Search Results | IDETC-CIE | ASME Digital Collection

1-20 of 50

Sort by

Sort Order Select

Proceedings Papers

An Radio Frequency Impedance Matching Control Benchmark System for Advanced Control Strategies Evaluation

Carlos A. Rodríguez, Jairo Viola, YangQuan Chen

Proc. ASME. IDETC-CIE2021, Volume 7: 17th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA), V007T07A004, August 17–19, 2021

Paper No: DETC2021-70211

DOI: https://doi.org/10.1115/DETC2021-70211

View Paper

Topics: Adaptive control, Algorithms, Control equipment, Control systems, Feedback, Feedforward control, Plasmas (Ionized gases), Reflectance, Robustness, Semiconductor wafers

Proceedings Papers

Simulation of Submicron Particle Deposition in Laminar and Turbulent Stagnation Point Flows

Salem Abuzeid, Ahmed A. Busnaina

Proc. ASME. CIE91, ASME 1991 Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computational Fluid/Thermal Engineering, 565-574, August 18–22, 1991

Paper No: CIE1991-0070

DOI: https://doi.org/10.1115/CIE1991-0070

View Paper

Topics: Particulate matter, Simulation, Stagnation flow, Turbulence, Brownian motion, Aerosols, Flow (Dynamics), Fluctuations (Physics), Fluids, Semiconductor wafers

Proceedings Papers

Particle Transport in CVD and Diffusion Processes

Ahmed Busnaina, Xiaoying Zhu, Xiaowei Zheng

Proc. ASME. CIE92, ASME 1992 International Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computers in Fluid Mechanics/Thermal Systems, 483-490, August 2–6, 1992

Paper No: CIE1992-0057

DOI: https://doi.org/10.1115/CIE1992-0057

View Paper

Topics: Chemical vapor deposition, Diffusion processes, Particulate matter, Furnaces, Semiconductor wafers, Aerosols, Diffusion (Physics), Turbulence, Brownian motion, Computation

Proceedings Papers

Design and Fabrication of Microelectromechanical Systems

G. K. Ananthasuresh, Sridhar Kota, Selden B. Crary, Kensall D. Wise

Proc. ASME. DETC92, 22nd Biennial Mechanisms Conference: Robotics, Spatial Mechanisms, and Mechanical Systems, 251-258, September 13–16, 1992

Paper No: DETC1992-0222

DOI: https://doi.org/10.1115/DETC1992-0222

View Paper

Topics: Design, Manufacturing, Microelectromechanical systems, Blocks (Building materials), Micromachining, Micromechanical devices, Sensors, Boron, Circuits, Dimensions

Proceedings Papers

Mass Transport and Particle Transport in an LPCVD Process

Bruce S. MacGibbon, Ahmed A. Busnaina

Proc. ASME. CIE93, 13th Computers in Engineering Conference, 213-219, August 8–12, 1993

Paper No: CIE1993-0027

DOI: https://doi.org/10.1115/CIE1993-0027

View Paper

Topics: Particulate matter, Contamination, Pressure, Brownian motion, Chemical vapor deposition, Circuits, Dimensions, Drag (Fluid dynamics), Flow (Dynamics), Gravity (Force)

Proceedings Papers

Active Vibration Control of Flexible Space Structures by Using Piezoelectric Sensors and Actuators

Brij N. Agrawal, Hyochoong Bang

Proc. ASME. DETC93, 14th Biennial Conference on Mechanical Vibration and Noise: Vibration and Control of Mechanical Systems, 169-179, September 19–22, 1993

Paper No: DETC1993-0232

DOI: https://doi.org/10.1115/DETC1993-0232

View Paper

Topics: Actuators, Sensors, Space frame structures, Vibration control, Damping, Feedback, Flexible structures, Navy, Piezoelectric actuators, Piezoelectric ceramics

Proceedings Papers

Multiple-Mode Input Shaping Sequences for Reducing Residual Vibrations

B. Whitney Rappole, Jr., Neil C. Singer, Warren P. Seering

Proc. ASME. DETC94, 23rd Biennial Mechanisms Conference: Machine Elements and Machine Dynamics, 11-16, September 11–14, 1994

Paper No: DETC1994-0237

DOI: https://doi.org/10.1115/DETC1994-0237

View Paper

Topics: Vibration, Feedforward control, Flexible structures, Optimization, Robots, Semiconductor wafers

Proceedings Papers

Design Considerations for Manufacturability of MEMS Comb Actuators

Hrishikesh Dixit, Dean L. Taylor, Srikanth Kannapan

Proc. ASME. DETC-CIE96, Volume 1: Design for Manufacturing Conference, V001T01A047, August 18–22, 1996

