The focus of this paper is on the system-level cooling of integrated circuits and the effect of various cooling scenarios on the temperature response. Specifically, this paper addresses the thermal response of a system of integrated circuits when the heat sink fin arrangement and the fan location are varied in order to optimize the effects of conduction and forced-convection heat transfer to cool the system.
The Effects of Various Cooling Scenarios on a System of Integrated Circuits
- Views Icon Views
- Share Icon Share
- Search Site
Minter, DL, Pang, YF, & Scott, EP. "The Effects of Various Cooling Scenarios on a System of Integrated Circuits." Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 2. Washington, DC, USA. November 15–21, 2003. pp. 167-173. ASME. https://doi.org/10.1115/IMECE2003-41667
Download citation file: