The measurement of the temperature field at the tool-chip interface in machining has been demonstrated. The key elements in the measurement technique are the use of an optically transparent sapphire tool, which has enabled direct images of the tool-chip contact area in the infra-red to be obtained at high spatial and temporal resolution; and radiation intensity measurements in two wavelength windows which have enabled the temperature field to be accurately derived from these intensity values. The principal characteristics of the temperature field such as the variation of temperature with position along the interface and the location of the region of highest temperature are identified. The implications of this measurement to our understanding of the tribology of the tool-chip interface and machining process models are briefly discussed.

This content is only available via PDF.
You do not currently have access to this content.