Abstract

Polysilicon (chemically vapor deposited polycrystalline silicon) is the predominant structural material for MEMS products where the components have thicknesses of ten microns or less and minimum feature sizes of one micron or less. Although a corresponding bulk polysilicon manufactured in the same manner does not exist, it is nevertheless important to know whether the size of the manufactured component affects the Young’s modulus and strength of the material. This is still an open question, but there is research underway. A comprehensive survey is not intended here; Sharpe et al. (1997) contains a summary as of the end of 1996. The presentation will discuss recent developments in modulus and strength measurements with emphasis on electrostatic tensile tests.

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