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Proceedings Papers

Proceedings Volume Cover
ASME 2003 International Mechanical Engineering Congress and Exposition
November 15–21, 2003
Washington, DC, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
0-7918-3714-9
Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology

Electronic and Photonic Packaging

Advanced/Novel Interconnects

Application Specific MEMS/NEMS Packaging and Panel

Critical Issues in Accelerated Life Testing and Field Reliability

Design, Simulation, and Measurement of MEMS Packaging

Fabrication and Testing of MEMS Packaging

General

High Density Interconnects and 3-D Packaging

Influence of Stresses and Defects on Nanoelectronics/MEMS Performance

Lead-Free Solders

Mechanical Reliability of Power Electronic Modules

Micro and Nano Scale Heat Transfer in Electronics

Microelectronics

Nanocomposites and Emerging Materials in Microelectronics

Photonics

Reliability Issues in Nanoelectronics/Nanoelectromechanical Packaging

Cooling of Microelectronics, MEMS, Photonics, and Nano Devices: In Honor of R. C. Chu’s Sustained Contribution to Electronic Cooling

Thermal Transport Issues in Devices and Packaging Technologies

Electrical Systems and Photonic Design

Photonics Packaging — Process and Reliability Issues

Cooling of Microelectronics, MEMS, Photonics, and Nano Devices: In Honor of R. C. Chu’s Sustained Contribution to Electronic Cooling

Topics: Design

Nanotechnology

NanoManufacturing

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