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Proceedings Papers

Extraordinary Thermal Conductivity of Graphene: Prospects of Thermal Management Applications

Suchismita Ghosh, Denis L. Nika, Evgenni P. Pokatilov, Irene Calizo, Alexander A. Balandin

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 345-352, August 8–13, 2010

Paper No: IHTC14-22348

DOI: https://doi.org/10.1115/IHTC14-22348

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Topics: Graphene, Thermal conductivity, Thermal management, Temperature, Lasers, Phonons, Carbon, Dimensions, Electromagnetic scattering, Graphite

Proceedings Papers

Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks

Yong-Jiun Lee, Poh-Seng Lee, Siaw-Kiang Chou

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 283-291, August 8–13, 2010

Paper No: IHTC14-23413

DOI: https://doi.org/10.1115/IHTC14-23413

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Topics: Fins, Heat sinks, Microchannels, Silicon

Proceedings Papers

Numerical Analysis of Single Phase Multi Layered Micro-Channel Heat Sink With Inter-Connects Between Vertical Channels

A. K. M. M. Morshed, Jamil A. Khan

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 133-140, August 8–13, 2010

Paper No: IHTC14-22828

DOI: https://doi.org/10.1115/IHTC14-22828

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Topics: Heat sinks, Microchannels, Numerical analysis

Proceedings Papers

Significant Heat Transfer Enhancement in Microchannels With a Segmented Flow of Two Immiscible Liquids

Ashish Asthana, Igor Zinovik, Christian Weinmueller, Dimos Poulikakos

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 141-149, August 8–13, 2010

Paper No: IHTC14-22830

DOI: https://doi.org/10.1115/IHTC14-22830

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Topics: Flow (Dynamics), Heat transfer, Microchannels, Drops, Temperature, Water, Heat, Heat sinks, Cooling, Electronics

Proceedings Papers

Combined Experimental and Numerical Study for Multiple Microchannel Heat Transfer System

Jingru Zhang, Yogesh Jaluria, Tiantian Zhang, Li Jia

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 25-30, August 8–13, 2010

Paper No: IHTC14-22235

DOI: https://doi.org/10.1115/IHTC14-22235

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Topics: Heat transfer, Microchannels, Computer simulation, Steady state, Flow (Dynamics), Temperature, Cooling, Design, Heat, Heat sinks

Proceedings Papers

Mechanism of Critical Heat Flux for Convective Boiling of FC-72 in a Diverging Microchannel Heat Sink

Chun Ting Lu, Chin Pan

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 489-495, August 8–13, 2010

Paper No: IHTC14-22750

DOI: https://doi.org/10.1115/IHTC14-22750

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Topics: Boiling, Critical heat flux, Heat sinks, Microchannels, Flow (Dynamics), Liquid films, Bubbles, Design, Flow visualization, Heat

Proceedings Papers

Boiling Heat Transfer Enhancement by Controllable Tailoring of the TPL

Alexander Ustinov, Jovan Mitrovic

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 245-253, August 8–13, 2010

Paper No: IHTC14-22339

DOI: https://doi.org/10.1115/IHTC14-22339

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Topics: Boiling, Heat transfer, Pins (Engineering), Vapors, Bubbles, Chain, Density, Electrodeposition, Flux (Metallurgy), Heat

Proceedings Papers

Simulation of Fluid Flow and Heat Transfer of Flat Plate Heat Sinks With Spiral Inserts

Ganesh Subbuswamy, Xianchang Li

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 611-618, August 8–13, 2010

Paper No: IHTC14-22898

DOI: https://doi.org/10.1115/IHTC14-22898

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Topics: Flat plates, Fluid dynamics, Heat sinks, Heat transfer, Simulation, Flow (Dynamics), Pressure, Computer cooling, Computer simulation, Pressure drop

Proceedings Papers

Thermal Optimization of Plate-Fin Heat Sinks With Variable Fin Thickness

Dong-Kwon Kim, Jaehoon Jung, Sung Jin Kim

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 517-522, August 8–13, 2010

Paper No: IHTC14-22728

DOI: https://doi.org/10.1115/IHTC14-22728

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Topics: Heat sinks, Optimization

Proceedings Papers

An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Siddharth Bhopte, Seshu B. Desu, Bahgat Sammakia

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 629-635, August 8–13, 2010

Paper No: IHTC14-22918

DOI: https://doi.org/10.1115/IHTC14-22918

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Topics: Electronic systems, Flat heat pipes, Heat flux, Heat, Thermal conductivity, Design, Electronic packages, Thermal management, Carbon, Dimensions

Proceedings Papers

Experimental Performance of Novel Foam and Schwarz Surface Heat Sinks

Domhnaill Hernon

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 431-439, August 8–13, 2010

Paper No: IHTC14-22136

DOI: https://doi.org/10.1115/IHTC14-22136

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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Investment casting (Process)

Proceedings Papers

Analysis and Optimum for Air Cooling Thermal Module Using Dimple Vortex Generators

Kai-Shing Yang, Shu-Lin Li, Ing Youn Chen, Chi-Chuan Wang

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 441-448, August 8–13, 2010

Paper No: IHTC14-22146

DOI: https://doi.org/10.1115/IHTC14-22146

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Topics: Cooling, Generators, Vortices, Geometry, Design, Flow (Dynamics), Heat transfer, Heat conduction, Heat sinks

