The process of in-mold electronics (IME) is an innovative technology that integrates printed electronics with film insert molding to produce plastic components that contain electronics. The process involves the combination of printing, thermoforming, and injection molding to create complex and customized electronic devices. This technology has found numerous applications in various industries, including automobile components, household appliances, and consumer electronics, where customized user interfaces are required to manage or monitor the system. A customized user interface is required for a variety of applications in automotive, industrial electronics, and consumer technology to manage or monitor the system. Knobs, pressure and toggle switches, analog instruments, and flat-screen technology with touch sensor capabilities are also options. The key advantage of IME technology is its ability to create flexible and stretchable electronic devices capable of functioning under strain when bent, stretched, and deformed. Despite its potential, the IME process faces several challenges. One of the critical factors affecting the performance of IME products is the electrical resistance of the printed circuit, which changes during thermoforming. This presents a significant design challenge, as over-deformation of printed circuits can lead to poor performance and reliability issues. In this study, we have developed new design strategies and methods to optimize the performance of the IME process. This includes the use of electrically conductive adhesives to attach components in their undeformed state and later subject to thermoforming. This approach helps to maintain the integrity of the printed circuit and improve the performance of the interconnects. To evaluate the performance of the IME process, we have employed the OrCAD software to build and simulate a digital circuit. The performance of the inverting circuit was compared and evaluated against the tolerance limits of the COTs.

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