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Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997

Paper No: IMECE1997-0853

DOI: https://doi.org/10.1115/IMECE1997-0853

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Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number

Proceedings Papers

Effectiveness of Open-Cell Metallic Foams for High Power Electronic Cooling

Ashraf-F. Bastawros

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 211-217, November 15–20, 1998

Paper No: IMECE1998-0655

DOI: https://doi.org/10.1115/IMECE1998-0655

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Topics: Computer cooling, Metal foams, Pressure drop, Heat, Cross-flow, Cylinders, Design, Flow (Dynamics), Fluids, Forced convection

Proceedings Papers

Characterization of Electric Fan Noise Generation Due to Blade Geometry

Liliosa-Eyang Cole, Fred Barez

Proc. ASME. IMECE2021, Volume 1: Acoustics, Vibration, and Phononics, V001T01A001, November 1–5, 2021

Paper No: IMECE2021-68201

DOI: https://doi.org/10.1115/IMECE2021-68201

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Topics: Blades, Geometry, Noise (Sound), Sound pressure, Flow (Dynamics), Noise control, Pressure, Rotors, Aerodynamic noise, Computational fluid dynamics

Proceedings Papers

Development of a Topology-Optimized Structure for Electronics Cooling Under Natural Convection Conditions

Yao Song See, Jin Yao Ho, Kai Choong Leong, Teck Neng Wong

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A002, November 1–5, 2021

Paper No: IMECE2021-70712

DOI: https://doi.org/10.1115/IMECE2021-70712

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Topics: Computer cooling, Lasers, Melting, Natural convection, Optimization, Phase change materials, Topology

Proceedings Papers

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Andrzej J. Przekwas, Zhijian Chen, Marek Turowski

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 475-481, November 14–19, 1999

Paper No: IMECE1999-0308

DOI: https://doi.org/10.1115/IMECE1999-0308

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Topics: Aerodynamics, Jets, Microelectronic devices, Modeling, Simulation, Aerodynamic flow, Computational fluid dynamics, Computer cooling, Flow (Dynamics), Fluid mechanics

Proceedings Papers

Analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe

A. Hoelke, H. T. Henderson, F. M. Gerner, M. Kazmierczak

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 53-60, November 14–19, 1999

Paper No: IMECE1999-1062

DOI: https://doi.org/10.1115/IMECE1999-1062

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Topics: Heat pipes, Heat transfer, Micromachining, Silicon, Computer cooling, Ducts, Heat, Heat flux, Microfabrication, Network analysis

Proceedings Papers

Two-Phase Flow in Microchannels

G. Hetsroni, A. Mosyak, Z. Segal

Proc. ASME. IMECE2001, Heat Transfer: Volume 3 — Fluid-Physics and Heat Transfer for Macro- and Micro-Scale Gas-Liquid and Phase-Change Flows, 87-93, November 11–16, 2001

Paper No: IMECE2001/HTD-24204

DOI: https://doi.org/10.1115/IMECE2001/HTD-24204

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Topics: Microchannels, Two-phase flow, Flow (Dynamics), Heat sinks, Temperature, Boiling, Computer cooling, Fluids, Heat transfer, Imaging

Proceedings Papers

Capillary Pumped Loop Heat Spreader for Electronics Cooling

Jaewon Chung, Costas P. Grigoropoulos, Ralph Greif

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 283-290, November 11–16, 2001

Paper No: IMECE2001/HTD-24405

DOI: https://doi.org/10.1115/IMECE2001/HTD-24405

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Topics: Computer cooling, Flat heat pipes

Proceedings Papers

Three-Dimensional Flow and Heat Transfer Calculations in Micro-Channel Heat Exchangers

A. K. Saha, Sumanta Acharya

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 199-208, November 11–16, 2001

Paper No: IMECE2001/HTD-24394

DOI: https://doi.org/10.1115/IMECE2001/HTD-24394

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Topics: Flow (Dynamics), Heat exchangers, Heat transfer, Microchannels, Reynolds number, Cylinders, Friction, Computer cooling, Convection, Cooling

Proceedings Papers

Effects of an Auxiliary Plate Position on Natural Convection in a Vertical Channel With Radiation

Assunta Andreozzi, Oronzio Manca, Biagio Morrone

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 3-12, November 11–16, 2001

Paper No: IMECE2001/HTD-24372

DOI: https://doi.org/10.1115/IMECE2001/HTD-24372

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Topics: Natural convection, Radiation (Physics), Radiative heat transfer, Wall temperature, Emissivity, Rayleigh number, Computer cooling, Heat flux, Heat transfer, Telecommunications

Proceedings Papers

Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers

Ali Heydari, Kathy Russell

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 83-93, November 11–16, 2001

Paper No: IMECE2001/EPP-24710

DOI: https://doi.org/10.1115/IMECE2001/EPP-24710

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Topics: Compression, Computers, Cooling, Refrigeration, Vapors, Compressors, Refrigerants, Condensers (steam plant), Heat exchangers, Clearances (Engineering)

Proceedings Papers

A Mixed Thermal Convection Criteria for a Printed Circuit Board

E. Kehoe, R. Grimes, M. Davies

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 95-103, November 11–16, 2001