Paper No: 96-DETC/DFM-1311

DOI: https://doi.org/10.1115/96-DETC/DFM-1311

View Paper

Topics: Actuators, Design, Design for Manufacturing, Microelectromechanical systems, Manufacturing, Parametric design, Chemical vapor deposition, Etching, Integrated circuits, Lithography

Proceedings Papers

Removal of Submicron Particles Using High Frequency Ultrasonics

Ahmed A. Busnaina, Fen Dai

Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A018, August 18–22, 1996

Paper No: 96-DETC/CIE-1352

DOI: https://doi.org/10.1115/96-DETC/CIE-1352

View Paper

Topics: Particulate matter, Ultrasonics, Ultrasonic cleaning, Contamination, Chemical vapor deposition, Integrated circuit fabrication, Reactive-ion etching, Semiconductor wafers, Semiconductors (Materials)

Proceedings Papers

Multivariable Feedback Relevant System Identification of a Wafer Stepper System

Raymond A. de Callafon, Paul M. J. Van den Hof

Proc. ASME. DETC97, Volume 1A: 16th Biennial Conference on Mechanical Vibration and Noise, V01AT03A014, September 14–17, 1997

Paper No: DETC97/VIB-4243

DOI: https://doi.org/10.1115/DETC97/VIB-4243

View Paper

Topics: Feedback, Wafer steppers, Semiconductor wafers, Control equipment, Design, Manufacturing, Robust control

Proceedings Papers

Analytical Modeling for Semiconductor Wafer Fab Environments in Support of Drum-Buffer-Rope Implementation

Jay Maguire, Jim Hinchman, Steve Luce

Proc. ASME. DETC98, Volume 4: 3rd Design for Manufacturing Conference, V004T04A045, September 13–16, 1998

Paper No: DETC98/DFM-5751

DOI: https://doi.org/10.1115/DETC98/DFM-5751

View Paper

Topics: Design for Manufacturing, Modeling, Polishing equipment, Ropes, Semiconductor wafers, Manufacturing, Cycles, Equipment performance, Industrial capacity

Proceedings Papers

Slurry Residue Removal in Post Chemical Mechanical Polishing

Ahmed A. Busnaina, Naim Moumen

Proc. ASME. DETC99, Volume 2: 19th Computers and Information in Engineering Conference, 87-92, September 12–16, 1999

Paper No: DETC99/CIE-9049

DOI: https://doi.org/10.1115/DETC99/CIE-9049

View Paper

Topics: Chemical vapor deposition, Contamination, Oxidation, Particulate matter, Polishing, Semiconductor wafers, Slurries

Proceedings Papers

Microfabrication and Characterization of Electro-Thermal-Compliant Micro Devices

Jun Li, G. K. Ananthasuresh

Proc. ASME. IDETC-CIE2000, Volume 7A: 26th Biennial Mechanisms and Robotics Conference, 621-633, September 10–13, 2000

Paper No: DETC2000/MECH-14118

DOI: https://doi.org/10.1115/DETC2000/MECH-14118

View Paper

Topics: Actuators, Compliant mechanisms, Excimer lasers, Heating, Joules, Materials properties, Metals, Microelectromechanical systems, Microfabrication, Micromachining

Proceedings Papers

Designing a Requirement Driven Product Development Process

Qi Dong, Daniel E. Whitney

Proc. ASME. IDETC-CIE2001, Volume 4: 13th International Conference on Design Theory and Methodology, 11-20, September 9–12, 2001

Paper No: DETC2001/DTM-21682

DOI: https://doi.org/10.1115/DETC2001/DTM-21682

View Paper

Topics: Design, Product development, Algorithms, Flow (Dynamics), Semiconductor wafers, Systems analysis

Proceedings Papers

Effect of Piezoceramic Hysteresis in Passive and Hybrid Structural Acoustic Control

M. Bulent Ozer, Thomas J. Royston

Proc. ASME. IDETC-CIE2001, Volume 6B: 18th Biennial Conference on Mechanical Vibration and Noise, 1379-1388, September 9–12, 2001

Paper No: DETC2001/VIB-21465

DOI: https://doi.org/10.1115/DETC2001/VIB-21465

View Paper

Topics: Acoustics, Piezoelectric ceramics, Semiconductor wafers, Dimensions, Equations of motion, Modeling

Proceedings Papers

Design, Development and Characterization of a Wrap Spring Clutch/Brake Mechanism As a Knee Joint for an Assistive Exoskeleton

Vishnu Aishwaryan Subra Mani, Nathaniel Goldfarb, Gregory S. Fischer

Proc. ASME. IDETC-CIE2020, Volume 9: 40th Computers and Information in Engineering Conference (CIE), V009T09A035, August 17–19, 2020

