This paper describes transient cooling technology for electronic equipment using Phase Change Materials (PCMs) and a heat sink with pin fins. We designed an electronic module including paraffin as the PCM and measured its transient temperature rise. The effects of the diameter of pin fins and heat dissipation values were investigated as design parameters. The results show that the temperature rise values were controlled by the thermal absorption effect due to the latent heat of the PCM. It is also confirmed that the proposed thermal network method with an equivalent specific heat model has strong potential for use in the analysis of electronic modules using PCMs.
- Electronic and Photonic Packaging Division
Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials
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Takakuwa, S, Ishizuka, M, Nakagawa, S, & Takagi, K. "Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 471-477. ASME. https://doi.org/10.1115/InterPACK2009-89218
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