Research and development on System in Package (SiP) technologies is prevalent now both in industry and academia. This paper provides an overview of SiP from a CPU and communications systems perspective. Some of the items that will be covered include what defines a “system” for SiP, what value a SiP architecture brings, the types of SiP packaging architectures and technologies, and the challenges involved with developing SiP solutions.
- Heat Transfer Division and Electronic and Photonic Packaging Division
An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems
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Polka, L, Mahajan, R, Swan, J, & Choksi, G. "An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 971-975. ASME. https://doi.org/10.1115/IPACK2005-73320
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