Thermal analysis of electronic devices is essential for designing thermal management systems and for assuring a perfect working condition. In order to have a precise thermal analysis, thermal spreading resistance should be calculated. In this paper, a numerical study is conducted on the thermal resistance of a 2D flux channel with a non-uniform convection coefficient in the heat sink plane. For this purpose, the Finite Volume Method (FVM) is used. As a case study, a 2D flux channel with a discrete specified heat flux and convection edges is assumed. Also, the heat transfer coefficient in the sink boundary condition is determined symmetrically using a hyperellipse function. This function can model a wide variety of different distributions of a heat transfer coefficient from a uniform cooling to the most intense cooling in the central region. All results are compared and validated with the COMSOL commercial software package. The proposed method is useful for thermal engineers for modeling different flux channels with different properties and boundary conditions such as the variable heat transfer coefficient.
- Electronic and Photonic Packaging Division
Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane
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Razavi, M, Dehghani-Sanij, A, & Muzychka, YS. "Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A058. ASME. https://doi.org/10.1115/IPACK2015-48685
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