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Proceedings Papers

Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives

Joshua Kasitz, Muhammad Ghufran, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141296
https://doi.org/10.1115/IPACK2024-141296
View Paper titled, Enhanced Passive Cooling in Thermal Interface Materials via Encapsulated Phase Change Material Additives
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Topics: Cooling, Phase change materials
Proceedings Papers

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

Mohammad Reza Najjari, Cam Turner, Kamal Mostafavi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140918
https://doi.org/10.1115/IPACK2024-140918
View Paper titled, Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach
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Topics: Boiling, Cooling, Two-phase flow, Refrigerants, Design, Health and safety, Innovation, Liabilities, Pressure drop
Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment

Russell Tipton, Ashley Wise, Srdan Mutabdzija, Craig Shores, Devdatta Kulkarni
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141206
https://doi.org/10.1115/IPACK2024-141206
View Paper titled, Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment
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Topics: Cooling, Refrigerants
Proceedings Papers

Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139031
https://doi.org/10.1115/IPACK2024-139031
View Paper titled, Exploring the Impact of CRAH Unit Partial Failure in Hybrid-Cooled Data Centers
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Topics: Cooling, Data centers, Density, Failure, Heat
Proceedings Papers

Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology

Ali Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
https://doi.org/10.1115/IPACK2024-141342
View Paper titled, Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology
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Topics: Cooling, Data centers, Density, Heat, Refrigerants, Thermal management
Proceedings Papers

Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling

Yousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140277
https://doi.org/10.1115/IPACK2024-140277
View Paper titled, Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling
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Topics: Cooling, Data centers, Flow (Dynamics), Microchannels, Plates (structures)
Proceedings Papers

Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack

Ali Heydari, Deogratius Kisitu, Alfonso Ortega, Bahareh Eslami, Pardeep Shahi, Mohammad Tradat, James Costello, Benjamin Margaritondo
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140672
https://doi.org/10.1115/IPACK2024-140672
View Paper titled, Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack
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Topics: Cooling, Data centers, Density, Plates (structures)
Proceedings Papers

Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures

Myriam Bouzidi, Junyoung Kim, Jonathan Goldman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140132
https://doi.org/10.1115/IPACK2024-140132
View Paper titled, Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures
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Topics: Batteries, Electric vehicles, Flexible structures, Thermal management, Temperature, Heat, Cooling, Energy dissipation, Battery life, Coolants
Proceedings Papers

Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity

Bidzina Kekelia, J. Emily Cousineau, Rajneesh Chaudhary, Jeff Tomerlin, Sreekant Narumanchi, Vandana Rallabandi, Jon Wilkins, Shajjad Chowdhury, Himel Barua, Mostak Mohammad, Burak Ozpineci
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141631
https://doi.org/10.1115/IPACK2024-141631
View Paper titled, Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity
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Topics: Cavities, Cooling, Electric motors, Electronics, Engines, Motors, Rotors, Thermal management, Traction
Proceedings Papers

Parametric Thermal Design for Heterogeneously Integrated High-Power Packages

Yunhyeok Im, Junyoung Kim, Mingeun Choi, Myriam Bouzidi, Xingchen Li, Joon Woo Kim, Ahmet Mete Muslu, Satish Kumar, Madhavan Swaminathan, Suresh K. Sitaraman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141216
https://doi.org/10.1115/IPACK2024-141216
View Paper titled, Parametric Thermal Design for Heterogeneously Integrated High-Power Packages
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Topics: Cooling, Design, Silicon
Proceedings Papers

Capillary-Based Two-Phase Cooling for High Power Density Power Electronics

Yujui Lin, Heungdong Kwon, Yini He, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140766
https://doi.org/10.1115/IPACK2024-140766
View Paper titled, Capillary-Based Two-Phase Cooling for High Power Density Power Electronics
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Topics: Cooling, Electronics, Power density, Thermal management
Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
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Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

Numerical Study of Two-Phase Immersion Cooling Limits for Bare Die Packages With Novec 649

Tanya Liu, Sadegh Khalili, Jorge Padilla, Madhusudan Iyengar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141718
https://doi.org/10.1115/IPACK2024-141718
View Paper titled, Numerical Study of Two-Phase Immersion Cooling Limits for Bare Die Packages With Novec 649
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Topics: Cooling
Proceedings Papers

A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC

David Geb, Subodh Deodhar, Nitin Netake, Tejas Jeurkar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140403
https://doi.org/10.1115/IPACK2024-140403
View Paper titled, A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC
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Topics: Simulation, Thermal management, Cooling, Design, Algorithms, Control equipment, Temperature, Heat, Integrated circuits, Sensors
Proceedings Papers

Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam

Bolape Alade, Deogratius Kisitu, May Battleson, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140105
https://doi.org/10.1115/IPACK2024-140105
View Paper titled, Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam
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Topics: Copper, Forced convection, Water, Compression, Flow (Dynamics), Metal foams, Cooling, Heat, Computer cooling, Coolants
Proceedings Papers

Numerical Study of Single-Phase Immersion Cooling Limits for Bare Die Packages

Sadegh Khalili, Tanya Liu, Jorge Padilla, Madhusudan Iyengar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141750
https://doi.org/10.1115/IPACK2024-141750
View Paper titled, Numerical Study of Single-Phase Immersion Cooling Limits for Bare Die Packages
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Topics: Cooling, Forced convection
Proceedings Papers

Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System

Bharath Ram Ravi, Jiwon Yu, Stephen Keefe, Herman Chu, Chase Wealther
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
https://doi.org/10.1115/IPACK2024-139429
View Paper titled, Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System
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Topics: Cooling, Thermofluids, Heat, Internet of things, Artificial intelligence, Blockchain technology, Carbon footprint, Coolants, Cooling systems, Data centers
Proceedings Papers

Cooling Electronics by Direct Contact With Liquids

Amanie N. Abdelmessih, David F. Delgado, Ezry Lopez, Nathaniel P. Michael, Grant P. Napierala, Nicholas J. Ramos
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141334
https://doi.org/10.1115/IPACK2024-141334
View Paper titled, Cooling Electronics by Direct Contact With Liquids
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Topics: Computer cooling, Cooling, Electronics
Proceedings Papers

Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs

Akshith Narayanan, Qingyang Wang, Serdar Ozguc, Richard W. Bonner, III
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141261
https://doi.org/10.1115/IPACK2024-141261
View Paper titled, Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs
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Topics: Cooling, Graphics processing units, Vehicles