Thermal Interface Materials (TIMs) play a key role in the thermal management of microelectronics by providing a path of low thermal impedance between the heat generating devices and the heat dissipating components (heat spreader/sink). In addition, TIMs need to reliably maintain this low thermal resistance path throughout the operating life of the device. Currently, several different TIM material solutions are employed to dissipate heat away from semiconductor devices. Thermal greases, adhesives, gels, pads, and phase change materials are among these material solutions. Each material system has its own advantages and associated application space. While thermal greases offer excellent thermal performance, their uncured state makes them susceptible to pump-out and other degradation mechanisms. On the other hand, adhesives offer structural support but offer a higher heat resistance path. Gels are designed to provide a level of cross-linking to allow the thermal performance of greases and prevent premature degradation. However, the degree of crosslinking can have a significant effect of the behavior of gels. In this research, TIMs with varying cross-linking densities are studied and their thermal and mechanical properties reported. The base resin systems and fillers were maintained constant, while slight compositional alternations were made to induce different degrees of cross-linking.

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