1115/ICNMM2018-7694

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Topics: Drops, Transients (Dynamics), Cooling, Heat transfer, Flow (Dynamics), Temperature, Aircraft, Boiling, Coating processes, Coatings

Proceedings Papers

Two-Phase Flow Conjugate Heat Transfer in Wavy Microchannel

Nishant Tiwari, Manoj Kumar Moharana

Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T02A017, June 10–13, 2018

Paper No: ICNMM2018-7735

DOI: https://doi.org/10.1115/ICNMM2018-7735

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Topics: Heat transfer, Microchannels, Two-phase flow, Bubbles, Boiling, Flow (Dynamics), Heat transfer coefficients, Nucleation (Physics), Vapors, Accounting

Proceedings Papers

Thermal Performance of Micro-Jet Impingement Device With Parallel Flow, Jet-Adjacent Fluid Removal

Todd M. Bandhauer, David R. Hobby, Chris Jacobsen, Dave Sherrer

Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T11A004, June 10–13, 2018

Paper No: ICNMM2018-7665

DOI: https://doi.org/10.1115/ICNMM2018-7665

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Topics: Flow (Dynamics), Fluids, Cooling, Impingement cooling, Jets, Integrated circuits, Reynolds number, Thermal resistance, Electronic systems, Geometry

Proceedings Papers

Influence of Condensation on the Outer Surface of Polymer Hollow Fiber Heat Exchangers During Heat Transfer

Tereza Brozova, Erik Bartuli

Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A006, June 10–13, 2018

Paper No: ICNMM2018-7728

DOI: https://doi.org/10.1115/ICNMM2018-7728

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Topics: Condensation, Fibers, Heat exchangers, Heat transfer, Polymers, Air conditioning, Aluminum, Copper, Corrosion resistance, Gravity (Force)

Proceedings Papers

The Leidenfrost Phenomenon on Sub-Micron Tapered Pillars

Manuel Auliano, Maria Fernandino, Peng Zhang, Carlos Alberto Dorao

Proc. ASME. ICNMM2017, ASME 2017 15th International Conference on Nanochannels, Microchannels, and Minichannels, V001T08A003, August 27–30, 2017

Paper No: ICNMM2017-5557

DOI: https://doi.org/10.1115/ICNMM2017-5557

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Topics: Columns (Structural), Drops, Cooling, Displacement, Evaporation, Heat transfer, Temperature, Thermal conductivity, Vapors, Water

Proceedings Papers

The Leidenfrost Phenomenon on Silicon Nanowires

Manuel Auliano, Maria Fernandino, Peng Zhang, Carlos Alberto Dorao

Proc. ASME. ICNMM2016, ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, V001T09A004, July 10–14, 2016

Paper No: ICNMM2016-8032

DOI: https://doi.org/10.1115/ICNMM2016-8032

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Topics: Nanowires, Silicon, Drops, Heat transfer, Cooling, Evaporation, High temperature, Polishing, Temperature, Thermal conductivity

Proceedings Papers

Metallic Nanoemulsion for Microchannel Heat-Sink

Yoshikazu Hayashi, Gordon Yip, Yoon Jo Kim, Jong-Hoon Kim

Proc. ASME. ICNMM2016, ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, V001T15A002, July 10–14, 2016

Paper No: ICNMM2016-8010

DOI: https://doi.org/10.1115/ICNMM2016-8010

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Topics: Heat sinks, Microchannels, Thermal conductivity, Viscosity, Drops, Fluids, Coolants, Nanoscale phenomena, Oxidation, Specific heat

Proceedings Papers

Microchannel Design Study for 3D Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method

L.-M. Collin, V. Fiori, P. Coudrain, S. L. Lhostis, S. Chéramy, J.-P. Colonna, B. Mathieu, A. Souifi, L. G. Fréchette

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A005, July 6–9, 2015

Paper No: ICNMM2015-48830

DOI: https://doi.org/10.1115/ICNMM2015-48830

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Topics: Cooling, Design, Finite element methods, Microchannels, Microelectronic devices, Heat, Modeling, Computer software, Finite element analysis, Copper