Paper No: IMECE2001/EPP-24711

DOI: https://doi.org/10.1115/IMECE2001/EPP-24711

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Topics: Convection, Printed circuit boards, Mixed convection, Cylinders, Electronic systems, Reynolds number, Temperature distribution, Buoyancy, Computer cooling, Cross-flow

Proceedings Papers

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

S. I. Haider, Yogendra K. Joshi, Wataru Nakayama

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 209-218, November 11–16, 2001

Paper No: IMECE2001/HTD-24395

DOI: https://doi.org/10.1115/IMECE2001/HTD-24395

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Topics: Computer cooling, Two-phase flow, Condensers (steam plant), Temperature, Heat transfer coefficients, Condensation, Heat, Heat pipes, Boiling, Fluids

Proceedings Papers

Computation of Natural Convection in Channels With Staggered Pin Fins

Dhanunjay S. Boyalakuntla, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 129-137, November 11–16, 2001

Paper No: IMECE2001/HTD-24386

DOI: https://doi.org/10.1115/IMECE2001/HTD-24386

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Topics: Computation, Computer cooling, Cooling, Design, Electronics, Exterior walls, Finite volume methods, Fins, Flow (Dynamics), Heat flux

Proceedings Papers

Performance Evaluation of Serrated Plate Fins for Under-Carriage Electronics Cooling in Transportation Application

Ibraheem K. Shwaish, Jayathi Y. Murthy, Cristina H. Amon, Diep Bains

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 177-178, November 11–16, 2001

Paper No: IMECE2001/HTD-24391

DOI: https://doi.org/10.1115/IMECE2001/HTD-24391

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Topics: Computer cooling, Fins, Performance evaluation, Railroad passenger cars, Transportation systems, Cooling, Electronics, Heat sinks, Flow (Dynamics), Trains

Proceedings Papers

Microscale Liquid Impingement Cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T. C. Liu, Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 135-140, November 11–16, 2001

Paper No: IMECE2001/MEMS-23820

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23820

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Topics: Impingement cooling, Microelectromechanical systems, Microscale devices, Jets, Water, Computer cooling, Flow (Dynamics), Heat flux, Heat transfer coefficients, Orifices

Proceedings Papers

Emerging Technologies and Research Issues in Nontraditional Manufacturing

Y. Lawrence Yao, Richard N. Smith, Ralph L. Resnick, K. P. Rajurkar, John H. Givens, Warren E. Maher, Bin Wei

Proc. ASME. IMECE2001, Manufacturing Engineering, 469-472, November 11–16, 2001

Paper No: IMECE2001/MED-23352

DOI: https://doi.org/10.1115/IMECE2001/MED-23352

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Topics: Manufacturing, Packaging, Simulation, Electronics, Modeling, Adhesives, Computer cooling, Concurrent engineering, Hardening (Curing), Lamination

Proceedings Papers

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Bahgat Sammakia, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, Sanjeev Sathe

Proc. ASME. IMECE2001, Manufacturing Engineering, 461-463, November 11–16, 2001

Paper No: IMECE2001/MED-23350

DOI: https://doi.org/10.1115/IMECE2001/MED-23350

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Topics: Adhesives, Computer cooling, Computer simulation, Computers, Concurrent engineering, Design, Drilling, Electronic packages, Electronics, Engineering design processes

Proceedings Papers

New Paradigms in Electronics Cooling Engineering

David Copeland

Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 45, November 5–10, 2000

Paper No: IMECE2000-1179

DOI: https://doi.org/10.1115/IMECE2000-1179

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Topics: Computer cooling, Heat sinks, Aluminum, Cooling, Computers, Metals, Electronics, Extruding, Aluminum alloys, Capacitors

Proceedings Papers

Trends and New Paradigms in Electronics Cooling Market and Industry

David Copeland

Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 27, November 5–10, 2000

Paper No: IMECE2000-1173

DOI: https://doi.org/10.1115/IMECE2000-1173

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Topics: Computer cooling, Heat sinks, Cooling, Computers, Aluminum, Copper, Cycles, Density, Design, Electrical measurement

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NARROW

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

Effectiveness of Open-Cell Metallic Foams for High Power Electronic Cooling

Characterization of Electric Fan Noise Generation Due to Blade Geometry

Development of a Topology-Optimized Structure for Electronics Cooling Under Natural Convection Conditions

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe

Two-Phase Flow in Microchannels

Capillary Pumped Loop Heat Spreader for Electronics Cooling

Three-Dimensional Flow and Heat Transfer Calculations in Micro-Channel Heat Exchangers

Effects of an Auxiliary Plate Position on Natural Convection in a Vertical Channel With Radiation

Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers

A Mixed Thermal Convection Criteria for a Printed Circuit Board

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

Computation of Natural Convection in Channels With Staggered Pin Fins

Performance Evaluation of Serrated Plate Fins for Under-Carriage Electronics Cooling in Transportation Application

Microscale Liquid Impingement Cooling

Emerging Technologies and Research Issues in Nontraditional Manufacturing

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

New Paradigms in Electronics Cooling Engineering

Trends and New Paradigms in Electronics Cooling Market and Industry

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