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Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Paper No: IMECE1997-0817
DOI: https://doi.org/10.1115/IMECE1997-0817
View Paper titled, Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs
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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)
Proceedings Papers

A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions

X. D. Wang, C. M. Agrawal
Proc. ASME. IMECE97, Advances in Bioengineering, 323-324, November 16–21, 1997
Paper No: IMECE1997-0359
DOI: https://doi.org/10.1115/IMECE1997-0359
View Paper titled, A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions
Click here to open pdf in another window PDF for A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions
Topics: Biomaterials, Bone, Fracture toughness, Orthopedics, Artificial limbs, Bonding, Cements (Adhesives), Dental materials, Fracture mechanics, Numerical analysis
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Paper No: IMECE1997-0515
DOI: https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997
Paper No: IMECE1997-0506
DOI: https://doi.org/10.1115/IMECE1997-0506
View Paper titled, Investigation of Underfill Adhesion in Plastic Flip-Chip Packages
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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
DOI: https://doi.org/10.1115/IMECE1997-0508
View Paper titled, Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
Click here to open pdf in another window PDF for Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997
Paper No: IMECE1997-0497
DOI: https://doi.org/10.1115/IMECE1997-0497
View Paper titled, Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications
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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997
Paper No: IMECE1997-0501
DOI: https://doi.org/10.1115/IMECE1997-0501
View Paper titled, Potential Failure Sites in a Flip-Chip Package With and Without Underfill
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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis
Proceedings Papers

Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature

Youri Lenets, James P. Thomas, Theodore Nicholas
Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 315-321, November 16–21, 1997
Paper No: IMECE1997-0547
DOI: https://doi.org/10.1115/IMECE1997-0547
View Paper titled, Sustained-Load Cracking in Mill Annealed Ti-6Al-4V at Room Temperature
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Topics: Cracking (Materials), Fracture (Process), Stress, Temperature, Fracture (Materials), Diffusion processes, Fatigue, Forging, Fracture mechanics, Hydrogen
Proceedings Papers

Stub-Sill Tank Car Damage Tolerance Analysis Full-Scale Validation Test

Keith B. Smith, Joseph W. Cardinal, Peter C. McKeighan
Proc. ASME. IMECE97, Rail Transportation, 43-48, November 16–21, 1997
Paper No: IMECE1997-0592
DOI: https://doi.org/10.1115/IMECE1997-0592
View Paper titled, Stub-Sill Tank Car Damage Tolerance Analysis Full-Scale Validation Test
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Topics: Damage, Railway tank cars, Tolerance analysis, Fatigue, Fracture mechanics, Inspection
Proceedings Papers

High Strain Rate Normal Indentation of Ceramics: Implications for Material Removal Mechanisms

Ghatu Subhash, Brian J. Koeppel, Richard J. Anton, Yonggang Y. Huang, Abhijit Chandra
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 417-424, November 16–21, 1997
Paper No: IMECE1997-0695
DOI: https://doi.org/10.1115/IMECE1997-0695
View Paper titled, High Strain Rate Normal Indentation of Ceramics: Implications for Material Removal Mechanisms
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Topics: Ceramics, Dynamic testing (Materials), Cracking (Materials), Failure, Fracture (Process), Fracture mechanics, Grinding, Stress
Proceedings Papers

Process Modeling and Interfacial Behavior in the VSPA Package

Richard Harries, Suresh Sitaraman
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 293-299, November 16–21, 1997
Paper No: IMECE1997-0676
DOI: https://doi.org/10.1115/IMECE1997-0676
View Paper titled, Process Modeling and Interfacial Behavior in the VSPA Package
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Topics: Delamination, Electronic packages, Failure mechanisms, Finite element model, Fracture (Materials), Fracture mechanics, Geometry, Manufacturing, Materials properties, Modeling
Proceedings Papers

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Jeung Sang Go, Young-Ho Cho
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 357-360, November 15–20, 1998
Paper No: IMECE1998-1268
DOI: https://doi.org/10.1115/IMECE1998-1268
View Paper titled, Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging
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Topics: Cavities, Design, MEMS packaging, Semiconductor wafers, Bonding, Plates (structures), Pressure, Design methodology, Failure, Finite element analysis
Proceedings Papers

Crack Linkup at Multiple Site Damage

L. Ma, A. S. Kobayashi, S. N. Atluri, P. W. Tan
Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 1-2, November 15–20, 1998
Paper No: IMECE1998-0354
DOI: https://doi.org/10.1115/IMECE1998-0354
View Paper titled, Crack Linkup at Multiple Site Damage
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Topics: Damage, Fracture (Materials), Stress, Collapse, Displacement, Aircraft, Aluminum, Design, Fasteners, Fatigue
Proceedings Papers

