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Keywords: thermo-mechanical
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Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 57-63, November 5–11, 2005
Paper No: IMECE2005-80238
... voids lead-free thermo-mechanical durability Lau, J., Erasmus, S., 2002, “Effect of voids on Bump Chip Carrier (BCC++) solder joint reliability,” IEEE Electronic Components and Technology Conference, pp. 992–1000. Sharma, P., 2000, “Micro-structural modeling of cyclic creep damage in tin...