Paper No: DETC2020-22444

DOI: https://doi.org/10.1115/DETC2020-22444

View Paper

Topics: Brakes, Design, Exoskeleton devices, Knee, Springs, Robotics, Automotive brakes, Biomechanics, Biomedicine, Performance

Proceedings Papers

Direct Label Free Detection of Orchid Virus Using a Micro/Nano Hybrid Structured Biosensor

Wei-Jhen Wang, Chia-Hwa Lee, Chin-Wen Li, Stephen Liao, Fuh-Jyh Jan, Gou-Jen Wang

Proc. ASME. IDETC-CIE2019, Volume 4: 24th Design for Manufacturing and the Life Cycle Conference; 13th International Conference on Micro- and Nanosystems, V004T08A002, August 18–21, 2019

Paper No: DETC2019-97198

DOI: https://doi.org/10.1115/DETC2019-97198

View Paper

Topics: Biosensors, Electrochemical impedance spectroscopy, Electrodes, Ethyl compounds, Integrated circuit fabrication, Self-assembly, Semiconductor wafers, Sensors

Proceedings Papers

Genetically Modified Soybean Detection Using a Biosensor Electrode With Self-Assembled Gold Nanoparticles on a Micro Hemisphere Array

Ying-Ting Lin, Iren Kuznetsova, Gou-Jen Wang

Proc. ASME. IDETC-CIE2019, Volume 4: 24th Design for Manufacturing and the Life Cycle Conference; 13th International Conference on Micro- and Nanosystems, V004T08A001, August 18–21, 2019

Paper No: DETC2019-97112

DOI: https://doi.org/10.1115/DETC2019-97112

View Paper

Topics: Biosensors, Electrodes, Nanoparticles, Self-assembly, Semiconductor wafers, Electrochemical impedance spectroscopy, Ethanol, Genetically engineered foods, Photolithography

Proceedings Papers

Tension-Induced Raman Spectrum Enhanced Phenomena of Graphene Membrane

Kai-Ming Hu, Bo Peng, Han Yan, Wen-Ming Zhang, Zhong-Yin Xue, Zeng-Feng Di, Ya-Ting Sun

Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A016, August 26–29, 2018

Paper No: DETC2018-85158

DOI: https://doi.org/10.1115/DETC2018-85158

View Paper

Topics: Graphene, Membranes, Raman spectra, Tension, Silicon-on-insulator, Microfabrication, Microscale devices, Semiconductor wafers, Stress

Proceedings Papers

Characterization of a Non-Interdigitated Comb Drive

Mary Gopanchuk, Mohamed Arabi, N. Nelson-Fitzpatrick, Majed S. Al-Ghamdi, Eihab Abdel-Rahman, Mustafa Yavuz

Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A013, August 26–29, 2018

Paper No: DETC2018-86271

DOI: https://doi.org/10.1115/DETC2018-86271

View Paper

Topics: Actuators, Design, Manufacturing, Semiconductor wafers, Sensors, Silicon-on-insulator

NARROW

An Radio Frequency Impedance Matching Control Benchmark System for Advanced Control Strategies Evaluation

Simulation of Submicron Particle Deposition in Laminar and Turbulent Stagnation Point Flows

Particle Transport in CVD and Diffusion Processes

Design and Fabrication of Microelectromechanical Systems

Mass Transport and Particle Transport in an LPCVD Process

Active Vibration Control of Flexible Space Structures by Using Piezoelectric Sensors and Actuators

Multiple-Mode Input Shaping Sequences for Reducing Residual Vibrations

Design Considerations for Manufacturability of MEMS Comb Actuators

Removal of Submicron Particles Using High Frequency Ultrasonics

Multivariable Feedback Relevant System Identification of a Wafer Stepper System

Analytical Modeling for Semiconductor Wafer Fab Environments in Support of Drum-Buffer-Rope Implementation

Slurry Residue Removal in Post Chemical Mechanical Polishing

Microfabrication and Characterization of Electro-Thermal-Compliant Micro Devices

Designing a Requirement Driven Product Development Process

Effect of Piezoceramic Hysteresis in Passive and Hybrid Structural Acoustic Control

Design, Development and Characterization of a Wrap Spring Clutch/Brake Mechanism As a Knee Joint for an Assistive Exoskeleton

Direct Label Free Detection of Orchid Virus Using a Micro/Nano Hybrid Structured Biosensor

Genetically Modified Soybean Detection Using a Biosensor Electrode With Self-Assembled Gold Nanoparticles on a Micro Hemisphere Array

Tension-Induced Raman Spectrum Enhanced Phenomena of Graphene Membrane

Characterization of a Non-Interdigitated Comb Drive

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only