Potential Effects of Micromechanical Stresses on the Failure Initiation in Composite Laminates

N. J. Pagano, F. G. Yuan
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 163-164, November 15–20, 1998
Paper No: IMECE1998-1156
DOI: https://doi.org/10.1115/IMECE1998-1156
View Paper titled, Potential Effects of Micromechanical Stresses on the Failure Initiation in Composite Laminates
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Topics: Composite materials, Failure, Laminates, Stress, Fibers, Failure mechanisms, Boundary-value problems, Delamination, Elasticity, Modeling
Proceedings Papers

A Generalized Self-Consistent Method for Osteonal Cortical Bone Modeling

X. Edward Guo, X. Neil Dong, Y. Young Huang
Proc. ASME. IMECE98, Advances in Bioengineering, 271-272, November 15–20, 1998
Paper No: IMECE1998-0135
DOI: https://doi.org/10.1115/IMECE1998-0135
View Paper titled, A Generalized Self-Consistent Method for Osteonal Cortical Bone Modeling
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Topics: Bone, Modeling, Composite materials, Fibers, Damage mechanics, Mechanical properties, Microcracks, Bone mechanics, Elasticity, Fracture mechanics
Proceedings Papers

Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method

M. Ostoja-Starzewski, Ahmed Al-Ostaz, I. Jasiuk
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 287-288, November 15–20, 1998
Paper No: IMECE1998-1208
DOI: https://doi.org/10.1115/IMECE1998-1208
View Paper titled, Cracking of Plates With Randomly Distributed Holes by a Maximum Entropy Method
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Topics: Entropy, Fracture (Process), Plates (structures), Fracture (Materials), Aluminum, Brittleness, Damage, Electromagnetic scattering, Epoxy adhesives, Epoxy resins
Proceedings Papers

The Mechanics of Composite Strength Evolution: Concepts and Applications

Ken Reifsnider
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 173-174, November 15–20, 1998
Paper No: IMECE1998-1161
DOI: https://doi.org/10.1115/IMECE1998-1161
View Paper titled, The Mechanics of Composite Strength Evolution: Concepts and Applications
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Topics: Composite materials, Fracture (Materials), Stress, Fracture (Process), Strength (Materials), Damage, Fibers, Brittleness, Deformation, Diffusion (Physics)
Proceedings Papers

The Fracture Mechanics of Microelectromechanical Systems

Roberto Ballarini
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 185, November 15–20, 1998
Paper No: IMECE1998-1165
DOI: https://doi.org/10.1115/IMECE1998-1165
View Paper titled, The Fracture Mechanics of Microelectromechanical Systems
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Topics: Fracture mechanics, Microelectromechanical systems, Fatigue cracks, Fracture toughness, Stress corrosion cracking
Proceedings Papers

Crack Propagating in a Bimaterial Functionally Graded Multilayered Composite Media

Sandeep Muju
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 231-232, November 15–20, 1998
Paper No: IMECE1998-1184
DOI: https://doi.org/10.1115/IMECE1998-1184
View Paper titled, Crack Propagating in a Bimaterial Functionally Graded Multilayered Composite Media
Click here to open pdf in another window PDF for Crack Propagating in a Bimaterial Functionally Graded Multilayered Composite Media
Topics: Composite materials, Fracture (Materials), Stress, Anisotropy, Flamelet generated manifold, Functionally graded materials, Materials properties, Approximation, Eigenfunctions, Eigenvalues
Proceedings Papers

Mechanistically-Based Fracture Mechanics Models for the Prediction of Multiple Semi-Elliptical Crack Growth in Q1N (HY80) Pressure Vessel Steel Under Fatigue Loading

W. O. Soboyejo, J. F. Knott
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 67-77, November 15–20, 1998
Paper No: IMECE1998-1141
DOI: https://doi.org/10.1115/IMECE1998-1141
View Paper titled, Mechanistically-Based Fracture Mechanics Models for the Prediction of Multiple Semi-Elliptical Crack Growth in Q1N (HY80) Pressure Vessel Steel Under Fatigue Loading
Click here to open pdf in another window PDF for Mechanistically-Based Fracture Mechanics Models for the Prediction of Multiple Semi-Elliptical Crack Growth in Q1N (HY80) Pressure Vessel Steel Under Fatigue Loading
Topics: Fatigue, Fracture (Materials), Fracture mechanics, Pressure vessels, Steel, Fatigue cracks, Fatigue life