MEMS devices typically have moving or oscillating mechanical parts, and characterization of their dynamics, including their modal parameters, is highly desirable. This paper is concerned with experimental implementation of a Stochastic Subspace Identification (SSI) algorithm as well a base excitation based identification algorithm for experimental modal analysis of a micro-cantilever switch. A white noise signal applied to the built-in electrostatic actuator in the switches excited a response measured using microscanning Laser Doppler Vibrometry (LDV). In the case of identification via the SSI, only the output response was used while the base excitation based algorithm employed the input and the output signals. The modal parameters found using MACEC matched well with those predicted by theory, and the results obtained via the two experimental identification approaches are in good agreement, thus providing confidence in using the SSI approach for experimental modal analysis of MEMS structures.
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ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 28–31, 2011
Washington, DC, USA
Conference Sponsors:
- Design Engineering Division and Computers and Information in Engineering Division
ISBN:
978-0-7918-5484-6
PROCEEDINGS PAPER
Modal Characterization of MEMS Switches via Output Only and Input/Output Identification Methods
Joel M. Book,
Joel M. Book
The University of Western Ontario, London, ON, Canada
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Samuel F. Asokanthan
Samuel F. Asokanthan
The University of Western Ontario, London, ON, Canada
Search for other works by this author on:
Joel M. Book
The University of Western Ontario, London, ON, Canada
Samuel F. Asokanthan
The University of Western Ontario, London, ON, Canada
Paper No:
DETC2011-48888, pp. 263-267; 5 pages
Published Online:
June 12, 2012
Citation
Book, JM, & Asokanthan, SF. "Modal Characterization of MEMS Switches via Output Only and Input/Output Identification Methods." Proceedings of the ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference. Washington, DC, USA. August 28–31, 2011. pp. 263-267. ASME. https://doi.org/10.1115/DETC2011-48888
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