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Proceedings Papers

Implementation of the Latest Breakthrough in the Physics of Materials in Metal Cutting: Analysis and Preliminary Results

Viktor P. Astakhov, A. A. Komarovskiy
Proc. ASME. IMECE99, Manufacturing Science and Engineering, 319-326, November 14–19, 1999
Paper No: IMECE1999-0688
DOI: https://doi.org/10.1115/IMECE1999-0688
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Topics: Metal cutting, Physics, Cutting, Databases, Deformation, Energy consumption, Equations of state, Fracture (Materials), Fracture (Process), Machinability
Proceedings Papers

High Density Through-Wafer Electrical Interconnects for Direct-Chip-Attach, Device-Scale MEMS Packaging

Jordan Neysmith, Daniel F. Baldwin
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 595-599, November 5–10, 2000
Paper No: IMECE2000-1151
DOI: https://doi.org/10.1115/IMECE2000-1151
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Topics: Density, MEMS packaging, Semiconductor wafers, Solders, Complementary metal oxide semiconductors, Manufacturing, Metallurgy, Signals
Proceedings Papers

Force Control Method of Soft Actuator Using Multiple Super Elastic Alloy Wires

Shun Aizawa, Taichi Nozawa, Atsushi Sakuma
Proc. ASME. IMECE2017, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Structural Health Monitoring and Prognosis, V009T12A033, November 3–9, 2017
Paper No: IMECE2017-70709
DOI: https://doi.org/10.1115/IMECE2017-70709
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Topics: Actuators, Alloys, Force control, Wire, Deformation, Seas, Control equipment, Heating and cooling, Phase transitions, Design
Proceedings Papers

Development of a Thermo-Metallurgical Model to Predict Heating and Austenitization of 22MnB5 for Hot Forming Die Quenching

M. Verma, J. R. Culham, M. Di Ciano, K. J. Daun
Proc. ASME. IMECE2017, Volume 8: Heat Transfer and Thermal Engineering, V008T10A057, November 3–9, 2017
Paper No: IMECE2017-71013
DOI: https://doi.org/10.1115/IMECE2017-71013
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Topics: Heating, Quenching (Metalworking), Blanks, Furnaces, Rollers, Hearths, Steel, Temperature, Latent heat, Metallurgy
Proceedings Papers

Dynamic and Controlled Tuning of the Boiling Curve During Quenching

Arjang Shahriari, Mark Hermes, Vaibhav Bahadur
Proc. ASME. IMECE2016, Volume 8: Heat Transfer and Thermal Engineering, V008T10A016, November 11–17, 2016
Paper No: IMECE2016-65866
DOI: https://doi.org/10.1115/IMECE2016-65866
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Topics: Boiling, Quenching (Metalworking), Heat transfer, Vapors, Cooling, Fluids, Metals, Wetting, Cycles, Downtime
Proceedings Papers

A Finite Element Analysis for Thermal Analysis of Laser Cladding of Mild Steel With P420 Steel Powder

Navid Nazemi, Jill Urbanic
Proc. ASME. IMECE2016, Volume 2: Advanced Manufacturing, V002T02A073, November 11–17, 2016
Paper No: IMECE2016-65654
DOI: https://doi.org/10.1115/IMECE2016-65654
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Topics: Cladding systems (Building), Finite element analysis, Lasers, Steel, Thermal analysis, Temperature, Metallurgy, Alloys, Carbon, Computer simulation
Proceedings Papers

Two-Scale Thermo-Crystal Plasticity Finite Element Analysis of Dynamic-Recrystallization Texture Evolution

Yuhei Ueda, Yu Goto, Toshihiko Yamaguchi, Yoshihiro Tomita, Yusuke Morita, Eiji Nakamachi
Proc. ASME. IMECE2016, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T11A017, November 11–17, 2016
Paper No: IMECE2016-66437
DOI: https://doi.org/10.1115/IMECE2016-66437
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Topics: Crystals, Finite element analysis, Plasticity, Recrystallization, Texture (Materials), Heat, Aluminum alloys, Anisotropy, Compression, Deformation
Proceedings Papers

A Comparison of the Processing Routes on the Properties of Mg Reinforced With Nanosize MgO

