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Proceedings Papers

Evaluation of Elastic Properties of a Functionally Graded Composite Using an Elastic-Impact Technique

Prabhakar R. Marur, Hareesh V. Tippur

Proc. ASME. IMECE97, Noise Control and Acoustics, 227-234, November 16–21, 1997

Paper No: IMECE1997-1048

DOI: https://doi.org/10.1115/IMECE1997-1048

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Topics: Composite materials, Elasticity, Functionally graded materials, Echoes, Epoxy adhesives, Epoxy resins, Glass, Impact testing, Particulate matter, Poisson ratio

Proceedings Papers

Nondestructive Elastic Property Characterization of IC Encapsulants

Sridhar Canumalla, Michael G. Oravecz

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 25-32, November 16–21, 1997

Paper No: IMECE1997-0496

DOI: https://doi.org/10.1115/IMECE1997-0496

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Topics: Delamination, Elasticity, Fillers (Materials), Flip-chip packages, Integrated circuit packaging, Molding, Process control, Reliability, Resins, Young's modulus

Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997

Paper No: IMECE1997-0512

DOI: https://doi.org/10.1115/IMECE1997-0512

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Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)

Proceedings Papers

Study on Robust Fail-Safe Structural Design Method

Tomoyuki Hiroyasu, Maho Shoji, Hiroshi Yamakawa

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 221-228, November 16–21, 1997

Paper No: IMECE1997-0537

DOI: https://doi.org/10.1115/IMECE1997-0537

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Topics: Structural design, Flow (Dynamics), Design, Automobiles, Hull, Robustness, Ships, Structures, Topology, Young's modulus

Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997

Paper No: IMECE1997-0814

DOI: https://doi.org/10.1115/IMECE1997-0814

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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry

Proceedings Papers

A Microstructure for the In Situ Determination of Residual Strain

Chi Shiang Pan, Wensyang Hsu

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 105-111, November 16–21, 1997

Paper No: IMECE1997-0947

DOI: https://doi.org/10.1115/IMECE1997-0947

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Topics: Annealing, Cantilever beams, Deflection, Displacement, Finite element analysis, Modeling, Polysilicon, Strain sensors, Young's modulus

Proceedings Papers

Design, Fabrication and Static Test of a Resonant Microaccelerometer

Si Young Kim, Jeung Sang Go, Young-Ho Cho

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 21-26, November 16–21, 1997

Paper No: IMECE1997-0933

DOI: https://doi.org/10.1115/IMECE1997-0933

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Topics: Design, Manufacturing, Resonance, Accelerometers, Micromachining, Polysilicon, Stress, Annealing, Deflection, Mechanical structures

Proceedings Papers

Analysis on Multi-Layered, Corrugated Diaphragm With Residual Stress

Hai Yan, Kuok Chun Lou, Byungchai Lee, Eun Sok Kim

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 373-378, November 15–20, 1998

Paper No: IMECE1998-1271

DOI: https://doi.org/10.1115/IMECE1998-1271

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Topics: Diaphragms (Mechanical devices), Diaphragms (Structural), Stress, Deflection, Pressure, Residual stresses, Stress concentration, Anisotropy, Design, Finite difference methods

Proceedings Papers

Electrostatic Mechanical Testing of Polysilicon

William N. Sharpe, Jr., Kevin Turner, Richard L. Edwards

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 385-388, November 15–20, 1998

Paper No: IMECE1998-1273

DOI: https://doi.org/10.1115/IMECE1998-1273

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Topics: Mechanical testing, Polysilicon, Brittleness, Cross section (Physics), Displacement, Interferometry, Lasers, Microelectromechanical systems, Tensile strength, Testing

Proceedings Papers

Numerical Simulations of Endovascular Balloon Occlusion for Cerebral Aneurysms

Tetsuji Minoura, Nobuyuki Sakai, Sadami Tsutsumi

Proc. ASME. IMECE98, Advances in Bioengineering, 51-52, November 15–20, 1998

Paper No: IMECE1998-0026

DOI: https://doi.org/10.1115/IMECE1998-0026

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Topics: Aneurysms, Computer simulation, Finite element methods, Finite element model, Young's modulus, Simulation, Simulation results, Stress

Proceedings Papers

In-Situ Test Structures for Metrological and Mechanical Characterization of MEMS

Raj K. Gupta

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 141-143, November 15–20, 1998

Paper No: IMECE1998-1149

DOI: https://doi.org/10.1115/IMECE1998-1149

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Topics: Microelectromechanical systems, Errors, Geometry, Mechanical properties, Stiffness, Calibration, Deflection, Electrical measurement, Semiconductor wafers, Stress

Proceedings Papers

Size Effects on Mechanical Properties of Polysilicon

William N. Sharpe, Jr.

