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Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Paper No: IPACK2013-73158
DOI: https://doi.org/10.1115/IPACK2013-73158
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Paper No: IPACK2013-73149
DOI: https://doi.org/10.1115/IPACK2013-73149
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Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A006, July 16–18, 2013
Paper No: IPACK2013-73148
DOI: https://doi.org/10.1115/IPACK2013-73148
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Topics: Copper, Thin films, Electroplating, Electrical properties, Electrical resistivity, Annealing, Bulk solids, Density, Grain boundaries, High temperature
Proceedings Papers

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A001, July 16–18, 2013
Paper No: IPACK2013-73092
DOI: https://doi.org/10.1115/IPACK2013-73092
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Topics: Nanoparticles, Self-assembly, Columns (Structural), Evaporation, Particulate matter, Annealing, Bridges (Structures), Composite materials, Copper, Electronic packages
Proceedings Papers

Influences of Specimen Size and Annealing Temperature on Mechanical Reliability of FIB-Fabricated Si Nanowires for NEMS

Tatsuya Fujii, Koichi Sudoh, Shozo Inoue, Takahiro Namazu
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A006, July 16–18, 2013
Paper No: IPACK2013-73310
DOI: https://doi.org/10.1115/IPACK2013-73310
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Topics: Annealing, Nanoelectromechanical systems, Nanowires, Reliability, Temperature, Manufacturing, Silicon, Young's modulus, Damage, Focused ion beams
Proceedings Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 677-684, July 6–8, 2011
Paper No: IPACK2011-52048
DOI: https://doi.org/10.1115/IPACK2011-52048
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Topics: Copper, Electrical properties, Grain boundaries, Thin films, Fracture (Materials), Annealing, Reliability, Brittle fracture, Electron backscatter diffraction, Stress
Proceedings Papers

Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology

Han-Jung Wang, Hung-An Deng, Shih-Ying Chiang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 401-407, July 6–8, 2011
Paper No: IPACK2011-52201
DOI: https://doi.org/10.1115/IPACK2011-52201
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Topics: Microelectromechanical systems, Microphones, Modeling, Stress, Thin films, Finite element analysis, Aluminum, Deformation, Polysilicon, Residual stresses
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Paper No: InterPACK2009-89079
DOI: https://doi.org/10.1115/InterPACK2009-89079
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing
Proceedings Papers

Forming High Temperature Solder Interfaces by Low Temperature Fluxless Processing

Daoqiang Daniel Lu, Chuan Hu, Annie Tzu-Yu Huang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 729-734, July 8–12, 2007
Paper No: IPACK2007-33197
DOI: https://doi.org/10.1115/IPACK2007-33197
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Topics: High temperature, Low temperature, Solders, Bonding, Melting, Annealing, Differential scanning calorimetry, Electrons, Melting point, Temperature
Proceedings Papers

Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films

Koji Miyazaki, Jun-Ichiro Kurosaki, Masayuki Takashiri, Bertrand Lenoir, Hiroshi Tsukamoto
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 335-342, July 8–12, 2007
Paper No: IPACK2007-33756
DOI: https://doi.org/10.1115/IPACK2007-33756
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Topics: Microcoolers, Thin films, Shades and shadows, Temperature, Thermal conductivity, Annealing, Atmospheric pressure, Bulk solids, Chemical etching, Dry etching
Proceedings Papers

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

Kenichi Shimizu, Tasiyuki Torii
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1703-1708, July 17–22, 2005
Paper No: IPACK2005-73134
DOI: https://doi.org/10.1115/IPACK2005-73134
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Topics: Copper, Crystals, Fatigue cracks, Rotation, Crystal structure, Fatigue testing, Fracture (Materials), Electron backscatter diffraction, Annealing, Evaluation methods
Proceedings Papers

Effects of Interlayer Resin Bonding on Fatigue Crack Initiation/Propagation in Laminate Materials With a Surface Layer of Copper Film

Akira Matsuba, Tashiyuki Torii, DongHui Ma
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1719-1724, July 17–22, 2005
Paper No: IPACK2005-73168
DOI: https://doi.org/10.1115/IPACK2005-73168
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Topics: Annealing, Bonding, Copper, Crack propagation, Fatigue cracks, Laminates, Resins
Proceedings Papers

Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice

Hing Wah Lee, Parthiban Arunasalam, Ishak A. Azid, Kankanhally N. Seetharamu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 733-740, July 17–22, 2005
Paper No: IPACK2005-73280
DOI: https://doi.org/10.1115/IPACK2005-73280
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Topics: Chain, Flow (Dynamics), Optimization, Temperature control, Artificial neural networks, Finite element analysis, Microfluidics, Simulation results, Temperature distribution, Annealing