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Proceedings Papers

Effects of Loading Frequencies on Fatigue Strength of Aluminum 6061-T6

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A012, October 30–November 3, 2022

Paper No: IMECE2022-94129

DOI: https://doi.org/10.1115/IMECE2022-94129

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Topics: Aluminum, Fatigue failure, Fatigue life, Fatigue strength, Stress

Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997

Paper No: IMECE1997-0822

DOI: https://doi.org/10.1115/IMECE1997-0822

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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure

Proceedings Papers

Comparison of Different Solder Systems Based on Propensity for Damage

Vijay Sarihan

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 243-248, November 16–21, 1997

Paper No: IMECE1997-0823

DOI: https://doi.org/10.1115/IMECE1997-0823

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Topics: Damage, Solders, Stress, Temperature, Cycles, Fatigue, Fatigue life, Finite element methods, Alloys, Eutectic alloys

Proceedings Papers

Experimental Study of the Pre-Stressing Capability Through Residual Stress Generation in Superfinish Machining of Hardened Steel

C. R. Liu, S. R. Agha

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 197-207, November 16–21, 1997

Paper No: IMECE1997-1093

DOI: https://doi.org/10.1115/IMECE1997-1093

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Topics: Machining, Martensitic steel, Stress, Finishes, Fatigue life, Grinding, Turning, Compressive stress, Diamonds, Fatigue

Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997

Paper No: IMECE1997-1120

DOI: https://doi.org/10.1115/IMECE1997-1120

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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design

Proceedings Papers

Fatigue Damage of Glass/Vinyl Ester Thick Composites

A. Haque, J. Johnson, U. K. Vaidya, S. Jeelani

Proc. ASME. IMECE97, Noise Control and Acoustics, 247-257, November 16–21, 1997

Paper No: IMECE1997-1051

DOI: https://doi.org/10.1115/IMECE1997-1051

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Topics: Composite materials, Ester, Fatigue damage, Glass, Compression, Laminates, Failure, Acoustic emissions, Compressive strength, Cycles

Proceedings Papers

Fatigue Behavior of Resin Infusion Processed S2-Glass Woven Composites

Ajit D. Kelkar, J. Sankar, Pramod Chaphalkar, C. Grace, S. N. Yarmolenko, Shankar Mall, U. K. Vaidya

Proc. ASME. IMECE97, Noise Control and Acoustics, 243-246, November 16–21, 1997

Paper No: IMECE1997-1050

DOI: https://doi.org/10.1115/IMECE1997-1050

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Topics: Fatigue, Glass, Resins, Woven composites, Composite materials, Cycles, Transfer molding, Tension, Armor, Damage

Proceedings Papers

Ballistic and Damping Characteristics of ECPE/Glass Hybrid Composites

Ashok Bhatnagar, Madhu Rammoorthy, Raymond Glaser, Chandrasekhar V. Nori, P. Raju Mantena

Proc. ASME. IMECE97, Noise Control and Acoustics, 215-225, November 16–21, 1997

Paper No: IMECE1997-1047

DOI: https://doi.org/10.1115/IMECE1997-1047

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Topics: Composite materials, Damping, Glass, Vehicles, Metals, Vehicle armor, Armor, Bullets, Chain, Engines

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997

Paper No: IMECE1997-1209

DOI: https://doi.org/10.1115/IMECE1997-1209

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Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997

Paper No: IMECE1997-0500

DOI: https://doi.org/10.1115/IMECE1997-0500

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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Sam Y. Zamrik, Mark L. Renauld

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 333-345, November 16–21, 1997

Paper No: IMECE1997-0549

DOI: https://doi.org/10.1115/IMECE1997-0549

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Topics: Fatigue life, Gas turbines, Thermomechanics, Cycles, Temperature, Creep, Fatigue, Nickel, Superalloys

Proceedings Papers

An Experimental Investigation in High Temperature Fatigue of MMCs

C. DeLalla, H. Nayeb-Hashemi, H. E. M. Sallam

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 133-140, November 16–21, 1997

Paper No: IMECE1997-0530

DOI: https://doi.org/10.1115/IMECE1997-0530

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Topics: Fatigue, High temperature, Metal matrix composites, Temperature, Damage, Fracture (Materials), Fatigue properties, Particulate matter, Fatigue life, Stress

