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Proceedings Papers

A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers

Jeremiah N. Mpagazehe, Geo A. Thukalil, C. Fred Higgs, III

Proc. ASME. IJTC2009, ASME/STLE 2009 International Joint Tribology Conference, 27-29, October 19–21, 2009

Paper No: IJTC2009-15205

DOI: https://doi.org/10.1115/IJTC2009-15205

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Topics: Erosion, Physics, Semiconductor wafers, Electrical properties, Integrated circuits, Lubrication, Particulate matter, Polishing

Proceedings Papers

Post-CMP Cleaning Applications

V. Khosla, M. Vinogradov, N. V. Gitis, R. K. Singh, D. W. Stockbower, C. R. Wargo

Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 719-720, October 20–22, 2008

Paper No: IJTC2008-71017

DOI: https://doi.org/10.1115/IJTC2008-71017

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Topics: Adhesion, Contamination, Ethanol, Particulate matter, Polishing, Semiconductor wafers, Stability, Surface roughness

Proceedings Papers

Nano-Scale Tribological Properties of Silicon Pillars With the Variation in Pitch

Duc-Cuong Pham, R. Arvind Singh, Jinseok Kim, Sungwook Yang, Eui-Sung Yoon

Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 115-117, October 20–22, 2008

Paper No: IJTC2008-71289

DOI: https://doi.org/10.1115/IJTC2008-71289

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Topics: Columns (Structural), Nanoscale phenomena, Silicon, Tribology, Adhesion, Friction, Microelectromechanical systems, Nanostructures , Semiconductor wafers

Proceedings Papers

Optimum Roughness for Minimum Adhesion

D.-L. Liu, J. Martin, N. A. Burnham

Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 593-595, October 20–22, 2008

Paper No: IJTC2008-71192

DOI: https://doi.org/10.1115/IJTC2008-71192

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Topics: Adhesion, Surface roughness, Adhesives, Atomic force microscopy, Fractals, Cantilevers, Computer software, Contact mechanics, Microelectromechanical systems, Nanoscale phenomena

Proceedings Papers

On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP

Dinc¸er Bozkaya, Sinan Mu¨ftu¨

Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 557-559, October 20–22, 2008

Paper No: IJTC2008-71122

DOI: https://doi.org/10.1115/IJTC2008-71122

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Topics: Dielectric materials, Fracture (Materials), Fracture (Process), Particulate matter, Polishing, Pressure, Semiconductor wafers

Proceedings Papers

Anisotropic Frictional Behavior of Nanotextured Surfaces

H.-S. Zhang, K. Komvopoulos

Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 749-751, October 20–22, 2008

Paper No: IJTC2008-71146

DOI: https://doi.org/10.1115/IJTC2008-71146

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Topics: Anisotropy, Friction, Atomic force microscopy, Stress, Adhesion, Diamonds, Imaging, Nanoscale phenomena, Semiconductor wafers

Proceedings Papers

Planar Flat Product Transport Using Viscous Traction

Jeroen van Rij, Jasper Wesselingh, Ron A. J. van Ostayen, Jo W. Spronck, Robert H. Munnig Schmidt, Jan van Eijk

Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 355-357, October 20–22, 2008

Paper No: IJTC2008-71153

DOI: https://doi.org/10.1115/IJTC2008-71153

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Topics: Traction, Actuators, Glass, Bearings, Computation, Geometry, Inflow, Outflow, Semiconductor wafers, Stiffness

Proceedings Papers

A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration

Dinc¸er Bozkaya, Sinan Mu¨ftu¨

Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 569-571, October 20–22, 2008

Paper No: IJTC2008-71129

DOI: https://doi.org/10.1115/IJTC2008-71129

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Topics: Porosity, Pressure, Polishing, Dielectric materials, Semiconductor wafers

Proceedings Papers

Effect of Adhesion on Wafer Separation Due to Trapped Particles

Andy Pamp, George G. Adams

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 809-811, October 22–24, 2007

Paper No: IJTC2007-44157

DOI: https://doi.org/10.1115/IJTC2007-44157

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Topics: Adhesion, Particulate matter, Semiconductor wafers, Separation (Technology), Bonding, Nanomanufacturing, Contamination, Elastic plates, Nanoscale devices, Pressure

Proceedings Papers

The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals

Joseph Bonivel, Sarah Biltz, Elon Terrell, Burak Ozdoganlar, C. Fred Higgs, III

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1019-1020, October 22–24, 2007

Paper No: IJTC2007-44488

DOI: https://doi.org/10.1115/IJTC2007-44488

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Topics: Metals, Polishing, Thin films, Semiconductor wafers, Copper, Data storage systems, Integrated circuits, Manufacturing, Mechanical properties, Nanoindentation

Proceedings Papers

Characterization of Titanium and Niobium Doped DLC Films Grown by Pulsed DC PVD: Closed Field Unbalanced Magnetron Sputtering (CFUBMS) Method

Deniz Ugur, Ihsan Efeoglu, Sabri Altintas

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 917-919, October 22–24, 2007

Paper No: IJTC2007-44257

DOI: https://doi.org/10.1115/IJTC2007-44257

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Topics: Diamond films, Sputtering (Irradiation), Titanium, Coatings, Tribology, Adhesion, Carbon, Diamonds, Disks, Glass

