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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74119
https://doi.org/10.1115/IPACK2017-74119
View Paper titled, Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe
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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A045, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48257
https://doi.org/10.1115/IPACK2015-48257
View Paper titled, An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions
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Topics: Computer software, Construction, Cracking (Materials), Delamination, Design, Energy efficiency, Failure, Failure mechanisms, Fracture (Process), Junctions
Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48432
https://doi.org/10.1115/IPACK2015-48432
View Paper titled, Development of a Raised-Floor Plenum Design Tool
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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage
Proceedings Papers

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48364
https://doi.org/10.1115/IPACK2015-48364
View Paper titled, Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling
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Topics: Computer simulation, Data centers, Optimization, Stress, Thermal efficiency, Design, Containment, Computational fluid dynamics, Air conditioning, Flow (Dynamics)
Proceedings Papers

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48152
https://doi.org/10.1115/IPACK2015-48152
View Paper titled, Understanding the True Total Cost of Ownership of Water Cooling for Data Centers
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Topics: Cooling, Data centers, Water, Construction, Density, Doors, Energy dissipation, Heat, Heat exchangers, Innovation
Proceedings Papers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48169
https://doi.org/10.1115/IPACK2015-48169
View Paper titled, Consideration for Running Data Center at High Temperatures and Using Free Air Cooling
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Topics: Cooling, Data centers, High temperature, Corrosion, Internet, Temperature, Design, Operating temperature, Refrigeration, Carbon dioxide
Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48690
https://doi.org/10.1115/IPACK2015-48690
View Paper titled, Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
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Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89340
https://doi.org/10.1115/InterPACK2009-89340
View Paper titled, Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning
Proceedings Papers

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Takeshi Tsukamoto, Jyunji Takayoshi, Roger R. Schmidt, Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 915-921, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89258
https://doi.org/10.1115/InterPACK2009-89258
View Paper titled, Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers
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Topics: Cooling, Data centers, Heat exchangers, Refrigeration, Server racks, Refrigerants, Water, Compression, Construction, Coolants
Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89405
https://doi.org/10.1115/InterPACK2009-89405
View Paper titled, Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages
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Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis
Proceedings Papers

Benchmark Testing of LGA Sockets for Server Applications

Brian Beaman
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 459-467, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33067
https://doi.org/10.1115/IPACK2007-33067
View Paper titled, Benchmark Testing of LGA Sockets for Server Applications
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Topics: Testing, Engineering standards, Circuits, Construction, Hardware, Compression, Heat sinks, Reliability, Solders
Proceedings Papers

Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center

James W. VanGilder, Roger R. Schmidt
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 493-501, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73375
https://doi.org/10.1115/IPACK2005-73375
View Paper titled, Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center
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Topics: Air flow, Data centers, Tiles, Computational fluid dynamics, Leakage, Design, Building renovation, Construction, Cooling, Cooling systems
Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73196
https://doi.org/10.1115/IPACK2005-73196
View Paper titled, Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning
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Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics
Proceedings Papers

Capacity Control in Refrigerated Systems

Johnston W. Peeples
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 153-157, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35070
https://doi.org/10.1115/IPACK2003-35070
View Paper titled, Capacity Control in Refrigerated Systems
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Topics: Architecture, Compression, Computer cooling, Condensers (steam plant), Construction, Cooling, Design, Electronics, Energy dissipation, Flow (Dynamics)
Proceedings Papers

Dynamic Characterization of Thermal Interface Material for Electronic Cooling

Rocky Shih, Cullen E. Bash
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 159-166, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35073
https://doi.org/10.1115/IPACK2003-35073
View Paper titled, Dynamic Characterization of Thermal Interface Material for Electronic Cooling
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Topics: ASTM International, Computer cooling, Construction, Design, Heating, Instrumentation, Product development, Testing, Thermal resistance, Vehicles
Proceedings Papers

High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array

C. C. Wang, T. D. Kudrle, M. Bancu, J. Hsiao, C. H. Mastrangelo
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 245-249, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35203
https://doi.org/10.1115/IPACK2003-35203
View Paper titled, High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array
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Topics: Borosilicate glasses, Density, Semiconductor wafers, Bonding, Construction, Flip-chip, Machining, Metals, Particle spin, Rotation
Proceedings Papers

Qualification and Reliability Testing of a Microchip Laser System for Space Applications

M. W. Wright, D. Franzen, H. Hemmati, M. Sandor
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 879-883, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35298
https://doi.org/10.1115/IPACK2003-35298
View Paper titled, Qualification and Reliability Testing of a Microchip Laser System for Space Applications
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Topics: Accelerated life testing, Integrated circuits, Lasers, Testing, Temperature, Construction, Crystals, Fibers, Flow (Dynamics), Instrumentation