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Proceedings Papers

Multi-Level Polysilicon Surface-Micromachining Technology: Applications and Issues

Jeffry J. Sniegowski
Proc. ASME. IMECE96, Aerospace, 751-759, November 17–22, 1996
Paper No: IMECE1996-0691
https://doi.org/10.1115/IMECE1996-0691
View Paper titled, Multi-Level Polysilicon Surface-Micromachining Technology: Applications and Issues
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Topics: Micromachining, Polysilicon, Manufacturing, Microelectromechanical systems, Circuits, Etching, Polishing, Semiconductor wafers
Proceedings Papers

Design Techniques for Minimizing Manufacturing Variations in Surface Micromachined Accelerometers

Stephen F. Bart, Howard R. Samuels
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 427-433, November 17–22, 1996
Paper No: IMECE1996-1385
https://doi.org/10.1115/IMECE1996-1385
View Paper titled, Design Techniques for Minimizing Manufacturing Variations in Surface Micromachined Accelerometers
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Topics: Accelerometers, Engineering design processes, Manufacturing, Micromachining, Etching, Capacitors, Design, Dimensions, Geometry, Sensors
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
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Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Fabrication of Surface-Micromachined Polysilicon Microactuators Using HF Gas-Phase Etching Process

Jong Hyun Lee, Kyung Ho Park, Chun Su Lee, Jong Tae Baek, Chang-Jin Kim, Hyung Joun Yoo
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 373-377, November 17–22, 1996
Paper No: IMECE1996-1377
https://doi.org/10.1115/IMECE1996-1377
View Paper titled, Fabrication of Surface-Micromachined Polysilicon Microactuators Using HF Gas-Phase Etching Process
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Topics: Etching, Manufacturing, Microactuators, Micromachining, Polysilicon, Chemical etching, Stiction, Stress, Thin films, Vapors
Proceedings Papers

Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes

Masato Ikegawa
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 183, November 17–22, 1996
Paper No: IMECE1996-1044
https://doi.org/10.1115/IMECE1996-1044
View Paper titled, Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes
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Topics: Flow (Dynamics), Heat transfer, Integrated circuit fabrication, Semiconductor wafers, Manufacturing, Particulate matter, Chemical reactions, Chemical vapor deposition, Contamination, Etching
Proceedings Papers

Projection Micromachining of Polyimide Thin Films by an Excimer Laser

X. Zhang, C. P. Grigoropoulos, D. J. Krajnovich, A. C. Tam
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 45-54, November 17–22, 1996
Paper No: IMECE1996-1029
https://doi.org/10.1115/IMECE1996-1029
View Paper titled, Projection Micromachining of Polyimide Thin Films by an Excimer Laser
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Topics: Excimer lasers, Micromachining, Thin films, Etching, Ablation (Vaporization technology), Lasers, Atomic force microscopy, Fluence (Radiation measurement), Resolution (Optics), Absorption
Proceedings Papers

Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process

Pallavi Sharma, Matthias Pleil, Nathan Jackson
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A012, October 30–November 3, 2022
Paper No: IMECE2022-92967
https://doi.org/10.1115/IMECE2022-92967
View Paper titled, Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process
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Topics: Etching, Flow (Dynamics), Reactive-ion etching, Silicon, Cooling, Cycles, Corners (Structural elements), Energy dissipation, Gas flow, Heat
Proceedings Papers

Fabrication and Testing of a Multilayer Silicon Fluidic Laminar Proportional Amplifier

Brett H. Piekarski, Robert J. Zeto, Steve M. Tenney, Matthew H. Ervin
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 97-101, November 15–20, 1998
Paper No: IMECE1998-1228
https://doi.org/10.1115/IMECE1998-1228
View Paper titled, Fabrication and Testing of a Multilayer Silicon Fluidic Laminar Proportional Amplifier
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Topics: Manufacturing, Silicon, Testing, Design, Stainless steel, Etching, Flow (Dynamics), Laminates, Milling, Photolithography
Proceedings Papers

Anisotropic Crystalline Etching Simulation Using a Continuous Cellular Automata Algorithm

Zhenjun Zhu, Chang Liu
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 577-582, November 15–20, 1998
Paper No: IMECE1998-1303
https://doi.org/10.1115/IMECE1998-1303
View Paper titled, Anisotropic Crystalline Etching Simulation Using a Continuous Cellular Automata Algorithm
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Topics: Algorithms, Anisotropy, Etching, Simulation
Proceedings Papers

Fabrication of 109.5° Micro V-Grooves Using a Two-Step Anisotropic Etching Technique

Wen-Tien Chang Chien, Liwei Lin, Yi-Chung Lo, Chia-Ou Chang
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 361-364, November 15–20, 1998
Paper No: IMECE1998-1269
https://doi.org/10.1115/IMECE1998-1269
View Paper titled, Fabrication of 109.5° Micro V-Grooves Using a Two-Step Anisotropic Etching Technique
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Topics: Anisotropy, Etching, Manufacturing, Shapes, Design, Microelectromechanical systems, Semiconductor wafers
Proceedings Papers

Design, Testing, and Simulation of Microscale Gas Chromatography Columns

Mary L. Hudson, Richard Kottenstette, Carolyn M. Matzke, Greg C. Frye-Mason, Kim A. Shollenberger, Doug R. Adkins, C. Channy Wong
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 207-214, November 15–20, 1998
Paper No: IMECE1998-1244
https://doi.org/10.1115/IMECE1998-1244
View Paper titled, Design, Testing, and Simulation of Microscale Gas Chromatography Columns
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Topics: Design, Gas chromatography, Microscale devices, Simulation, Testing, Resolution (Optics), Chemistry, Dimensions, Etching, Plates (structures)
Proceedings Papers

