For accomplishing ultra-thin micro and nano electromechanical mechanical systems (MEMS / NEMS), we are proposing an approach with substrate-less devices. Instead of fabricating thin devices on regular thickness wafers and thinning down the wafer at the end, the new devices are still fabricated on a thick handling wafer, but are released from them. This is done by means of a sacrificial layer below the device dissolved at the end of the wafer fabrication process. For still achieving sufficient device stiffness, an organic carrier-foil is integrated into the component, resulting in a flexible part with similarities to a macroscopic decal. For avoiding a warping particularly for multilayer devices, a compensation of the film is necessary.

This content is only available via PDF.
You do not currently have access to this content.