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Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111736
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6417
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 173-178, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52097