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 153-155, November 15–20, 1998

Paper No: IMECE1998-1153

DOI: https://doi.org/10.1115/IMECE1998-1153

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Topics: Mechanical properties, Polysilicon, Microelectromechanical systems, Vapors, Young's modulus

Proceedings Papers

Rayleigh Waves Propagating Along an Oblique Cut Surface of Directional Fiber Reinforced Composites

Tadashi Ohyoshi

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 237-238, November 15–20, 1998

Paper No: IMECE1998-1187

DOI: https://doi.org/10.1115/IMECE1998-1187

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Topics: Fiber reinforced composites, Rayleigh waves, Waves, Composite materials, Cutting, Fibers, Stress, Density, Dimensions, Dynamic response

Proceedings Papers

Synthesis-Structure-Property Relationship for Ultra-Soft Tissue-Equivalent Alginate Hydrogel

Xiangpeng Li, Jihua Gou, Olusegun J. Ilegbusi

Proc. ASME. IMECE2021, Volume 2A: Advanced Manufacturing, V02AT02A055, November 1–5, 2021

Paper No: IMECE2021-70392

DOI: https://doi.org/10.1115/IMECE2021-70392

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Topics: Biological tissues, Hydrogels, Young's modulus

Proceedings Papers

An Improved Response Function Based Stochastic Meshless Method for Bending Analysis of Thin Plates

M. Aswathy, C. O. Arun

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A049, November 1–5, 2021

Paper No: IMECE2021-73429

DOI: https://doi.org/10.1115/IMECE2021-73429

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Topics: Galerkin method, Plates (structures), Simulation, Displacement, Stiffness, Approximation, Boundary-value problems, Deformation, Density, Equilibrium (Physics)

Proceedings Papers

Dependencies of Parallel Sparse Iterative Linear Solver Methods on Matrix Conditioning on Unstructured Finite Element Meshes

Qiyue Lu, Seid Koric

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A025, November 1–5, 2021

Paper No: IMECE2021-69065

DOI: https://doi.org/10.1115/IMECE2021-69065

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Topics: Eigenvalues, Finite element analysis, Iterative methods, Linear systems, Young's modulus

Proceedings Papers

Biomechanics of Cervical Spine Ligaments

Narayan Yoganandan, Srirangam Kumaresan, Frank A. Pintar

Proc. ASME. IMECE99, Advances in Bioengineering, 233-234, November 14–19, 1999

Paper No: IMECE1999-0463

DOI: https://doi.org/10.1115/IMECE1999-0463

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Topics: Biomechanics, Cervical spine, Elasticity, Failure, Stress, Young's modulus, Deflection, Deformation, Stiffness, Tensile testing

Proceedings Papers

Tension Test With Single-Crystalline-Silicon Microspecimen

Taechung Yi, Chang-Jin “CJ” Kim

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 81-86, November 14–19, 1999

Paper No: IMECE1999-0249

DOI: https://doi.org/10.1115/IMECE1999-0249

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Topics: Silicon, Tension, Young's modulus, Silicon-on-insulator, Stress, Crystals, Interferometry, Lasers, Manufacturing, Micromachining

Proceedings Papers

Three-Dimensional Finite Element Stress Response Analysis of Laminated Cantilever Beams With Adhesive Layers Subjected to Impact Loadings

Jyo Shimura, Izumi Higuchi, Toshiyuki Sawa

Proc. ASME. IMECE99, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections, 1-7, November 14–19, 1999

Paper No: IMECE1999-1181

DOI: https://doi.org/10.1115/IMECE1999-1181

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Topics: Adhesives, Cantilever beams, Finite element analysis, Stress, Young's modulus, Finite element methods, Wave propagation, Strain gages, Stress concentration

Proceedings Papers

Two Dimensional Transient Thermal Stress Analysis of Adhesive Butt Joints

Yuichi Nakano, Hiroki Kondo

Proc. ASME. IMECE99, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections, 105-111, November 14–19, 1999

Paper No: IMECE1999-1190

DOI: https://doi.org/10.1115/IMECE1999-1190

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Topics: Adhesives, Thermal stresses, Transients (Dynamics), Temperature, Elasticity, Strips, Temperature distribution, Thermal expansion, Young's modulus

2 3 4 5

NARROW

Evaluation of Elastic Properties of a Functionally Graded Composite Using an Elastic-Impact Technique

Nondestructive Elastic Property Characterization of IC Encapsulants

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Study on Robust Fail-Safe Structural Design Method

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

A Microstructure for the In Situ Determination of Residual Strain

Design, Fabrication and Static Test of a Resonant Microaccelerometer

Analysis on Multi-Layered, Corrugated Diaphragm With Residual Stress

Electrostatic Mechanical Testing of Polysilicon

Numerical Simulations of Endovascular Balloon Occlusion for Cerebral Aneurysms

In-Situ Test Structures for Metrological and Mechanical Characterization of MEMS

Size Effects on Mechanical Properties of Polysilicon

Rayleigh Waves Propagating Along an Oblique Cut Surface of Directional Fiber Reinforced Composites

Synthesis-Structure-Property Relationship for Ultra-Soft Tissue-Equivalent Alginate Hydrogel

An Improved Response Function Based Stochastic Meshless Method for Bending Analysis of Thin Plates

Dependencies of Parallel Sparse Iterative Linear Solver Methods on Matrix Conditioning on Unstructured Finite Element Meshes

Biomechanics of Cervical Spine Ligaments

Tension Test With Single-Crystalline-Silicon Microspecimen

Three-Dimensional Finite Element Stress Response Analysis of Laminated Cantilever Beams With Adhesive Layers Subjected to Impact Loadings

Two Dimensional Transient Thermal Stress Analysis of Adhesive Butt Joints

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