A numerical fluid flow and heat transfer model is presented in order to study the evaporation characteristics of a stationary thin film liquid-vapor meniscus. The model is used to evaluate the evaporative heat transfer performance of micron-size rectangular channels on the surface of the secondary wick, inside a micro-columnated coherent porous silicon wick design. The shape of the liquid-vapor meniscus in the channel is obtained by solving the Young-Laplace equation, using a surface energy minimizing algorithm. Mass, momentum and energy equations are then solved in the liquid domain using a discrete finite volume method-based approach. The vapor is assumed to be fully saturated and evaporation at the liquid-vapor interface is modeled using kinetic theory. The effect of wall superheat and inlet-liquid subcooling on the rate of evaporation and associated heat transfer from the evaporating meniscus is characterized.
Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure
- Views Icon Views
- Share Icon Share
- Search Site
Dhillon, NS, Cheng, JC, & Pisano, AP. "Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure." Proceedings of the ASME 2011 International Mechanical Engineering Congress and Exposition. Volume 10: Heat and Mass Transport Processes, Parts A and B. Denver, Colorado, USA. November 11–17, 2011. pp. 667-677. ASME. https://doi.org/10.1115/IMECE2011-65057
Download citation file: