1-1 of 1
Keywords: thermo-mechanical
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 57-63, November 5–11, 2005
Paper No: IMECE2005-80238
... voids lead-free thermo-mechanical durability Lau, J., Erasmus, S., 2002, “Effect of voids on Bump Chip Carrier (BCC++) solder joint reliability,” IEEE Electronic Components and Technology Conference, pp. 992–1000. Sharma, P., 2000, “Micro-structural modeling of cyclic creep damage in tin...