1-20 of 204
Copper
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites

Hansen Qiao, Katherine Jiang, Tiwei Wei, Yujui Lin, Chris Perez, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113126
https://doi.org/10.1115/IPACK2023-113126
View Paper titled, Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites
Open the PDF for Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites in another window
Topics: Composite materials, Copper, Nanowires, Plasma desorption mass spectrometry
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
Open the PDF for Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure in another window
Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
https://doi.org/10.1115/IPACK2023-113781
View Paper titled, Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
Open the PDF for Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments in another window
Topics: Copper, Critical heat flux, Data centers, Heat, Heat transfer, Microcoolers, Pool boiling, Refrigerants, Reliability
Proceedings Papers

Boiling Limit on Textured Oil-Impregnated Surfaces

Yimin Zhou, Solomon Adera
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111736
https://doi.org/10.1115/IPACK2023-111736
View Paper titled, Boiling Limit on Textured Oil-Impregnated Surfaces
Open the PDF for Boiling Limit on Textured Oil-Impregnated Surfaces in another window
Topics: Boiling, Bubbles, Critical heat flux, Pool boiling, Thermal management, Vapors, Heat, Copper, Delays, Failure
Proceedings Papers

Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows

Pradeep Lall, Aathi Raja Ram Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111925
https://doi.org/10.1115/IPACK2023-111925
View Paper titled, Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows
Open the PDF for Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows in another window
Topics: Copper, Fracture (Materials), Fracture (Process), Resins
Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
Open the PDF for Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates in another window
Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices

Alicia Medina Garcia, John Harris, David R. Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113792
https://doi.org/10.1115/IPACK2023-113792
View Paper titled, Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices
Open the PDF for Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices in another window
Topics: Copper, Nanowires, Reliability, Silver, Mechanical properties, High temperature, Resilience, Shear strength, Shear stress, Temperature
Proceedings Papers

Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling

Pradeep Lall, Madhu Kasturi
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111977
https://doi.org/10.1115/IPACK2023-111977
View Paper titled, Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling
Open the PDF for Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling in another window
Topics: Copper, Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Cagatay Ozdemir
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111534
https://doi.org/10.1115/IPACK2023-111534
View Paper titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics
Open the PDF for Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics in another window
Topics: Ceramics, Copper, Electronics, Plasma spraying, Spraying (Coating processes), Coatings, Sprays, Surface roughness, Electronic packaging, Additive manufacturing
Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97440
https://doi.org/10.1115/IPACK2022-97440
View Paper titled, Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Open the PDF for Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging in another window
Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Open the PDF for Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability in another window
Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Open the PDF for Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers in another window
Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

Deogratius Kisitu, Carol Caceres, Metodi Zlatinov, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97400
https://doi.org/10.1115/IPACK2022-97400
View Paper titled, Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling
Open the PDF for Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling in another window
Topics: Boiling, Computer cooling, Cooling, Copper, Flow (Dynamics), Heat flux, Metal foams
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Open the PDF for Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module in another window
Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

Shinya Kawakita, Yuki Ishizaka, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-70410
https://doi.org/10.1115/IPACK2021-70410
View Paper titled, Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam
Open the PDF for Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam in another window
Topics: Composite materials, Copper, Thermal conductivity
Proceedings Papers

Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics

Mei-Chien Lu
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73314
https://doi.org/10.1115/IPACK2021-73314
View Paper titled, Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics
Open the PDF for Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics in another window
Topics: Bonding, Copper, Density, Design, Overlays (Materials engineering)
Proceedings Papers

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Pradeep Lall, Kartik Goyal, Kyle Schulze, Curtis Hill
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74063
https://doi.org/10.1115/IPACK2021-74063
View Paper titled, Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate
Open the PDF for Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate in another window
Topics: Copper, Electronics, Inks, Sintering
Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73348
https://doi.org/10.1115/IPACK2021-73348
View Paper titled, Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints
Open the PDF for Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints in another window
Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing
Proceedings Papers

Contact Angle Tuning of Copper Microporous Structures

Farid Soroush, Tanya Liu, Qianying Wu, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73334
https://doi.org/10.1115/IPACK2021-73334
View Paper titled, Contact Angle Tuning of Copper Microporous Structures
Open the PDF for Contact Angle Tuning of Copper Microporous Structures in another window
Topics: Copper
Proceedings Papers

A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

Farid Soroush, Tanya Liu, Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73309
https://doi.org/10.1115/IPACK2021-73309
View Paper titled, A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling
Open the PDF for A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling in another window
Topics: Boiling, Copper, Liquid films