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Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Paper No: IPACK2021-74016
DOI: https://doi.org/10.1115/IPACK2021-74016
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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Paper No: IPACK2021-73015
DOI: https://doi.org/10.1115/IPACK2021-73015
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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021
Paper No: IPACK2021-73269
DOI: https://doi.org/10.1115/IPACK2021-73269
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Topics: Compression, Cooling, Data centers, Heat recovery, Vapors
Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Paper No: IPACK2021-68121
DOI: https://doi.org/10.1115/IPACK2021-68121
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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

Pardeep Shahi, Sarthak Agarwal, Satyam Saini, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 27–29, 2020
Paper No: IPACK2020-2592
DOI: https://doi.org/10.1115/IPACK2020-2592
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Topics: Computational fluid dynamics, Copper, Data centers, Nanoparticles
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
DOI: https://doi.org/10.1115/IPACK2020-2670
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Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density
Proceedings Papers

CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware

Satyam Saini, Kaustubh K. Adsul, Pardeep Shahi, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 27–29, 2020
Paper No: IPACK2020-2590
DOI: https://doi.org/10.1115/IPACK2020-2590
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Topics: Computational fluid dynamics, Contamination, Data centers, Hardware, Modeling, Particulate matter
Proceedings Papers

Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center

Uschas Chowdhury, Walter Hendrix, Thomas Craft, Willis James, Ankit Sutaria, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 7–9, 2019
Paper No: IPACK2019-6522
DOI: https://doi.org/10.1115/IPACK2019-6522
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Topics: Air conditioning, Containment, Coolers, Data centers, Design, Modeling
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Paper No: IPACK2019-6530
DOI: https://doi.org/10.1115/IPACK2019-6530
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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Dynamic Control of Airflow Balance in Data Centers

Stephen Paul Linder, Jim Van Gilder, Yan Zhang, Enda Barrett
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 7–9, 2019
Paper No: IPACK2019-6304
DOI: https://doi.org/10.1115/IPACK2019-6304
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Topics: Air flow, Containment, Data centers, Flow (Dynamics)
Proceedings Papers

Thermal Profiling of a Small Operational Data Center

İsmail Türkmen, Cem Ahmet Mercan, Hamza Salih Erden
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 7–9, 2019
Paper No: IPACK2019-6309
DOI: https://doi.org/10.1115/IPACK2019-6309
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Topics: Computational fluid dynamics, Data centers
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Paper No: IPACK2019-6585
DOI: https://doi.org/10.1115/IPACK2019-6585
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

Pravin A. Shinde, Pratik V. Bansode, Satyam Saini, Rajesh Kasukurthy, Tushar Chauhan, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 7–9, 2019
Paper No: IPACK2019-6590
DOI: https://doi.org/10.1115/IPACK2019-6590
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Topics: Cooling, Data centers, Experimental analysis, Optimization, Temperature
Proceedings Papers

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019
Paper No: IPACK2019-6444
DOI: https://doi.org/10.1115/IPACK2019-6444
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Topics: Cooling, Design, Design engineering, Thermal management, Water, Graphics processing units, Electronic components, Flow (Dynamics), Artificial intelligence, Data centers
Proceedings Papers

Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center

Jimil M. Shah, Roshan Anand, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Prabjit Singh, Mike Kaler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 7–9, 2019
Paper No: IPACK2019-6601
DOI: https://doi.org/10.1115/IPACK2019-6601
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Topics: Contamination, Data centers, Particulate matter
Proceedings Papers

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018
Paper No: IPACK2018-8432
DOI: https://doi.org/10.1115/IPACK2018-8432
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Topics: Temperature, Pumps, Cooling, Fluids, Failure, Operating temperature, Air pollution, Condensation, Corrosion, Data centers
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Paper No: IPACK2018-8436
DOI: https://doi.org/10.1115/IPACK2018-8436
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Paper No: IPACK2018-8305
DOI: https://doi.org/10.1115/IPACK2018-8305
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing
Proceedings Papers

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 27–30, 2018
Paper No: IPACK2018-8443
DOI: https://doi.org/10.1115/IPACK2018-8443
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Topics: Cooling, Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Heat