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Proceedings Papers

Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021
Paper No: IPACK2021-66842
https://doi.org/10.1115/IPACK2021-66842
View Paper titled, Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements
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Topics: Electrical conductance, Thermoreflectance, Transducers, Thermal resistance, Architecture, Computer simulation, Electronic packaging, Fittings, Flow (Dynamics), Geometry
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Paper No: IPACK2020-2613
https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 27–29, 2020
Paper No: IPACK2020-2526
https://doi.org/10.1115/IPACK2020-2526
View Paper titled, Enabling Packaging Architectures and Interconnect Technologies for Image Sensors
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Topics: Architecture, Bonding, Density, Packaging, Sensors
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Laura Spinella, Nick Bosco
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 7–9, 2019
Paper No: IPACK2019-6520
https://doi.org/10.1115/IPACK2019-6520
View Paper titled, Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging
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Topics: Electronic packaging, Fatigue, Packaging, Simulation, Solders, Thermomechanics, Reliability, Climate, Architecture, Electronics
Proceedings Papers

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A016, October 7–9, 2019
Paper No: IPACK2019-6443
https://doi.org/10.1115/IPACK2019-6443
View Paper titled, Comparative Study on Power Module Architectures for Modularity and Scalability
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Topics: Architecture, Electric vehicles, Silicon, Electronics, Hybrid electric vehicles, Carbon, Cooling, Design, Emissions, Energy gap
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Paper No: IPACK2018-8307
https://doi.org/10.1115/IPACK2018-8307
View Paper titled, Thermal Interface Materials Enhanced by Micro and Nanostructures
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Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures
Proceedings Papers

Multi-Physics Driven Co-Design of 3D Multicore Architectures

He Xiao, Wen Yueh, Saibal Mukhopadhyay, Sudhakar Yalamanchili
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A038, July 6–9, 2015
Paper No: IPACK2015-48533
https://doi.org/10.1115/IPACK2015-48533
View Paper titled, Multi-Physics Driven Co-Design of 3D Multicore Architectures
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Topics: Architecture, Design, Physics, Temperature, Delays, Energy efficiency, Circuits, Cycles, Energy consumption, Heat flux
Proceedings Papers

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A020, July 16–18, 2013
Paper No: IPACK2013-73263
https://doi.org/10.1115/IPACK2013-73263
View Paper titled, 3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler
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Topics: Microchannels, Cooling, Manufacturing, Thermohydrodynamics, Architecture, Computers, Density, Design, Electronic components, Engineering simulation
Proceedings Papers

Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future

Jie Wei
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 107-111, July 6–8, 2011
Paper No: IPACK2011-52045
https://doi.org/10.1115/IPACK2011-52045
View Paper titled, Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future
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Topics: Cooling, Water, Convection, Architecture, Cooling systems, Design, Energy consumption, Flow (Dynamics), Low temperature, Maintainability
Proceedings Papers

An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures

Michael K. Patterson, Rainer Weidmann, Markus Leberecht, Manuel Mair, Richard M. Libby
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 479-488, July 6–8, 2011
Paper No: IPACK2011-52090
https://doi.org/10.1115/IPACK2011-52090
View Paper titled, An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures
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Topics: Air flow, Architecture, Containment, Cooling systems, Data centers, Temperature, Energy consumption, Cooling, Fans, Hardware
Proceedings Papers

The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow

James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang, Collyn T. O’Kane
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 505-510, July 6–8, 2011
Paper No: IPACK2011-52127
https://doi.org/10.1115/IPACK2011-52127
View Paper titled, The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow
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Topics: Air flow, Data centers, Tiles, Cooling, Architecture, Computational fluid dynamics, Design, Flow (Dynamics), Leakage, Modeling
Proceedings Papers

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

Anjali Chauhan, Bahgat Sammakia, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 225-234, July 6–8, 2011
Paper No: IPACK2011-52137
https://doi.org/10.1115/IPACK2011-52137
View Paper titled, Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM
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Topics: Cooling, Microchannels, Heat sinks, Thermal management, Thermal resistance, Architecture, Cooling systems, Energy dissipation, Silicon
Proceedings Papers

Reliability Studies for Package-on-Package Components in Drop and Shock Environments

Pradeep Lall, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 591-602, July 6–8, 2011
Paper No: IPACK2011-52231
https://doi.org/10.1115/IPACK2011-52231
View Paper titled, Reliability Studies for Package-on-Package Components in Drop and Shock Environments
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Topics: Package on package, Reliability, Shock (Mechanics), Architecture, Electronics, Failure, Engineering simulation, Simulation, Warping, Design
Proceedings Papers

Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

Pradeep Lall, Dinesh Arunachalam, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 537-547, July 6–8, 2011
Paper No: IPACK2011-52195
https://doi.org/10.1115/IPACK2011-52195
View Paper titled, Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics
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Topics: Alloys, Architecture, Ball-Grid-Array packages, Copper, Cycles, Design, Electronics, Failure data, Lead-free solders, Model development
Proceedings Papers

PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics

Pradeep Lall, Aniket Shirgaokar, Dineshkumar Arunachalam, Jeff Suhling, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 159-170, July 19–23, 2009
Paper No: InterPACK2009-89329
https://doi.org/10.1115/InterPACK2009-89329
View Paper titled, PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics
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Topics: Electronics, Fatigue, Thermomechanics, Temperature, Ball-Grid-Array packages, Cycles, Reliability, Alloys, Architecture, Copper
Proceedings Papers

Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems

Evan G. Colgan, Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 799-806, July 19–23, 2009
Paper No: InterPACK2009-89177
https://doi.org/10.1115/InterPACK2009-89177
View Paper titled, Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems
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Topics: Water, Cooling, Design, Heat exchangers, Locations, Server racks, Temperature, Architecture, Computers, Data centers
Proceedings Papers

Optimal Fan Speed Control for Thermal Management of Servers

Zhikui Wang, Cullen Bash, Niraj Tolia, Manish Marwah, Xiaoyun Zhu, Parthasarathy Ranganathan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 709-719, July 19–23, 2009
Paper No: InterPACK2009-89074
https://doi.org/10.1115/InterPACK2009-89074
View Paper titled, Optimal Fan Speed Control for Thermal Management of Servers
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Topics: Air flow, Architecture, Control equipment, Cooling, Data centers, Energy consumption, Fans, Feedback, Temperature, Thermal management
Proceedings Papers

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 857-871, July 19–23, 2009
Paper No: InterPACK2009-89298
https://doi.org/10.1115/InterPACK2009-89298
View Paper titled, Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration
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Topics: Electronics, Shock (Mechanics), Vibration, Failure, Damage, Solders, Principal component analysis, Failure mechanisms, Fracture (Process), Alloys
Proceedings Papers

Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

Jordan Roberts, M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Ron Zhang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 977-988, July 19–23, 2009
Paper No: InterPACK2009-89383
https://doi.org/10.1115/InterPACK2009-89383
View Paper titled, Characterization of Die Stress Distributions in Area Array Flip Chip Packaging
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Topics: Flip-chip, Flip-chip devices, Packaging, Stress, Sensors, Ceramics, Adhesives, Cycles, Manufacturing, Silicon