For accomplishing ultra-thin micro and nano electromechanical mechanical systems (MEMS / NEMS), we are proposing an approach with substrate-less devices. Instead of fabricating thin devices on regular thickness wafers and thinning down the wafer at the end, the new devices are still fabricated on a thick handling wafer, but are released from them. This is done by means of a sacrificial layer below the device dissolved at the end of the wafer fabrication process. For still achieving sufficient device stiffness, an organic carrier-foil is integrated into the component, resulting in a flexible part with similarities to a macroscopic decal. For avoiding a warping particularly for multilayer devices, a compensation of the film is necessary.
Considerations on Ultra-Thin Substrate-Less Micro and Nano Systems
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Gatzen, HH, Griesbach, T, Wurz, MC, & Rissing, L. "Considerations on Ultra-Thin Substrate-Less Micro and Nano Systems." Proceedings of the ASME 2011 International Mechanical Engineering Congress and Exposition. Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration. Denver, Colorado, USA. November 11–17, 2011. pp. 447-454. ASME. https://doi.org/10.1115/IMECE2011-62916
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