Proceedings Papers

A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications

Aziz Koyuncuog˘lu, Tuba Okutucu, Haluk Ku¨lah

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 721-724, August 8–13, 2010

Paper No: IHTC14-23212

DOI: https://doi.org/10.1115/IHTC14-23212

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Topics: Complementary metal oxide semiconductors, Cooling, Heat sinks, Metals, Microchannels, Polymers, Design, Flow (Dynamics), Circuits, Coolants

Proceedings Papers

Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

Hemin Hu, Jiahui Zhang, Xiaoze Du, Lijun Yang

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 449-458, August 8–13, 2010

Paper No: IHTC14-22181

DOI: https://doi.org/10.1115/IHTC14-22181

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Topics: Computational fluid dynamics, Computer cooling, Heat sinks

Proceedings Papers

Heat Sink Optimization: A Multi-Parameter Optimization Problem

Nicholas Hansen, Ivan Catton, Feng Zhou

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 649-655, August 8–13, 2010

Paper No: IHTC14-22968

DOI: https://doi.org/10.1115/IHTC14-22968

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Topics: Heat sinks, Optimization, Dimensions, Computer software, Convection, Energy conservation, Momentum

Proceedings Papers

Active Upstream Components for Enhanced Heat Transfer of Longitudinally Finned Heat Sinks

John Daly

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 459-465, August 8–13, 2010

Paper No: IHTC14-22203

DOI: https://doi.org/10.1115/IHTC14-22203

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Topics: Forced convection, Heat sinks, Heat transfer

Proceedings Papers

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

Takashi Fukue, Masaru Ishizuka, Shinji Nakagawa, Tomoyuki Hatakeyama, Wataru Nakayama

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 657-664, August 8–13, 2010

Paper No: IHTC14-22979

DOI: https://doi.org/10.1115/IHTC14-22979

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Topics: Air flow, Electronic equipment, Heat sinks, Heat transfer, Network analysis, Electrical components, Design, Computational fluid dynamics, Design methodology, Flow (Dynamics)

Proceedings Papers

An Experimental Study on the Effect of Configuration of Multiple Microchannels on Heat Removal for Electronic Cooling

Jingru Zhang, Shaurya Prakash, Yogesh Jaluria, Lei Lin

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 473-480, August 8–13, 2010

Paper No: IHTC14-22234

DOI: https://doi.org/10.1115/IHTC14-22234

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Topics: Computer cooling, Heat, Microchannels, Heat sinks, Heat transfer, Manufacturing, Anisotropy, Bonding, Chemical etching, Computer software

Proceedings Papers

Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink

Paul Kalinowski, Edvin Cetegen, Serguei Dessiatoun, John Lawler

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 741-752, August 8–13, 2010

Paper No: IHTC14-23326

DOI: https://doi.org/10.1115/IHTC14-23326

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Topics: Heat sinks, Computational fluid dynamics, Cooling, Engineering prototypes, Engineering simulation, Heat transfer coefficients, Manifolds, Optimization, Pressure drop, Simulation

Proceedings Papers

Compact Heat Sink With Combined Structures of Dimples-Protrusions With Pin-Fins or Micro-Channels: Review, Simulation and Experimental Data

Mikhail Spokoyny, Vladimir Trofimov, Xinliang Qiu, James M. Kerner

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 481-493, August 8–13, 2010

Paper No: IHTC14-22347

DOI: https://doi.org/10.1115/IHTC14-22347

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Topics: Fins, Heat sinks, Microchannels, Simulation, Heat transfer, Reynolds number, Vortices, Computer simulation, Design, Experimental analysis

NARROW

Extraordinary Thermal Conductivity of Graphene: Prospects of Thermal Management Applications

Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks

Numerical Analysis of Single Phase Multi Layered Micro-Channel Heat Sink With Inter-Connects Between Vertical Channels

Significant Heat Transfer Enhancement in Microchannels With a Segmented Flow of Two Immiscible Liquids

Combined Experimental and Numerical Study for Multiple Microchannel Heat Transfer System

Mechanism of Critical Heat Flux for Convective Boiling of FC-72 in a Diverging Microchannel Heat Sink

Boiling Heat Transfer Enhancement by Controllable Tailoring of the TPL

Simulation of Fluid Flow and Heat Transfer of Flat Plate Heat Sinks With Spiral Inserts

Thermal Optimization of Plate-Fin Heat Sinks With Variable Fin Thickness

An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Experimental Performance of Novel Foam and Schwarz Surface Heat Sinks

Analysis and Optimum for Air Cooling Thermal Module Using Dimple Vortex Generators

A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications

Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

Heat Sink Optimization: A Multi-Parameter Optimization Problem

Active Upstream Components for Enhanced Heat Transfer of Longitudinally Finned Heat Sinks

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

An Experimental Study on the Effect of Configuration of Multiple Microchannels on Heat Removal for Electronic Cooling

Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink

Compact Heat Sink With Combined Structures of Dimples-Protrusions With Pin-Fins or Micro-Channels: Review, Simulation and Experimental Data

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