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Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97382
https://doi.org/10.1115/IPACK2022-97382
View Paper titled, Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level
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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Matthew Ernst, Cholmin Choi, Abhijit Dasgupta
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73200
https://doi.org/10.1115/IPACK2013-73200
View Paper titled, Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading
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Topics: Time-domain analysis, Transients (Dynamics), Finite element analysis, Cycles, Dynamic analysis, Vibration, Cantilever beams, Circuits, Durability, Manufacturing
Proceedings Papers

Fracture and Fatigue Testing of Micro-Sized Materials for MEMS Applications

Kazuki Takashima, Timothy P. Halford, Yakichi Higo
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1679-1683, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73038
https://doi.org/10.1115/IPACK2005-73038
View Paper titled, Fracture and Fatigue Testing of Micro-Sized Materials for MEMS Applications
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Topics: Fatigue testing, Fracture (Materials), Microelectromechanical systems, Fatigue cracks, Alloys, Fatigue, Fatigue life, Fracture mechanics, Fracture toughness, Machinery