Proceedings Papers

Thermal Transport Property of Silicon Membranes With Asymmetric Porous Structure

Harutoshi Hagino, Koji Miyazaki

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T02A001, July 6–9, 2015

Paper No: ICNMM2015-48281

DOI: https://doi.org/10.1115/ICNMM2015-48281

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Topics: Membranes, Silicon, Phonons, Thermal rectification, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Heat conduction, Mean free path, Transport theory

Proceedings Papers

Adsorption-Based Thermal Rectifier

Tadeh Avanessian, Gisuk Hwang

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A024, July 6–9, 2015

Paper No: ICNMM2015-48508

DOI: https://doi.org/10.1115/ICNMM2015-48508

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Topics: Coatings, Design, Electronic systems, Fluids, Heat transfer, Kinetic theory, Knudsen flow, Mean free path, Particulate matter, Pressure

Proceedings Papers

Conjugate Heat Transfer Simulation in Gaseous Flow Micro Heat Exchanger

Giulio Croce, Michele A. Coppola

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A036, July 6–9, 2015

Paper No: ICNMM2015-48128

DOI: https://doi.org/10.1115/ICNMM2015-48128

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Topics: Gas flow, Heat exchangers, Heat transfer, Simulation, Compressibility, Fluids, Microchannels, Slip flow, Temperature, Thermal conductivity

Proceedings Papers

Numerical Analysis of Heat Transfer Characteristics for Supercritical Aviation Kerosene

Yachao Song, Danjiao Ma, Jingzhi Zhang, Jing-xiang Chen, Songze Chen, Wei Li

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A004, July 6–9, 2015

Paper No: ICNMM2015-48264

DOI: https://doi.org/10.1115/ICNMM2015-48264

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Topics: Aviation, Heat transfer, Numerical analysis, Temperature, Computational fluid dynamics, Convection, Density, Fittings, Fluids, Heat flux

Proceedings Papers

Multiphase Approach on Heat Transfer Performance of Micro-Channel Using Hybrid Carbon Nanofluid

Rajesh Nimmagadda, K. Venkatasubbaiah

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A050, July 6–9, 2015

Paper No: ICNMM2015-48117

DOI: https://doi.org/10.1115/ICNMM2015-48117

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Topics: Carbon, Heat transfer, Microchannels, Nanofluids, Single-walled carbon nanotubes, Nanoparticles, Flow (Dynamics), Convection, Fluids, Reynolds number

Proceedings Papers

Thermal Performance and Pressure Drop of Galinstan-Based Microchannel Heat-Sink for High Heat-Flux Thermal Management

Yoshikazu Hayashi, Navid Saneie, Yoon Jo Kim, Jong-Hoon Kim

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A012, July 6–9, 2015

Paper No: ICNMM2015-48404

DOI: https://doi.org/10.1115/ICNMM2015-48404

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Topics: Heat flux, Heat sinks, Microchannels, Pressure drop, Thermal management, Water, Viscosity, Fluids, Specific heat, Thermal conductivity

Proceedings Papers

Flow Boiling Heat Transfer Coefficient of DI-Water/SiO2 Nanofluid Inside a 1.1 mm Round Microchannel

Tiago A. Moreira, Francisco J. do Nascimento, Gherhardt Ribatski

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A021, July 6–9, 2015

Paper No: ICNMM2015-48317

DOI: https://doi.org/10.1115/ICNMM2015-48317

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Topics: Boiling, Flow (Dynamics), Heat transfer coefficients, Microchannels, Nanofluids, Quartz, Water, Nanoparticles, Flux (Metallurgy), Heat

Proceedings Papers

Axial Wall Conduction in Pulsating Laminar Flow in a Microtube

Parthasarathi Mishra, Manoj Kumar Moharana

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T02A006, August 3–7, 2014

Paper No: ICNMM2014-21975

DOI: https://doi.org/10.1115/ICNMM2014-21975

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Topics: Heat conduction, Laminar flow, Heat transfer, Flow (Dynamics), Boundary-value problems, Computer simulation, Electrical conductivity, Fluids, Heat flux, Numerical analysis