Proceedings Papers

Nano Wear of Noble Metals Against Silicon

Luohan Peng, Hong Liang

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 841-843, October 22–24, 2007

Paper No: IJTC2007-44227

DOI: https://doi.org/10.1115/IJTC2007-44227

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Topics: Metals, Silicon, Wear, Atomic force microscopy, Adhesives, Atoms, Crystals, Eutectic alloys, Nanoscale phenomena, Oxidation

Proceedings Papers

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

Joo Hoon Choi, Yangro Lee, Louis E. DeMarco, Richard T. Leveille, Joseph A. Levert, Chad S. Korach

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 749-751, October 22–24, 2007

Paper No: IJTC2007-44383

DOI: https://doi.org/10.1115/IJTC2007-44383

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Topics: Atomic force microscopy, Friction, Polishing, Particulate matter, Scanning probe microscopy, Circuits, Damage, Delamination, Glass, Integrated circuit fabrication

Proceedings Papers

Shear Strength and Durability of Self Assembled Monolayer

Masabumi Masuko, Hiroya Miyamoto, Akihito Suzuki

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 97-99, October 22–24, 2007

Paper No: IJTC2007-44221

DOI: https://doi.org/10.1115/IJTC2007-44221

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Topics: Durability, Self-assembly, Shear strength, Glass, Disks, Semiconductor wafers, Steel, Surface roughness, Tribology

Proceedings Papers

Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing

A. Osorno, S. Tereshko, I. Yoon, S. Danyluk

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1081-1082, October 22–24, 2007

Paper No: IJTC2007-44441

DOI: https://doi.org/10.1115/IJTC2007-44441

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Topics: Dynamics (Mechanics), Polishing, Pressure, Semiconductor wafers, Silicon, Particulate matter, Slurries, Electronics, Integrated circuits, Manufacturing

Proceedings Papers

The Effect of Channelling a Polymeric Surface on Its Adhesion and Friction Characteristics

Duc-Cuong Pham, R. Arvind Singh, Hoon Eui Jeong, Kahp Y. Suh, Eui-Sung Yoon

Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 791-793, October 22–24, 2007

Paper No: IJTC2007-44137

DOI: https://doi.org/10.1115/IJTC2007-44137

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Topics: Adhesion, Friction, Tribology, Lithography, Manufacturing, Microelectromechanical systems, Microscale devices, Nanoelectromechanical systems, Nanoscale phenomena, Polymer films

Proceedings Papers

In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process

Arun Sikder, Norm Gitis, Michael Vinogradov, Antanas Daugela

Proc. ASME. TRIB2004, ASME/STLE 2004 International Joint Tribology Conference, Parts A and B, 55-58, October 24–27, 2004

Paper No: TRIB2004-64346

DOI: https://doi.org/10.1115/TRIB2004-64346

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Topics: Tribology, Signals, Acoustic emissions, Adhesion, Copper, Delamination, Friction, Integrated circuits, Semiconductor wafers, Slurries

Proceedings Papers

Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning

Dedy Ng, Ting-Gang Zhang, Hong Liang

Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 929-937, October 23–25, 2006

Paper No: IJTC2006-12141

DOI: https://doi.org/10.1115/IJTC2006-12141

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Topics: Lubrication, Particulate matter, Adhesion, Atomic force microscopy, Polishing, Theoretical analysis, Drag (Fluid dynamics), Finite element analysis, Fluid films, Fundamental forces (Physics)

Proceedings Papers

Deformation of Bowed Silicon Wafers Due to Applied Pressure and Adhesion

Andy Pamp, George G. Adams

Paper No: IJTC2006-12279

DOI: https://doi.org/10.1115/IJTC2006-12279

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Topics: Adhesion, Deformation, Pressure, Semiconductor wafers, Separation (Technology), Surface energy, Bonding, Elastic plates, Nanomanufacturing, Nanoscale phenomena

Proceedings Papers

A Model for Studying the Hydrodynamic Slurry Behavior in CMP: Discrete and Continuous Phases

Elon Terrell, C. Fred Higgs, III

Paper No: IJTC2006-12229

DOI: https://doi.org/10.1115/IJTC2006-12229

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Topics: Slurries, Particulate matter, Polishing, Semiconductor wafers, Fluids, Kinematics, Manufacturing, Pressing, Shear (Mechanics), Simulation

NARROW

A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers

Post-CMP Cleaning Applications

Nano-Scale Tribological Properties of Silicon Pillars With the Variation in Pitch

Optimum Roughness for Minimum Adhesion

On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP

Anisotropic Frictional Behavior of Nanotextured Surfaces

Planar Flat Product Transport Using Viscous Traction

A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration

Effect of Adhesion on Wafer Separation Due to Trapped Particles

The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals

Characterization of Titanium and Niobium Doped DLC Films Grown by Pulsed DC PVD: Closed Field Unbalanced Magnetron Sputtering (CFUBMS) Method

Nano Wear of Noble Metals Against Silicon

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

Shear Strength and Durability of Self Assembled Monolayer

Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing

The Effect of Channelling a Polymeric Surface on Its Adhesion and Friction Characteristics

In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process

Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning

Deformation of Bowed Silicon Wafers Due to Applied Pressure and Adhesion

A Model for Studying the Hydrodynamic Slurry Behavior in CMP: Discrete and Continuous Phases

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