Proceedings Papers

Failure Mechanism of Metallization Layer of a Multichip Module Substrate

Mansur Rastani

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 469-475, November 16–21, 1997

Paper No: IMECE1997-0703

DOI: https://doi.org/10.1115/IMECE1997-0703

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Topics: Failure mechanisms, Multi-chip modules, Silicon, Temperature, Aluminum, Failure, Fatigue, Fatigue life, Finite element analysis, Metals

Proceedings Papers

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Ramesh Talreja

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 151-156, November 16–21, 1997

Paper No: IMECE1997-0659

DOI: https://doi.org/10.1115/IMECE1997-0659

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Topics: Composite materials, Damage mechanics, Durability, Creep, Damage, Fatigue life, Geometry, Metals, Testing

Proceedings Papers

Fatigue Life Prediction of an Orthotropic 6061-Aluminum Under Proportional and Nonproportional Loading

H. Nayeb-Hashemi, H. Lin

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 107-119, November 15–20, 1998

Paper No: IMECE1998-1143

DOI: https://doi.org/10.1115/IMECE1998-1143

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Topics: Aluminum, Fatigue life, Anisotropy, Constitutive equations, Aluminum alloys, Cracking (Materials), Dislocations, Fatigue, Fracture (Process), Hardening

Proceedings Papers

Piezoceramic Active Vibration Suppression System B-1B Flight Demonstration

Charles R. Larson, Eric Falangas, Melvin Weiss, Ratnakar R. Neurgoankar, Jeffrey G. Nelson, Joseph S. Rosenthal, Demetrious G. Zaferis, Stephen F. McGrath

Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 157-166, November 15–20, 1998

Paper No: IMECE1998-0949

DOI: https://doi.org/10.1115/IMECE1998-0949

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Topics: Flight, Piezoelectric ceramics, Vibration suppression, Aircraft, Actuators, Vibration, Design, Skin, Electrical wires, Hardware

Proceedings Papers

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Anand M. Deshpande, Ganesh Subbarayan, Dan Rose

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 767-777, November 15–20, 1998

Paper No: IMECE1998-1091

DOI: https://doi.org/10.1115/IMECE1998-1091

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Topics: Reliability, Solder joints, Design, Artificial neural networks, Computers, Fatigue life, Interferometry, Neural network models, Sands

Proceedings Papers

Mechanistically-Based Fracture Mechanics Models for the Prediction of Multiple Semi-Elliptical Crack Growth in Q1N (HY80) Pressure Vessel Steel Under Fatigue Loading

W. O. Soboyejo, J. F. Knott

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 67-77, November 15–20, 1998

Paper No: IMECE1998-1141

DOI: https://doi.org/10.1115/IMECE1998-1141

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Topics: Fatigue, Fracture (Materials), Fracture mechanics, Pressure vessels, Steel, Fatigue cracks, Fatigue life

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NARROW

Effects of Loading Frequencies on Fatigue Strength of Aluminum 6061-T6

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Comparison of Different Solder Systems Based on Propensity for Damage

Experimental Study of the Pre-Stressing Capability Through Residual Stress Generation in Superfinish Machining of Hardened Steel

CBGA Solder Fillet Shape Prediction and Design Optimization

Fatigue Damage of Glass/Vinyl Ester Thick Composites

Fatigue Behavior of Resin Infusion Processed S2-Glass Woven Composites

Ballistic and Damping Characteristics of ECPE/Glass Hybrid Composites

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Shearing Deformation in Partial Areal Arrays: Analytical Results

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

An Experimental Investigation in High Temperature Fatigue of MMCs

Failure Mechanism of Metallization Layer of a Multichip Module Substrate

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Fatigue Life Prediction of an Orthotropic 6061-Aluminum Under Proportional and Nonproportional Loading

Piezoceramic Active Vibration Suppression System B-1B Flight Demonstration

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Mechanistically-Based Fracture Mechanics Models for the Prediction of Multiple Semi-Elliptical Crack Growth in Q1N (HY80) Pressure Vessel Steel Under Fatigue Loading

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