C. S. Goh, J. Wei, M. Gupta
Proc. ASME. IMECE2009, Volume 14: Processing and Engineering Applications of Novel Materials, 289-292, November 13–19, 2009
Paper No: IMECE2009-10570
DOI: https://doi.org/10.1115/IMECE2009-10570
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Topics: Mechanical properties, Metallurgy, Nanoparticles, Particulate matter, Powder metallurgy, Tensile strength
Proceedings Papers

High Temperature SiC Power Module Packaging

Brian Rowden, Alan Mantooth, Simon Ang, Alex Lostetter, Jared Hornberger, Brice McPherson
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 85-90, November 13–19, 2009
Paper No: IMECE2009-12883
DOI: https://doi.org/10.1115/IMECE2009-12883
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Topics: High temperature, Packaging, Tension-leg platforms, Bonding, Silicon, Temperature, Blocks (Building materials), Bridges (Structures), Circuits, Distributed power generation
Proceedings Papers

Failure of Three Cementless Modular Total Hip Arthroplasty Prostheses: A Retrieval Analysis

Manish Paliwal, D. Gordon Allan, Peter Filip
Proc. ASME. IMECE2008, Volume 2: Biomedical and Biotechnology Engineering, 97-105, October 31–November 6, 2008
Paper No: IMECE2008-66998
DOI: https://doi.org/10.1115/IMECE2008-66998
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Topics: Arthroplasty, Failure, Prostheses, Stress, Biological tissues, Corrosion, Cracking (Materials), Deformation, Fracture (Process), Low cycle fatigue
Proceedings Papers

Gas Metal Arc Welded (GMAW) Joint Strength Comparison of Aluminum Sheet (5754) and Exturded (6063) Alloys

Ramakrishna Koganti, Armando Joaquin, Matthew Zaluzec, Chris Karas
Proc. ASME. IMECE2007, Volume 3: Design and Manufacturing, 715-723, November 11–15, 2007
Paper No: IMECE2007-43423
DOI: https://doi.org/10.1115/IMECE2007-43423
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Topics: Alloys, Aluminum, Gas metal arc welding, Metals, Heat, Gas flow, Failure, Joining, Vehicles, Aluminum alloys
Proceedings Papers

Thermal Crack Development and Wheel Useful Life

Radovan Sarunac
Proc. ASME. IMECE2002, Rail Transportation, 51-62, November 17–22, 2002
Paper No: IMECE2002-39602
DOI: https://doi.org/10.1115/IMECE2002-39602
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Topics: Fracture (Materials), Service life (Equipment), Wheels, Brakes, Compressive stress, Temperature, Automotive brakes, Braking, Braking control, Compression
Proceedings Papers

Metal Inert Gas (MIG) Welding Process Optimization for Joining Aluminum 5754 Sheet Material Using OTC/Daihen Equipment

R. Koganti, C. Karas, A. Joaquin, D. Henderson, M. Zaluzec, A. Caliskan
Proc. ASME. IMECE2003, Manufacturing, 409-425, November 15–21, 2003
Paper No: IMECE2003-42473
DOI: https://doi.org/10.1115/IMECE2003-42473
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Topics: Aluminum, Joining, Metals, Optimization, Sheet materials, Welding, Vehicles, Alloys, Aluminum alloys, Failure
Proceedings Papers

The Role of Intermetallics in Electromigration in Solder Pumps for Lead Free Solder Structure and Its Solder Pad Combination

S. B. Park, Ganesh R. Iyer
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 271-279, November 13–19, 2004
Paper No: IMECE2004-62494
DOI: https://doi.org/10.1115/IMECE2004-62494
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Topics: Electrodiffusion, Intermetallic compounds, Lead-free solders, Pumps, Solders, Failure, Flip-chip, Flip-chip devices, Bonding agents, Metallurgy
Proceedings Papers

Self-Aligned Hermetic Packaging Using Eutectic SnPb Solder and Cr/Ni/Cu Metallization Layer

Annie T. Huang, Chung-Kuang Chou, Chih Chen
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 327-328, November 13–19, 2004
Paper No: IMECE2004-61026
DOI: https://doi.org/10.1115/IMECE2004-61026
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Topics: Packaging, Solders, Glass, Bonding, Silicon, Tin, Heating, Metals, Temperature, Design