Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-4 of 4
Keywords: thermal design
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
Proc. ASME. IMECE2019, Volume 5: Engineering Education, V005T07A019, November 11–14, 2019
Paper No: IMECE2019-10099
... Abstract This paper describes the use of ANSYS ICEPAK software in teaching a senior level capstone thermal systems design course in a Mechanical Engineering curriculum. The use of ANSYS ICEPAK software tools in the thermal design course allows our undergraduates the preparation they need...
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 555-559, November 5–11, 2005
Paper No: IMECE2005-83058
... This paper presents thermal design optimization of an insulated gate bipolar transistor (IGBT) integrated power electronic module (IPEM). A commercially available finite element package was used to create a 3D geometric layout of the IGBT module. Thermal simulations were performed under...
Proceedings Papers
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 179-185, November 5–10, 2006
Paper No: IMECE2006-14307
... In this study, Computational Fluid Dynamics, which has taken its position in the thermal design of electronic packages, was used in order to draw a CFD road map for forced cooling conjugate heat transfer analyses in heat generating electronic systems. The main sources of error in CFD analyses...
Proceedings Papers
Proc. ASME. IMECE2006, Innovations in Engineering Education: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, 279-283, November 5–10, 2006
Paper No: IMECE2006-14345
... Curriculum thermal design design integration into curriculum Lattuca L. R., Terenzini P. T., and Volkwein J. F., 2006, “Engineering Chalange: A study of the Impact of EC2000”, ABET, Inc., Baltimore, MD. Middle East Technical University, Mechanical Engineering Department, Undergraduate Program...