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Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 555-559, November 5–11, 2005
Paper No: IMECE2005-83058
... This paper presents thermal design optimization of an insulated gate bipolar transistor (IGBT) integrated power electronic module (IPEM). A commercially available finite element package was used to create a 3D geometric layout of the IGBT module. Thermal simulations were performed under...