Proceedings Papers

Heat Conduction Simulation in Double-Walled Carbon Nanotubes With Intertube Additional Atoms

Peng Tan, Yanhui Feng, Liu Cui, Xinxin Zhang

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T12A014, August 3–7, 2014

Paper No: ICNMM2014-22191

DOI: https://doi.org/10.1115/ICNMM2014-22191

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Topics: Atoms, Carbon nanotubes, Heat conduction, Simulation, Deformation, Phonons, Carbon, Thermal conductivity, Density, Electromagnetic scattering

Proceedings Papers

Mixing and Heat Transfer in Helical Capillary Flow Reactors With Alternating Bends

Marius G. Gelhausen, Safa Kutup Kurt, Norbert Kockmann

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T13A001, August 3–7, 2014

Paper No: ICNMM2014-21779

DOI: https://doi.org/10.1115/ICNMM2014-21779

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Topics: Flow (Dynamics), Heat transfer, Chemical reactions, Ethylene-propylene rubber, Heat transfer coefficients, Laminar flow, Polymers, Temperature, Thermal conductivity, Water

Proceedings Papers

Motion and Deformation of a Water Droplet Under the Influence of an Electric Field

Kyle DeProw, Jeff Darabi

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T06A004, August 3–7, 2014

Paper No: ICNMM2014-21654

DOI: https://doi.org/10.1115/ICNMM2014-21654

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Topics: Deformation, Drops, Electric fields, Water, Glass, Accounting, Electrical conductivity, Electrodes, Fluids, Image processing

Proceedings Papers

Copper Plated Microchannel Heat Exchanger for MEMS Application

E. Borquist, E. Ogbonnaya, S. Thapa, D. Wood, L. Weiss

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T04A005, August 3–7, 2014

Paper No: ICNMM2014-21927

DOI: https://doi.org/10.1115/ICNMM2014-21927

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Topics: Copper, Heat exchangers, Microchannels, Microelectromechanical systems, Fluids, Absorption, Design, Temperature, Circuits, Density

2 3 4 5

NARROW

Transient Thermal Characteristics for a Liquid Drop Impacting a Hot PCM Substrate

Two-Phase Flow Conjugate Heat Transfer in Wavy Microchannel

Thermal Performance of Micro-Jet Impingement Device With Parallel Flow, Jet-Adjacent Fluid Removal

Influence of Condensation on the Outer Surface of Polymer Hollow Fiber Heat Exchangers During Heat Transfer

The Leidenfrost Phenomenon on Sub-Micron Tapered Pillars

The Leidenfrost Phenomenon on Silicon Nanowires

Metallic Nanoemulsion for Microchannel Heat-Sink

Microchannel Design Study for 3D Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method

Thermal Transport Property of Silicon Membranes With Asymmetric Porous Structure

Adsorption-Based Thermal Rectifier

Conjugate Heat Transfer Simulation in Gaseous Flow Micro Heat Exchanger

Numerical Analysis of Heat Transfer Characteristics for Supercritical Aviation Kerosene

Multiphase Approach on Heat Transfer Performance of Micro-Channel Using Hybrid Carbon Nanofluid

Thermal Performance and Pressure Drop of Galinstan-Based Microchannel Heat-Sink for High Heat-Flux Thermal Management

Flow Boiling Heat Transfer Coefficient of DI-Water/SiO2 Nanofluid Inside a 1.1 mm Round Microchannel

Axial Wall Conduction in Pulsating Laminar Flow in a Microtube

Heat Conduction Simulation in Double-Walled Carbon Nanotubes With Intertube Additional Atoms

Mixing and Heat Transfer in Helical Capillary Flow Reactors With Alternating Bends

Motion and Deformation of a Water Droplet Under the Influence of an Electric Field

Copper Plated Microchannel Heat Exchanger for MEMS Application

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