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Keywords: compact modelingClose
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1561-1568, October 31–November 6, 2008
Paper No: IMECE2008-68134
... computational times. The objective of this paper is to present an overview of techniques to minimize the computational time for complex designs such as a heat exchanger used in telecommunication cabinets. The discussion herein presents the concepts which lead to developing a compact model of the heat exchanger...
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 559-564, November 15–21, 2003
Paper No: IMECE2003-42173
... discusses some highlights of the project and indicates shortly their potential for small scale applications. 13 05 2008 thermal characterization compact modeling dynamic measurements test dies reliability Proceedings of IMECE'03: Many roadmaps recognise thermal management as one...
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 593-602, November 15–21, 2003
Paper No: IMECE2003-42180
... In the present work, a novel compact modeling method based on the volume-averaging technique and its application to the analysis of fluid flow and heat transfer in pin fin heat sinks are presented. The pin fin heat sink is modeled as a porous medium. The volume-averaged momentum and energy...