Microfluidics of a Planar Microfabricated Fluid Filter

Yit-shun Leung Ki, Didier Maillefer, Gilles Rey-Mermet, Peter A. Monkewitz, Philippe Renaud, Harald T. G. van Lintel
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 165-170, November 15–20, 1998
Paper No: IMECE1998-1238
https://doi.org/10.1115/IMECE1998-1238
View Paper titled, Microfluidics of a Planar Microfabricated Fluid Filter
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Topics: Filters, Fluids, Microfabrication, Microfluidics, Design, Filtration, Flow (Dynamics), Micromachining, Pumps, Silicon
Proceedings Papers

Genetic Algorithms in MEMS Synthesis

Hui Li, Erik K. Antonsson
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 299-303, November 15–20, 1998
Paper No: IMECE1998-1258
https://doi.org/10.1115/IMECE1998-1258
View Paper titled, Genetic Algorithms in MEMS Synthesis
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Topics: Genetic algorithms, Microelectromechanical systems, Shapes, Manufacturing, Simulation, Etching
Proceedings Papers

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Haruna Tada, Ioannis N. Miaoulis, Peter Y. Wong
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 37-44, November 15–20, 1998
Paper No: IMECE1998-1221
https://doi.org/10.1115/IMECE1998-1221
View Paper titled, Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers
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Topics: Computer simulation, Microcantilevers, Semiconductor wafers, Etching, Temperature gradient, Emissivity, Separation (Technology), Temperature, Thin films, Design
Proceedings Papers

A Micro-Actuator for a Hard-Disk Drive Fine Tracking Servo

Toshiki Hirano, Long-Sheng Fan, Wen Y. Lee, John Hong, Tetsuo Semba, Wayne Imaino, Surya Pattanaik, Susanna Chan, Patrick Webb
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 253-260, November 15–20, 1998
Paper No: IMECE1998-1250
https://doi.org/10.1115/IMECE1998-1250
View Paper titled, A Micro-Actuator for a Hard-Disk Drive Fine Tracking Servo
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Topics: Disks, Microactuators, Servomechanisms, Design, Control equipment, Manufacturing, Stiffness, Density, Electrodeposition, Errors
Proceedings Papers

Self-Assembled Microslider for Microjoinery

L.-S. Huang, B. Sridharan, C.-J. Kim, S. D. Collins, C. González, R. L. Smith
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 499-504, November 15–20, 1998
Paper No: IMECE1998-1291
https://doi.org/10.1115/IMECE1998-1291
View Paper titled, Self-Assembled Microslider for Microjoinery
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Topics: Self-assembly, Manufacturing, Semiconductor wafers, Bonding, Etching, Anisotropy, Clearances (Engineering), Friction, Micromachining, Polishing
Proceedings Papers

A Study on the Effects of Surface Roughness on the Strength of Single Lap Joints

Erol Sancaktar, Rajesh Gomatam
Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 91-111, November 15–20, 1998
Paper No: IMECE1998-1121
https://doi.org/10.1115/IMECE1998-1121
View Paper titled, A Study on the Effects of Surface Roughness on the Strength of Single Lap Joints
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Topics: Surface roughness, Adhesives, Abrasion, Adhesion, Boundary layers, Cavities, Etching, Surface finishing, Viscosity, Wetting
Proceedings Papers

Correlation of Fracture Initiation for Microscale Structures: Free-Standing Silicon and Silicon/Glass Interfaces

Martin L. Dunn, Wan Suwito, Paul E. W. Labossiere, Shawn J. Cunningham
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 157, November 15–20, 1998
Paper No: IMECE1998-1154
https://doi.org/10.1115/IMECE1998-1154
View Paper titled, Correlation of Fracture Initiation for Microscale Structures: Free-Standing Silicon and Silicon/Glass Interfaces
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Topics: Fracture (Materials), Fracture (Process), Glass, Microscale devices, Silicon, Stress, Etching, Semiconductor wafers, Anisotropy, Bending (Stress)
Proceedings Papers

Structure and Behavior of Materials for Micromechanical Devices

Peter Krulevitch, Kirk P. Seward, Harold D. Ackler, George C. Johnson, Roger T. Howe
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 131-133, November 15–20, 1998
Paper No: IMECE1998-1146
https://doi.org/10.1115/IMECE1998-1146
View Paper titled, Structure and Behavior of Materials for Micromechanical Devices
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Topics: Buckling, Crystallization, Electron microscopy, Etching, Fatigue, Film thickness, Fracture (Materials), Fracture (Process), Mechanical behavior, Microactuators
Proceedings Papers

Technology and System Challenges for 300 mm Metal and Polysilicon Plasma Etch

James Papanu, Peter Loewenhardt, Dale Olson, Arnold Kholodenko
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 839-843, November 15–20, 1998
Paper No: IMECE1998-1099
https://doi.org/10.1115/IMECE1998-1099
View Paper titled, Technology and System Challenges for 300 mm Metal and Polysilicon Plasma Etch
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Topics: Etching, Metals, Plasmas (Ionized gases), Polysilicon, Design, Semiconductor wafers, Fluid dynamics, Hardware, Simulation