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Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
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Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
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Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
https://doi.org/10.1115/IPACK2023-112064
View Paper titled, Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit
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Topics: Adhesives, Aerosols, Circuits, Failure, Inks, Shear (Mechanics), Silver, Stress, Sustainability
Proceedings Papers

Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112063
https://doi.org/10.1115/IPACK2023-112063
View Paper titled, Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics
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Topics: Circuits, Electronics, Printing, Silver, Surface mount devices
Proceedings Papers

Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

Pradeep Lall, Shriram Kulkarni, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
https://doi.org/10.1115/IPACK2023-111980
View Paper titled, Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors
Open the PDF for Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors in another window
Topics: Capacitors, Inductors, Resistors, Printing, Circuits, Drops, Electronics, Inks, Particulate matter, Resolution (Optics)
Proceedings Papers

Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112060
https://doi.org/10.1115/IPACK2023-112060
View Paper titled, Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits
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Topics: Circuits, Electronic circuits, Electronics, Offset printing
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
https://doi.org/10.1115/IPACK2023-112069
View Paper titled, Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
Open the PDF for Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications in another window
Topics: Adhesives, Circuits, Electronics, Inks, Printing
Proceedings Papers

Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112058
https://doi.org/10.1115/IPACK2023-112058
View Paper titled, Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability
Open the PDF for Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability in another window
Topics: Aerosols, Batteries, Circuits, Electronics, Inks, Offset printing, Printing, Silver, Sustainability
Proceedings Papers

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
https://doi.org/10.1115/IPACK2023-111895
View Paper titled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels
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Topics: Accelerated life testing, Accelerometers, Additive manufacturing, Aluminum, Circuits, Computer numerical control machine tools, Cracking (Materials), Delamination, Domes (Structural elements), Durability
Proceedings Papers

Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111957
https://doi.org/10.1115/IPACK2023-111957
View Paper titled, Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink
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Topics: Additive manufacturing, Aerosols, Circuits, Inks, Nanoparticles, Silver, Surface mount components, Sustainability, Water
Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97450
https://doi.org/10.1115/IPACK2022-97450
View Paper titled, Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries
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Topics: Circuits, Electronics, Printing
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97428
https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6434
https://doi.org/10.1115/IPACK2019-6434
View Paper titled, Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger
Open the PDF for Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger in another window
Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation
Proceedings Papers

Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

Kirsten Lovelace, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6499
https://doi.org/10.1115/IPACK2019-6499
View Paper titled, Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling
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Topics: Circuits, Sapphire, Silicon nitride ceramics, Thermal expansion
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6347
https://doi.org/10.1115/IPACK2019-6347
View Paper titled, Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits