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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels

July 6–9, 2015

San Francisco, California, USA

Conference Sponsors:

ISBN:

978-0-7918-5688-8

In This Volume

Thermal Management (89)

Volume 1: Thermal Management

Thermal Management

Air Cooling: Heat Sink to System Level

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han

InterPACK 2015; V001T09A001doi:https://doi.org/10.1115/IPACK2015-48085

Abstract

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Topics: Porous materials , Power conversion systems , Simulation models , Thermofluids , Heat sinks , Air flow , Power semiconductor devices , Temperature , Computation , Computer simulation

A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force

Hsien-Chin Su

InterPACK 2015; V001T09A002doi:https://doi.org/10.1115/IPACK2015-48151

Abstract

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Topics: Cooling systems , Electromagnetic force , Cooling , Blades , Dimensions , Electromagnets , Bearings , Design , Energy consumption , Engines

Orientation Effects on Thermal Performance of Radial Heat Sinks Subject to Natural Convection

Bin Li, Chan Byon

InterPACK 2015; V001T09A003doi:https://doi.org/10.1115/IPACK2015-48191

Abstract

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Topics: Heat sinks , Natural convection , Computer simulation , Finite volume methods , Fins , Gravity (Force) , Heat transfer , Radiation (Physics)

Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks

Pablo Hidalgo, Ari Glezer

InterPACK 2015; V001T09A004doi:https://doi.org/10.1115/IPACK2015-48511

Abstract

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Topics: Heat sinks , Heat transfer , Vorticity , Flow (Dynamics) , Fluids , Heat transfer coefficients , Cooling , Energy dissipation , Fins , Heat flux

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

Nico Setiawan Effendi, Kyoung Joon Kim

InterPACK 2015; V001T09A005doi:https://doi.org/10.1115/IPACK2015-48630

Abstract

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Topics: Heat sinks , Thermal management , Thermal resistance , Tool steel , Heat , Computational fluid dynamics , Cooling , Energy dissipation , Natural convection

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

Kayvan Abbasi, Sukhvinder Kang

InterPACK 2015; V001T09A006doi:https://doi.org/10.1115/IPACK2015-48641

Abstract

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Topics: Heat , Temperature , Thermocouples , Heat sinks , Temperature distribution , Approximation , Errors , Heat conduction , Heat transfer coefficients , Springs

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

Ehsan B. Haghighi, Thanh L. Phan, Vijit Wuttijumnong, Koichi Mashiko, Yuji Saito, Masataka Mochizuki

InterPACK 2015; V001T09A007doi:https://doi.org/10.1115/IPACK2015-48671

Abstract

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Topics: Cooling , Heat pipes , Heat sinks , Manufacturing , Air flow , Forced convection , Heat , Heat losses , Telecommunications , Thermal management

Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach

Khaled S. Al-Athel, Shahzada P. Aly, Abul Fazal M. Arif, Javad Mostaghimi

InterPACK 2015; V001T09A008doi:https://doi.org/10.1115/IPACK2015-48745

Abstract

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Topics: Aluminum alloys , Heat sinks , Metal foams , Computer-aided design , Computerized tomography , Finite element analysis , Geometry , Computer software , Engineering systems and industry applications , Mechanical behavior

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui

InterPACK 2015; V001T09A009doi:https://doi.org/10.1115/IPACK2015-48753

Abstract

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Topics: Channel flow , Heat flux , Flow (Dynamics) , Cycles , Heat sinks , Convection , Fluctuations (Physics) , Heat exchangers , Heat transfer , Turbulence

Data Centers and Energy Efficient Electronic Systems

Key Technologies to Implement High Thermal Ambient Data Center

Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo

InterPACK 2015; V001T09A010doi:https://doi.org/10.1115/IPACK2015-48015

Abstract

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Topics: Data centers , Temperature , Cooling , Design , Internet , Air conditioners , Ceilings , Computers , Energy consumption , Failure

Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center

Tianyi Gao, Bahgat G. Sammakia, James Geer, Bruce Murray, Russell Tipton, Roger Schmidt

InterPACK 2015; V001T09A011doi:https://doi.org/10.1115/IPACK2015-48069

Abstract

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Topics: Cooling , Data centers , Coolers , Energy consumption , Cooling systems , Density , Heat , Temperature , Coal , Computational fluid dynamics

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt

InterPACK 2015; V001T09A012doi:https://doi.org/10.1115/IPACK2015-48071

Abstract

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Topics: Cooling , Data centers , Temperature , Heat , Air flow , Computational fluid dynamics , Cooling systems , Stress , Computer simulation , Density

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney

InterPACK 2015; V001T09A013doi:https://doi.org/10.1115/IPACK2015-48152

Abstract

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Topics: Cooling , Data centers , Water , Construction , Density , Doors , Energy dissipation , Heat , Heat exchangers , Innovation

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja

InterPACK 2015; V001T09A014doi:https://doi.org/10.1115/IPACK2015-48169

Abstract

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Topics: Cooling , Data centers , High temperature , Corrosion , Internet , Temperature , Design , Operating temperature , Refrigeration , Carbon dioxide

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Prabjit Singh, Levente Klein, Dereje Agonafer, Jimil M. Shah, Kanan D. Pujara

InterPACK 2015; V001T09A015doi:https://doi.org/10.1115/IPACK2015-48176

Abstract

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Topics: Contamination , Particulate matter , Reliability , Temperature , Data centers , Electronic equipment , Temperature effects , Cutting , High temperature , Risk

Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Roger Schmidt

InterPACK 2015; V001T09A016doi:https://doi.org/10.1115/IPACK2015-48234

Abstract

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Topics: Data centers , Flow (Dynamics) , Modeling , Computational fluid dynamics , Pressure , Tiles , Boundary-value problems , Cooling , Dimensions , Ducts

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton

InterPACK 2015; V001T09A017doi:https://doi.org/10.1115/IPACK2015-48237

Abstract

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Topics: Cooling , Steady state , Transients (Dynamics) , Data centers , Containment , Air flow , Coolers , Failure , Flow (Dynamics) , Computational fluid dynamics

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Dan Comperchio, Sameer Behere

InterPACK 2015; V001T09A018doi:https://doi.org/10.1115/IPACK2015-48274

Abstract

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Topics: Data centers , Compressors , Energy consumption , Air conditioners , Computers , Cooling , Electronic systems , Evaporative cooling , System architecture , System monitoring

Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers

Levente J. Klein, Sergio A. Bermudez, Fernando J. Marianno, Hendrik F. Hamann, Prabjit Singh

InterPACK 2015; V001T09A019doi:https://doi.org/10.1115/IPACK2015-48349

Abstract

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Topics: Air pollution , Data centers , Energy efficiency , Cooling , Corrosion , Temperature , Sensors , Air conditioning , Air flow , Contamination

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon

InterPACK 2015; V001T09A020doi:https://doi.org/10.1115/IPACK2015-48364

Abstract

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Topics: Computer simulation , Data centers , Optimization , Stress , Thermal efficiency , Design , Containment , Computational fluid dynamics , Air conditioning , Flow (Dynamics)

Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems

Marcelo del Valle, Alfonso Ortega

InterPACK 2015; V001T09A021doi:https://doi.org/10.1115/IPACK2015-48375

Abstract

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Topics: Cooling systems , Data centers , Experimental characterization , Heat exchangers , Transients (Dynamics) , Water , Flow (Dynamics) , Temperature , Circuits , Cooling

Data Center Optimization Using Performance Metrics

Mark J. Seymour, Magnus K. Herrlin

InterPACK 2015; V001T09A022doi:https://doi.org/10.1115/IPACK2015-48400

Abstract

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Topics: Data centers , Optimization , Cooling , Air flow , Heat , Simulation , Temperature , Cooling systems , Energy consumption , Energy generation

The Effectiveness of Data Center Overhead Cooling in Steady and Transient Scenarios: Comparison of Downward Flow to a Cold Aisle Versus Upward Flow From a Hot Aisle

Luis Silva-Llanca, Marcelo del Valle, Alfonso Ortega

InterPACK 2015; V001T09A023doi:https://doi.org/10.1115/IPACK2015-48423

Abstract

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Topics: Cooling , Data centers , Flow (Dynamics) , Transients (Dynamics) , Heat exchangers , Cooling systems , Air flow , Energy efficiency , Pressure drop , Temperature

Perforated Tile Airflow Prediction: A Comparison of RANS CFD, Fast Fluid Dynamics, and Potential Flow Modeling

Christopher M. Healey, James W. VanGilder, Zachary M. Pardey

InterPACK 2015; V001T09A024doi:https://doi.org/10.1115/IPACK2015-48424

Abstract

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Topics: Air flow , Computational fluid dynamics , Flow (Dynamics) , Fluid dynamics , Modeling , Reynolds-averaged Navier–Stokes equations , Tiles , Data centers , Buoyancy , Friction

Data Center Cooling Efficiency With Simulation-Based Optimization

Laurent M. Billet, Christopher M. Healey, James W. VanGilder, Zachary M. Pardey

InterPACK 2015; V001T09A025doi:https://doi.org/10.1115/IPACK2015-48425

Abstract

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Topics: Cooling , Data centers , Optimization , Simulation , Energy consumption , Air flow , Cooling systems , Pressure , Sensors , Temperature

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Hamza Salih Erden, H. Ezzat Khalifa

InterPACK 2015; V001T09A026doi:https://doi.org/10.1115/IPACK2015-48430

Abstract

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Topics: Capacitance , Modeling , Parameter estimation , Water , Data centers , Transients (Dynamics) , Air flow , Computers , Cooling , Failure

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang

InterPACK 2015; V001T09A027doi:https://doi.org/10.1115/IPACK2015-48432

Abstract

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Topics: Design , Air flow , Tiles , Computational fluid dynamics , Cables , Construction , Cooling , Engineering simulation , Flow (Dynamics) , Leakage

Thermodynamic Analysis of Full Liquid-Cooled Data Centers

A. Bhalerao, A. P. Wemhoff

InterPACK 2015; V001T09A028doi:https://doi.org/10.1115/IPACK2015-48439

Abstract

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Topics: Data centers , Heat , Plates (structures) , Cooling , Exergy , Computers , Cooling towers , Modeling , Systems analysis

Creating a Calibrated CFD Model of a Midsize Data Center

Zachary M. Pardey, James W. VanGilder, Christopher M. Healey, David W. Plamondon

InterPACK 2015; V001T09A029doi:https://doi.org/10.1115/IPACK2015-48448

Abstract

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Topics: Computational fluid dynamics , Data centers , Modeling , Tiles , Air flow , Boundary-value problems , Calibration , Change management , Design , Flow (Dynamics)

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell

InterPACK 2015; V001T09A030doi:https://doi.org/10.1115/IPACK2015-48466

Abstract

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Topics: Cooling , Water , Design , Air flow , Heat , Energy consumption , Energy efficiency , Stress , Algorithms , Boundary-value problems

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

Lynn Parnell, Garrison Vaughan, John Thompson, Daniel Duffy, Louis Capps, Mark E. Steinke, Vinod Kamath

InterPACK 2015; V001T09A031doi:https://doi.org/10.1115/IPACK2015-48470

Abstract

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Topics: Server racks , Stress , Water , Cooling , Flow (Dynamics) , Temperature , Computers , Coolants , Density , Design

A Computational Study to Compare the Data Center Cooling Energy Spent Using Traditional Air Cooled and Hybrid Water Cooled Servers

Aparna Vallury, Mark E. Steinke, Vinod Kamath, Lynn Parnell

InterPACK 2015; V001T09A032doi:https://doi.org/10.1115/IPACK2015-48476

Abstract

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Topics: Cooling , Data centers , Water , Air flow , Density , Heat exchangers , Optimization , Simulation models , Temperature

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen

InterPACK 2015; V001T09A033doi:https://doi.org/10.1115/IPACK2015-48593

Abstract

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Topics: Air conditioning , Fans , Automatic control , Control systems , Cooling , Data centers , Energy consumption , Failure , Redundancy (Engineering) , Safety

Neural Network Modeling in Model-Based Control of a Data Center

Nachiket Kansara, Rohit Katti, Kourosh Nemati, Alan P. Bowling, Bahgat Sammakia

InterPACK 2015; V001T09A034doi:https://doi.org/10.1115/IPACK2015-48684

Abstract

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Topics: Artificial neural networks , Data centers , Modeling , Computational fluid dynamics , Temperature , Neural network models , Sensors , Storage , Transients (Dynamics)

Power-Performance-Reliability Co-Design for ICs

Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization

Caleb Serafy, Ankur Srivastava, Avram Bar-Cohen, Donald Yeung

InterPACK 2015; V001T09A035doi:https://doi.org/10.1115/IPACK2015-48344

Abstract

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Topics: Design , Microfluidics , Optimization , Cooling , Energy efficiency , Circuits

Co-Placement for Pin-Fin Based Micro-Fluidically Cooled 3D ICs

Zhiyuan Yang, Ankur Srivastava

InterPACK 2015; V001T09A036doi:https://doi.org/10.1115/IPACK2015-48354

Abstract

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Topics: Algorithms , Cooling , Design , Flow (Dynamics) , Gates (Closures) , Heat , Pins (Engineering) , Silicon , Temperature , Temperature uniformity

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Tiantao Lu, Ankur Srivastava

InterPACK 2015; V001T09A037doi:https://doi.org/10.1115/IPACK2015-48386

Abstract

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Topics: Design , Reliability , Finite element methods , Stress , Circuits , Design methodology , Electrodiffusion , Flow (Dynamics) , Heat conduction , Optimization

Multi-Physics Driven Co-Design of 3D Multicore Architectures

He Xiao, Wen Yueh, Saibal Mukhopadhyay, Sudhakar Yalamanchili

InterPACK 2015; V001T09A038doi:https://doi.org/10.1115/IPACK2015-48533

Abstract

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Topics: Architecture , Design , Physics , Temperature , Delays , Energy efficiency , Circuits , Cycles , Energy consumption , Heat flux

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson

InterPACK 2015; V001T09A039doi:https://doi.org/10.1115/IPACK2015-48690

Abstract

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Topics: Cavities , Cooling , Design , Integrated circuits , Fluids , Pressure , Blocks (Building materials) , Computer simulation , Construction , Drainage

Rack Level Thermal Management

An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

Hafiz M. Hashim, Baris Dogruoz, Mehmet Arik, Murat Parlak

InterPACK 2015; V001T09A040doi:https://doi.org/10.1115/IPACK2015-48024

Abstract

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Topics: Axial flow , Computational fluid dynamics , Performance characterization , Flow (Dynamics) , Engineering simulation , Engineers , Fans , Pressure , Pressure drop , Simulation

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour

InterPACK 2015; V001T09A041doi:https://doi.org/10.1115/IPACK2015-48244

Abstract

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Topics: Computer simulation , Cooling , Data centers , Heat , Air flow , Energy dissipation , Leakage , Water , Boundary-value problems , Computational fluid dynamics

Rack Server Solution in Data Center

Sheng Kang, Guofeng Chen, Chun Wang, Ruiquan Ding, Jiajun Zhang, Pinyan Zhu, Chao Liu, Nishi Ahuja

InterPACK 2015; V001T09A042doi:https://doi.org/10.1115/IPACK2015-48258

Abstract

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Topics: Data centers , Cooling , Energy consumption , Design , Fans , Air flow , Energy efficiency , Server racks , Cloud computing , Heat

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Tianyi Gao, Marcelo del Valle, Alfonso Ortega, Bahgat G. Sammakia

InterPACK 2015; V001T09A043doi:https://doi.org/10.1115/IPACK2015-48377

Abstract

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Topics: Cooling systems , Data centers , Experimental characterization , Heat exchangers , Transients (Dynamics) , Water , Computer simulation , Flow (Dynamics) , Temperature , Coolers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi

InterPACK 2015; V001T09A044doi:https://doi.org/10.1115/IPACK2015-48600

Abstract

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Topics: Density , Electronic equipment , Flow (Dynamics) , Network analysis , Packaging , Air flow , Computational fluid dynamics , Cooling , Design , Diluents

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Kazuma Obata, Takashi Fukue, Koichi Hirose, Mamoru Kikuchi, Yasuhiko Ueda, Shigekado Kusabuka, Tomoyasu Miyahara

InterPACK 2015; V001T09A045doi:https://doi.org/10.1115/IPACK2015-48607

Abstract

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Topics: Cooling , Flow (Dynamics) , Generators , Heat sinks , Vortices , Water , Heat , Density , Electric vehicles , Energy dissipation

