This paper discusses spring-loaded mechanical structures that can be used to make thermal connections between an object to be cooled, such as an integrated circuit, and a dissipative structure, like a cooling plate or heat sink. These metal structures are flexible and resilient, adapting to variations in orientation of the two objects to be coupled. Precision experiments and computations demonstrate that they have much lower thermal resistance than elastomeric “gap-filler” pads that are usually used to perform this function.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Thermal-Resistance Measurements on Mechanical Gap Fillers
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Kolodner, P, Hodes, M, Ewes, I, & Holmes, P. "Thermal-Resistance Measurements on Mechanical Gap Fillers." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 91-98. ASME. https://doi.org/10.1115/IPACK2005-73084
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