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Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 113-120, November 13–19, 2009
Paper No: IMECE2009-11471
... 07 07 2010 This paper documents simulation studies on interactive effect of standoff height and void volume on thermo-mechanical durability of Ball Grid Array (BGA) solder joints using a 3D visco-plastic finite element analysis. SE software was used to find the optimized shape...
Proc. ASME. IMECE2003, Manufacturing, 621-629, November 15–21, 2003
Paper No: IMECE2003-41161
... joiner. Then, thermal bonding operation is carried out by employing an extended stream oxidation cycle at elevated temperatures. Typical failure modes of DWB are misalignment errors and “voided” or “disbonded” regions. The area of “voided” regions for each bonded pair is determined by employing...
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 57-63, November 5–11, 2005
Paper No: IMECE2005-80238
... The effect of process-induced voids on the durability of Sn-Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ambiguous conclusions, showing that voids may sometimes be detrimental to reliability, but they may...