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Suchismita Sarangi, Will A. Kuhn, Scott Rider, Claude Wright, Shankar Krishnan

InterPACK 2015; V001T09A046doi:https://doi.org/10.1115/IPACK2015-48640

Abstract

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Topics: Cooling , Fluids , Temperature , Boiling , Bose-Einstein condensates , Air flow , Coating processes , Coatings , Coolants , Engineering standards

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Joshua Gess, Tyler Dreher, Sushil Bhavnani, Wayne Johnson

InterPACK 2015; V001T09A047doi:https://doi.org/10.1115/IPACK2015-48771

Abstract

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Topics: Flow (Dynamics) , Coolants , Pressure drop , Temperature , Energy dissipation , Fluids , Boiling , Cooling , Data centers , Design

Thermal Management: Device Level Thermal Management

Design, Fabrication and Characterization of a Mechanical Micropump

Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo

InterPACK 2015; V001T09A048doi:https://doi.org/10.1115/IPACK2015-48017

Abstract

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Topics: Design , Manufacturing , Micropumps , Flow (Dynamics) , Blades , Computational fluid dynamics , Emissions , Impellers , Pressure , Pumps

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko

InterPACK 2015; V001T09A049doi:https://doi.org/10.1115/IPACK2015-48019

Abstract

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Topics: Flat heat pipes , Heat pipes , Heat , Clocks , Computer cooling , Metals , Aerospace industry , Cooling , Data centers , Experimental analysis

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik

InterPACK 2015; V001T09A050doi:https://doi.org/10.1115/IPACK2015-48051

Abstract

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Topics: Temperature , Boundary-value problems , Finite element methods , Computer software , Cooling , Flux (Metallurgy) , Fourier series , Heat , Heat flux , Laplace equations

Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit

Thomas H. Sherer, II, Yogendra Joshi

InterPACK 2015; V001T09A051doi:https://doi.org/10.1115/IPACK2015-48061

Abstract

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Topics: Phase change materials , Shells , Thermal energy storage , Temperature , Transients (Dynamics) , Enthalpy , Flow (Dynamics) , Fluids , Heat transfer , Paraffin wax

Thermally-Optimum Design of GaN-on-SiC HEMT

Caleb A. Holloway, Avram Bar-Cohen

InterPACK 2015; V001T09A052doi:https://doi.org/10.1115/IPACK2015-48119

Abstract

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Topics: Design , Gallium nitride , Temperature , Geometry , Heat , Interfacial thermal resistance , Junctions , Thermal resistance , Cooling , Dimensions

Thermal Spreading Resistance in a Multilayered Orthotropic Circular Disk With Interfacial Resistance and Variable Heat Flux

Y. S. Muzychka

InterPACK 2015; V001T09A053doi:https://doi.org/10.1115/IPACK2015-48243

Abstract

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Topics: Disks , Heat flux , Interfacial thermal resistance , Electrical conductance , Boundary-value problems , Computer software , Contact resistance , FORTRAN , Modeling , Thermal resistance

Experimental Investigation of Fluid Motion in Pulsating Heat Pipe

Hyung Yun Noh, Sung Jin Kim

InterPACK 2015; V001T09A054doi:https://doi.org/10.1115/IPACK2015-48285

Abstract

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Topics: Fluids , Heat pipes , Pressure , Heat transfer , Latent heat , Temperature , Equilibrium (Physics) , Flow visualization , Heat , Pressure sensors

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk

InterPACK 2015; V001T09A055doi:https://doi.org/10.1115/IPACK2015-48333

Abstract

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Topics: Electronic packages , Nondestructive evaluation , Thermal diffusion , Heat , Acoustics , Algorithms , Contact resistance , Density , Energy dissipation , Flat heat pipes

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

InterPACK 2015; V001T09A056doi:https://doi.org/10.1115/IPACK2015-48537

Abstract

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Topics: Coolers , Fins , Computer simulation , Cooling , Density , Flow (Dynamics) , Flux (Metallurgy) , Heat , Coolants , Design

