High-performance thermal interface materials (TIMs) are essential in reducing thermal resistances while accommodating thermal expansion mismatch between heat sources and heat sinks. Here, we utilize copper nanowires (CuNWs) to form an intrinsically conductive and mechanically compliant nanostructure infiltrated with polydimethylsiloxane (PDMS) \for additional protection and compliance. We previously fabricated the CuNWs TIMs by direct electroplating on a silicon substrate with severe limitations on application and cost for largescale manufacturing. Thus, it is desirable to develop a cost-effective process for the fabrication of CuNWs TIMs in a “tape” or “coupon” form factor that can be easily inserted and bonded between two substrates. In this work, we developed a novel fabrication process to produce a Sn (20μm)-Cu/Au(20μm)/CuNWs-PDMS(30μm)/Cu(20μm)-Sn (20μm) TIM in a tape form factor. This innovative process involves producing an ultra-smooth (20 nm RMS) sacrificial Au/Cu foil that is used to electroplate CuNWs, PDMS infiltration, and finally, Cu and Sn film overplating to form the final TIM “tape”.

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