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Proceedings Papers

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

Mohammad Reza Najjari, Cam Turner, Kamal Mostafavi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140918
https://doi.org/10.1115/IPACK2024-140918
View Paper titled, Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach
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Topics: Boiling, Cooling, Two-phase flow, Refrigerants, Design, Health and safety, Innovation, Liabilities, Pressure drop
Proceedings Papers

Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node

Shrinath Shrinivas Ramdas, Tushar Chauhan, Mark Patterson, Dwayne R. Shirley, Lijuan Zhang, Roberto Coccioli
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141335
https://doi.org/10.1115/IPACK2024-141335
View Paper titled, Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node
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Topics: Columns (Structural), Copper, Delamination, Design, Finite element analysis, Fracture (Process), Optimization, Risk, Silicon
Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Parametric Thermal Design for Heterogeneously Integrated High-Power Packages

Yunhyeok Im, Junyoung Kim, Mingeun Choi, Myriam Bouzidi, Xingchen Li, Joon Woo Kim, Ahmet Mete Muslu, Satish Kumar, Madhavan Swaminathan, Suresh K. Sitaraman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141216
https://doi.org/10.1115/IPACK2024-141216
View Paper titled, Parametric Thermal Design for Heterogeneously Integrated High-Power Packages
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Topics: Cooling, Design, Silicon
Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
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Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC

David Geb, Subodh Deodhar, Nitin Netake, Tejas Jeurkar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140403
https://doi.org/10.1115/IPACK2024-140403
View Paper titled, A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC
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Topics: Simulation, Thermal management, Cooling, Design, Algorithms, Control equipment, Temperature, Heat, Integrated circuits, Sensors
Proceedings Papers

Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141356
https://doi.org/10.1115/IPACK2024-141356
View Paper titled, Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects
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Topics: Dimensions, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Fatigue life, Finite element analysis, Solders, Boundary-value problems, Design, Energy consumption
Proceedings Papers

Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms

Myunghoon Lee, Lindo Arimpoor Pallan Ouseph, Vamsi Krishna Yaddanapudi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141171
https://doi.org/10.1115/IPACK2024-141171
View Paper titled, Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms
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Topics: Computational fluid dynamics, Design, Evolutionary algorithms, Optimization, Workflow, Delays, Energy consumption, Intellectual property, Temperature, Thermal analysis
Proceedings Papers

Design of Power Transistor Embedded in PCB Supported by 3D Simulations

Aleš Chvála, Juraj Marek, Alexander Šatka, Jue Chen
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111389
https://doi.org/10.1115/IPACK2023-111389
View Paper titled, Design of Power Transistor Embedded in PCB Supported by 3D Simulations
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Topics: Design, Printed circuit boards, Simulation, Transistors
Proceedings Papers

Quick Turn Methodology for High Temperature Solder Fatigue Reliability

Matthew Norris, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113999
https://doi.org/10.1115/IPACK2023-113999
View Paper titled, Quick Turn Methodology for High Temperature Solder Fatigue Reliability
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Topics: Fatigue, High temperature, Lead-free solders, Reliability, Solders, Cycles, Failure, Geometry, Temperature, Thermal shock
Proceedings Papers

Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection

Joseph Herring, Gautam Gupta, Jacob Lamotte-Dawaghreh, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112019
https://doi.org/10.1115/IPACK2023-112019
View Paper titled, Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection
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Topics: Computational fluid dynamics, Cooling, Data centers, Design, Heat sinks, Natural convection, Optimization
Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
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Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments

Gautier Rouaze, Enzo M. Minazzo, Jackson B. Marcinichen, John R. Thome, Fred Buining
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111837
https://doi.org/10.1115/IPACK2023-111837
View Paper titled, Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments
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Topics: Cooling systems, Design, Refrigerants
Proceedings Papers

Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver

Aishworya Roy, Christina DiMarino, Jesi Miranda-Santos
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111921
https://doi.org/10.1115/IPACK2023-111921
View Paper titled, Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver
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Topics: Design, Gates (Closures), Manufacturing, Cooling, Bridges (Structures), Electric vehicles, Energy dissipation, Heat, Junctions, MOSFET transistors
Proceedings Papers

Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application

Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111804
https://doi.org/10.1115/IPACK2023-111804
View Paper titled, Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application
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Topics: Additive manufacturing, Cooling, Design, Heat sinks, Natural convection
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
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Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97886
https://doi.org/10.1115/IPACK2022-97886
View Paper titled, A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)
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Topics: Design, Heat sinks, Optimization
Proceedings Papers

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Utsav Gupta, Andras Vass-Varnai
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97669
https://doi.org/10.1115/IPACK2022-97669
View Paper titled, Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model
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Topics: Control systems, Design, Electric vehicles, Power converters, Automobiles, Batteries, Electronic components, Energy management, Modeling, Motors