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille

InterPACK 2015; V001T09A057doi:https://doi.org/10.1115/IPACK2015-48592

Abstract

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Topics: Gallium nitride , Heat sinks , Power density , Simulation , Thermal management , Cooling , Flow (Dynamics) , Microchannels , Design , Heat transfer

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka

InterPACK 2015; V001T09A058doi:https://doi.org/10.1115/IPACK2015-48685

Abstract

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Topics: Convection , Thermal resistance , Heat transfer coefficients , Boundary-value problems , Cooling , Thermal analysis , Computer software , Design , Engineers , Finite volume methods

Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device

Jing Liu, Zhong-Shan Deng, Zhi-Zhu He

InterPACK 2015; V001T09A059doi:https://doi.org/10.1115/IPACK2015-48698

Abstract

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Topics: Heat flux , Liquid metals , Thermal management , Cooling , Coolants , Flow (Dynamics) , Energy consumption , Heat , Batteries , Design

Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

Sergio Escobar, Niru Kumari, Rocky Shih, Sarah Anthony, Cullen Bash

InterPACK 2015; V001T09A060doi:https://doi.org/10.1115/IPACK2015-48770

Abstract

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Topics: Flow (Dynamics) , Heat , Porous materials , Vapors , Cooling , Heat transfer , Approximation , Capillarity , Computational fluid dynamics , Design

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

InterPACK 2015; V001T09A061doi:https://doi.org/10.1115/IPACK2015-48802

Abstract

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Topics: MOSFET transistors , Relaxation (Physics) , Temperature distribution , Simulation , Electric fields , Thermal properties , Heat , Physics , Temperature

Thermal Management: Phase Change Materials

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Kieran Hess, Amy S. Fleischer

InterPACK 2015; V001T09A062doi:https://doi.org/10.1115/IPACK2015-48082

Abstract

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Topics: Energy storage , Nanoparticles , Viscosity , Multi-walled carbon nanotubes , Fluids , Graphite , Temperature , Currents , Heat transfer , Nanofibers

Enhanced Melting for Transient Thermal Management

T. Rozenfeld, R. Hayat, Y. Kozak, G. Ziskind

InterPACK 2015; V001T09A063doi:https://doi.org/10.1115/IPACK2015-48369

Abstract

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Topics: Melting , Thermal management , Transients (Dynamics) , Fins , Phase change materials , Heat transfer , Energy dissipation , Geometry , Heat , Latent heat

Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances

Yash Ganatra, Amy Marconnet

InterPACK 2015; V001T09A064doi:https://doi.org/10.1115/IPACK2015-48499

Abstract

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Topics: Phase change materials , Thermal management , Energy dissipation , Heat , Temperature , Thermal conductivity , Density , Energy consumption , Flow (Dynamics) , Heat capacity

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff

InterPACK 2015; V001T09A065doi:https://doi.org/10.1115/IPACK2015-48522

Abstract

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Topics: Energy storage , Engineering simulation , Phase change materials , Simulation , Thermal energy storage , Finite element analysis , Heat flux , Heating , Latent heat , Melting

Thermal Management: Stacked Die and Multi-Chip-Module and Packaging

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

Ah-Young Park, S. B. Park

InterPACK 2015; V001T09A066doi:https://doi.org/10.1115/IPACK2015-48042

Abstract

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Topics: Bonding , Design , Thermal management , Finite element analysis , Packaging , Solders , Dimensions , Energy consumption , Heat transfer , Integrated circuits

Compact Thermal Modeling Methodology for Active and Thermal Bumps in 3D Microelectronic Packages

Arnab Choudhury, Shrenik Kothari, Nayandeep Mahanta, Hemanth Dhavaleswarapu, Je-Young Chang

InterPACK 2015; V001T09A067doi:https://doi.org/10.1115/IPACK2015-48104

Abstract

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Topics: Modeling , Thermal conductivity , Design , Heat transfer , Junctions , Reliability , Temperature , Thermal resistance

Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne

InterPACK 2015; V001T09A068doi:https://doi.org/10.1115/IPACK2015-48316

Abstract

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Topics: Experimental characterization , Heat transfer , Complementary metal oxide semiconductors , Cooling , Epoxy adhesives , Epoxy resins , Heating , Thermal conductivity , Thermal properties , Thermal resistance

Benchmarking Study on the Thermal Management Landscape for 3D ICs: From Back-Side to Volumetric Heat Removal

Thomas Brunschwiler, Arvind Sridhar, Chin Lee Ong, Gerd Schlottig

InterPACK 2015; V001T09A069doi:https://doi.org/10.1115/IPACK2015-48353

Abstract

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Topics: Heat , Thermal management , Cooling , Energy dissipation , Microchannels , Density , Drainage , Fluids , Heat budget (Physics) , Heat flux

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen

InterPACK 2015; V001T09A070doi:https://doi.org/10.1115/IPACK2015-48422

Abstract

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Topics: Modeling , Boundary-value problems , Anisotropy , Computer simulation , Computer software , Electronic packages , Finite element analysis , Flow (Dynamics) , Heat , Heat flux

Thermal Management: Thermal Interface Materials and Heat Spreading

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight

InterPACK 2015; V001T09A071doi:https://doi.org/10.1115/IPACK2015-48083

Abstract

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Topics: Alloys , Durability , Testing , ASTM International , Copper , Cycles , Gallium , Performance evaluation , Surface finishing , Tin

Measuring and Optimizing Thermal Interface Material Performance for VR Heatsink Designs

Jun Lu, Michelle C. Lin, Bernie Short

InterPACK 2015; V001T09A072doi:https://doi.org/10.1115/IPACK2015-48146

Abstract

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Topics: Air flow , Design , Fillers (Materials) , Mechanical testing , Power regulators , Silicones , Testing , Thermal resistance , Wind tunnels

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama

InterPACK 2015; V001T09A073doi:https://doi.org/10.1115/IPACK2015-48302

Abstract

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Topics: Contact resistance , Pressure , Heat , Surface roughness , Temperature , Bearings , Control systems , Electronic equipment , Errors , Satellites

The Detection of Minimum BLT Condition With Electrical Capacitance Measurement

Yasuhiro Saito, Satoru Suzuki, Takanori Komuro

InterPACK 2015; V001T09A074doi:https://doi.org/10.1115/IPACK2015-48303

Abstract

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Topics: Capacitance , Heat , Fillers (Materials) , Heat sinks , Solids , Electrical measurement , Mass production , Pressure , Semiconductor devices , Silicones

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Ninad Trifale, Eric Nauman, Kazuaki Yazawa

InterPACK 2015; V001T09A075doi:https://doi.org/10.1115/IPACK2015-48535

Abstract

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Topics: Contact resistance , Metal foams , Porosity , Fillers (Materials) , Foams (Chemistry) , Aluminum , Elastic moduli , Elasticity , Phase change materials , Simulation

Mechanical Solution for Dealing With Phase Change Material Flow When Mounting Electrical Components

Paul J. Grosskreuz, Rui Zhou, Kelly J. Bronk

InterPACK 2015; V001T09A076doi:https://doi.org/10.1115/IPACK2015-48634

Abstract

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Topics: Electrical components , Flow (Dynamics) , Phase change materials , Cooling systems , Electronic components , Heat , Heat sinks , Servomotors , Temperature , Thermal systems

The Efficiency of Heat Transfer Through the Interface of Sintered Silver Nanoparticles

Tomasz Fałat, Przemysław Matkowski, Krzysztof Stojek, Jan Felba, Bartosz Płatek, Andrzej Mościcki

InterPACK 2015; V001T09A077doi:https://doi.org/10.1115/IPACK2015-48732

Abstract

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Topics: Heat transfer , Nanoparticles , Silver , Temperature , Junctions , Transistors , Copper , Heat conduction , Inspection , Structural analysis

Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs

Timothy J. Longson, James Maddocks, Ali Kashani

InterPACK 2015; V001T09A078doi:https://doi.org/10.1115/IPACK2015-48735

Abstract

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Topics: Multi-walled nanotubes , Contact resistance , Temperature , Heat conduction , Modeling , Carbon , Catalysts , Deformation , Density , Multi-walled carbon nanotubes

Thermal Management: Thermoelectrics

Harvesting CPU Waste Heat Through Pyroelectric Materials

Soochan Lee, Nishant Singh, Patrick E. Phelan, Carole-Jean Wu

InterPACK 2015; V001T09A079doi:https://doi.org/10.1115/IPACK2015-48421

Abstract

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Topics: Waste heat , Heat , Temperature , Materials properties , Thermal conductivity , Computation , Electric power generation , Energy dissipation , Energy efficiency , Energy generation

Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures

Kazuaki Yazawa, Ali Shakouri

InterPACK 2015; V001T09A080doi:https://doi.org/10.1115/IPACK2015-48682

Abstract

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Topics: Design , Heat pumps , Temperature , Cooling , Heat , Heat sinks , Diluents , Energy generation , Reservoirs , Computer cooling

Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation

Kazuaki Yazawa, Stephen D. Heister, Timothy S. Fisher

InterPACK 2015; V001T09A081doi:https://doi.org/10.1115/IPACK2015-48692

Abstract

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Topics: Energy generation , Heat transfer , Optimization , Flow (Dynamics) , Fluids , Design , Temperature , Heat exchangers , Generators , Orifices

Thermal Modeling Methodologies and Simulations

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

InterPACK 2015; V001T09A082doi:https://doi.org/10.1115/IPACK2015-48205

Abstract

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Topics: Boundary-value problems , Silicon , Temperature , Thermal resistance , Computation , Heat conduction , Heat transfer , Simulation results , Design , Electronic equipment

CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels

Omer Bugra Kanargi, Christopher Yap, Poh Seng Lee

InterPACK 2015; V001T09A083doi:https://doi.org/10.1115/IPACK2015-48277

Abstract

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Topics: Computational fluid dynamics , Heat sinks , Flow (Dynamics) , Cross connections , Heat transfer , Pressure , Thermal boundary layers , Air flow , Convection , Design

Challenges and Opportunities in Thermal Management of Multi-Chip Packages

Hemanth K. Dhavaleswarapu, Chandra Mohan Jha, Susan F. Smith, Shrenik Kothari, Baris Bicen, Sanjoy K. Saha, Ashish Gupta

InterPACK 2015; V001T09A084doi:https://doi.org/10.1115/IPACK2015-48362

Abstract

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Topics: Density , Manufacturing , Reliability , Signals , Thermal management

Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida

InterPACK 2015; V001T09A085doi:https://doi.org/10.1115/IPACK2015-48370

Abstract

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Topics: Boiling , Microchannel flow , Modeling , Cooling , Cavities , Convection , Engineering simulation , Evaporative cooling , Fluids , Heat

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

Charlie De Vivero, Fulya Kaplan, Ayse K. Coskun

InterPACK 2015; V001T09A086doi:https://doi.org/10.1115/IPACK2015-48568

Abstract

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Topics: Hardware , Temperature , Phase change materials , Thermal management , Complementary metal oxide semiconductors , Computation , Cooling , Design , Errors , Heat

Thermal Modeling of Remote Radio Head Units

Manasa Sahini, Betsegaw Gebrehiwot, Dereje Agonafer, Rocky Colapietro

InterPACK 2015; V001T09A087doi:https://doi.org/10.1115/IPACK2015-48606

Abstract

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Topics: Modeling , Air flow , Temperature , Computational fluid dynamics , Cooling , Natural convection , Boundary-value problems , Design , Exhaust systems , Heat

A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips

Arthur Suszko, Mohamed S. El-Genk

InterPACK 2015; V001T09A088doi:https://doi.org/10.1115/IPACK2015-48678

Abstract

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Topics: Composite materials , Cooling , Flat heat pipes , Critical heat flux , Copper , Dielectric liquids , Graphite , Nucleate pool boiling , Numerical analysis , Surface roughness

A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials

Ich-Long Ngo, Chan Byon

InterPACK 2015; V001T09A089doi:https://doi.org/10.1115/IPACK2015-48740

Abstract

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Topics: Composite materials , Fillers (Materials) , Nanoparticles , Thermal conductivity , Particulate matter , Polymers

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Data Centers and Energy Efficient Electronic Systems

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Rack Level Thermal Management

Thermal Management: Device Level Thermal Management

Thermal Management: Phase Change Materials

Thermal Management: Stacked Die and Multi-Chip-Module and Packaging

Thermal Management: Thermal Interface Materials and Heat Spreading

Thermal Management: Thermoelectrics

Thermal Modeling Methodologies and Simulations

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